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Breitwisch, US

Mathew J. Breitwisch, Yorktown Heights, NY US

Patent application numberDescriptionPublished
20100078621METHOD TO REDUCE RESET CURRENT OF PCM USING STRESS LINER LAYERS - A memory cell structure and method for forming the same. The method includes forming a via within a dielectric layer. The via is formed over the center of an electrically conducting bottom electrode. The method includes depositing a stress liner along at least one sidewall of the via. The stress liner imparting stress on material proximate the stress liner. In one embodiment, the stress liner provides a stress in the range of 500 to 5000 MPa on the material enclosed within its volume. The method includes depositing phase change material within the via and the volume enclosed by the stress liner. The method also includes forming an electrically conducting top electrode above the phase change material.04-01-2010

Matthew Breitwisch, Yorktown Heights, NY US

Patent application numberDescriptionPublished
20090001341Phase Change Memory with Tapered Heater - An embodiment of the present invention includes a method of forming a nonvolatile phase change memory (PCM) cell. This method includes forming at least one bottom electrode; forming at least one phase change material layer on at least a portion of an upper surface of the bottom electrode; forming at least one heater layer on at least a portion of an upper surface of the phase change material layer; and shaping the heater layer into a tapered shape, such that an upper surface of the heater layer has a cross-sectional width that is longer than a cross-sectional width of a bottom surface of the heater layer contacting the phase change material layer.01-01-2009
20090196094INTEGRATED CIRCUIT INCLUDING ELECTRODE HAVING RECESSED PORTION - An integrated circuit includes a first electrode including an etched recessed portion. The integrated circuit includes a second electrode and a resistivity changing material filling the recessed portion and coupled to the second electrode.08-06-2009
20090289242Phase Change Memory With Tapered Heater - An embodiment of the present invention includes a method of forming a nonvolatile phase change memory (PCM) cell. This method includes forming at least one bottom electrode; forming at least one phase change material layer on at least a portion of an upper surface of the bottom electrode; forming at least one heater layer on at least a portion of an upper surface of the phase change material layer; and shaping the heater layer into a tapered shape, such that an upper surface of the heater layer has a cross-sectional width that is longer than a cross-sectional width of a bottom surface of the heater layer contacting the phase change material layer.11-26-2009

Matthew J. Breitwisch, Essex Junction, VT US

Patent application numberDescriptionPublished
20080286905Fin-Type Antifuse - A method of forming an antifuse forms a material layer and then patterns the material layer into a fin. The center portion of the fin is converted into a substantially non-conductive region and the end portions of the fin into conductors. The process of converting the center portion of the fin into an insulator allows a process of heating the fin above a predetermined temperature to convert the insulator into a conductor. Thus, the fin-type structure that can be selectively converted from an insulator into a permanent conductor using a heating process.11-20-2008
20110001111THERMALLY INSULATED PHASE CHANGE MATERIAL CELLS - A memory cell structure and method for forming the same. The method includes forming a pore within a dielectric layer. The pore is formed over the center of an electrically conducting bottom electrode. The method includes depositing a thermally insulating layer along at least one sidewall of the pore. The thermally insulating layer isolates heat from phase change current to the volume of the pore. In one embodiment phase change material is deposited within the pore and the volume of the thermally insulating layer. In another embodiment a pore electrode is formed within the pore and the volume of the thermally insulating layer, with the phase change material being deposited above the pore electrode. The method also includes forming an electrically conducting top electrode above the phase change material.01-06-2011
20110134676RESISTIVE MEMORY DEVICES HAVING A NOT-AND (NAND) STRUCTURE - Resistive memories having a not-and (NAND) structure including a resistive memory cell. The resistive memory cell includes a resistive memory element for storing a resistance value and a memory element access device for controlling access to the resistive memory element. The memory element access device is connected in parallel to the resistive memory element.06-09-2011

Patent applications by Matthew J. Breitwisch, Essex Junction, VT US

Matthew J. Breitwisch, Westchester, NY US

Patent application numberDescriptionPublished
20090073785MULTI-LEVEL MEMORY CELL UTILIZING MEASUREMENT TIME DELAY AS THE CHARACTERISTIC PARAMETER FOR LEVEL DEFINITION - A method for operating a memory cell. Memory cells represent binary values by storing a characteristic parameter. The method of memory cell operation entails receiving a binary value to be stored by a memory cell. A determining operation determines a target discharge time corresponding to the binary value. The target discharge time being the time needed to discharge a pre-charged circuit through the said memory cell to a predetermined level. A storing operation stores a characteristic parameter in the memory cell such that an electron discharge time through an electronic circuit formed, at least partially, by the memory cell, is substantially equal to the target discharge time.03-19-2009

Matthew J. Breitwisch, Pound Ridge, NY US

Patent application numberDescriptionPublished
20110228600MEMORY PROGRAMMING - Systems, methods, and devices for iteratively writing contents to memory locations are provided. A statistical model is used to determine a sequence of pulses to write desired contents to a memory location. The contents can be expressed as a resistance value in a range to store one or more bits in a memory cell. For phase change memory, an adaptive reset pulse and one or more annealing pulses are selected based on a desired resistance range. Reading the resistance value of the memory cell can provide feedback to determine adjustments in an overall pulse application strategy. The statistical model and a look up table can be used to select and modify pulses. Adaptively updating the statistical model and look up table may reduce the number of looping iterations to shift the resistance value of the memory cell into the desired resistance range.09-22-2011

Matthew Joseph Breitwisch, Essex Junction, VT US

Patent application numberDescriptionPublished
20100299297SYSTEM FOR ELECTRONIC LEARNING SYNAPSE WITH SPIKE-TIMING DEPENDENT PLASTICITY USING PHASE CHANGE MEMORY - A system, method and computer program product for producing spike-dependent plasticity in an artificial synapse is disclosed. According to one embodiment, a method for producing spike-dependent plasticity in an artificial neuron comprises generating a pre-synaptic spiking event in a first neuron when a total integrated input to the first neuron exceeds a first predetermined threshold. A post-synaptic spiking event is generated in a second neuron when a total integrated input to the second neuron exceeds a second predetermined threshold. After the pre-synaptic spiking event, a first pulse is applied to a pre-synaptic node of a synapse having a phase change memory element. After the post-synaptic spiking event, a second varying pulse is applied to a post-synaptic node of the synapse, wherein current through the synapse is a function of the state of the second varying pulse at the time of the first pulse.11-25-2010