Inventors list |
Assignees list |
Classification tree browser |
Top 100 Inventors |
Top 100 Assignees |
Branstetter
Bryan Branstetter, Oceanside, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20120083474 | HETEROCYCLIC AMIDES AS MODULATORS OF TRPA1 - Certain heterocyclic amide compounds are described. The compounds may be used in pharmaceutical compositions and methods for treating disease states, disorders, and conditions mediated by TRPA1 activity, such as pain, arthritis, itch, cough, asthma, or inflammatory bowel disease. | 04-05-2012 |
Bryan James Branstetter, Oceanside, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20110092481 | QUINOLINE OR ISOQUINOLINE SUBSTITUTED P2X7 ANTAGONISTS - The present invention is related to novel compounds of formula (I) having P2X7 antagonistic properties, pharmaceutical compositions comprising these compounds, chemical processes for preparing these compounds and their use in the treatment or prophylaxis of diseases associated with P2X7 receptor activity in animals, in particular humans. (I) | 04-21-2011 |
Bryan James Branstetter, Carlsbad, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20090156599 | Imidazolo-, oxazolo-, and thiazolopyrimidine modulators of TRPV1 - Certain TRPV1-modulating imidazolo-, oxazolo-, and thiazolopyrimdine compounds are described. The compounds may be used in pharmaceutical compositions and methods for treating disease states, disorders, and conditions mediated by TRPV1 activity, such as pain, arthritis, itch, cough, asthma, or inflammatory bowel disease. | 06-18-2009 |
Reagan Branstetter, Tucson, AZ US
| Patent application number | Description | Published |
|---|---|---|
| 20080310102 | METHODS AND APPARATUS FOR COMPACT ACTIVE COOLING - Methods and apparatus for compact active cooling for missile applications generally comprise a circuit card assembly level closed loop fluid filled cooling system for cooling high power components such as microprocessors. The present invention utilizes a cooling system constrained to a single circuit card assembly providing for a drop in replacement for current passively cooled circuit card assemblies. | 12-18-2008 |