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Brain, US
Christopher Thomas Brain, Cambridge, MA US
| Patent application number | Description | Published |
|---|---|---|
| 20080312316 | Chromone Derivatives Useful as Antagonists of Vr1 Receptors - The invention relates to novel heterocyclic compounds of the formula | 12-18-2008 |
| 20090082365 | Trisubstituted Quinazolinone Derivatives as Vanilloid Antagonists - The present invention relates to quinazolinone compounds of the formula | 03-26-2009 |
| 20090318441 | Pyrrolopyrimidine Compounds and Their Uses - The present application describes organic compounds that are useful for the treatment, prevention and/or amelioration of diseases, particularly pyrrolopyrimidine compounds and derivatives are described which inhibit protein kinases. The organic compounds are useful in treating proliferative disease. | 12-24-2009 |
| 20100105653 | PYRROLOPYRIMIDINE COMPOUNDS AND THEIR USES - The disclosed compounds relate to treatments and therapies for protein kinase-associated disorders. There is also a need for compounds useful in the treatment or prevention or amelioration of one or more symptoms of cancer, transplant rejections, and autoimmune diseases. Furthermore, there is a need for methods for modulating the activity of protein kinases, such as CDK1, CDK2, CDK4, CDK5, CDK6, CDK7, CDK8 and CDK9, using the compounds provided herein. | 04-29-2010 |
| 20100280033 | Pyrazole Derivatives - The present application describes organic compounds that are useful for the treatment, prevention and/or amelioration of diseases, particularly pyrazole compounds and derivatives are described which inhibit protein kinases. The organic compounds are useful in treating proliferative disease. | 11-04-2010 |
| 20110152244 | PYRROLOPYRIMIDINE COMPOUNDS AND THEIR USES - The disclosed compounds relate to treatments and therapies for protein kinase-associated disorders. There is also a need for compounds useful in the treatment or prevention or amelioration of one or more symptoms of cancer, transplant rejections, and autoimmune diseases. Furthermore, there is a need for methods for modulating the activity of protein kinases, such as CDK1, CDK2, CDK4, CDK5, CDK6, CDK7, CDK8 and CDK9, using the compounds provided herein. | 06-23-2011 |
Joseph Brain, Locust, NJ US
| Patent application number | Description | Published |
|---|---|---|
| 20090048365 | Odor-Absorbing Capsule Particle Composition and Methods Therein - An odor-absorbing capsule particle composition and methods of eliminating malodor from hard and soft surfaces and the surrounding vapor phase is provided. | 02-19-2009 |
Michael D. Brain, Monte Sereno, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20090038917 | Transport system including vertical rollers - A transport system for conveying articles along conveyance paths including straight, curvilinear, horizontal, inclined and declined conveyance sections. The articles are conveyed between a pair of vertical belts while being supported by protrusions extending from the vertical belts. The vertical belts are guided using a multiplicity of vertical rollers that are configurable into straight, curvilinear and dynamically changing conveyance sections. Multiple conveyance sections can be joined end to end to transport articles over complex paths and over long distances. The articles conveyed may include semiconductor wafers. | 02-12-2009 |
| 20090114507 | Integrated overhead transport system with stationary drive - A transport system is provided to move an article from a conveyance section to a location. The conveyance section transports the article using a pair of transport belts. A lift lowers the article downward between the pair of transport belts. A hoist translates the article beneath the conveyance section to the location while supporting the article from above. The article may include a FOUP, semiconductor wafer, substrate for the manufacture of display devices or photovoltaics. The hoist may comprise a carriage and a gripper configured to grasp and vertically move the article while suspended beneath the carriage. | 05-07-2009 |
Michael D. Brain, Los Gatos, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20090000908 | Systems and methods for buffering articles in transport - A system for buffering articles in transport is provided. The system comprises a buffer module configured to buffer articles and a computing system. The buffer module includes a first conveyor configured to transport the articles and a transference node configured to transfer the articles between the first conveyor and an external location. The computing system is configured to maintain an inventory list including a present location of each of the articles buffered by the buffer module. The computing system is further configured to control operation of the buffer module to transfer a selected article among the buffered articles to the external location. | 01-01-2009 |
Ruth Brain, Portland, OR US
| Patent application number | Description | Published |
|---|---|---|
| 20090309227 | FABRICATION OF INTERCONNECTS IN LOW-K INTERLAYER DIELECTRICS - A method for forming deep lithographic interconnects between a first metal and a second metal is provided. The method comprises depositing a first insulator layer on a semiconductor substrate; etching the first insulator layer at a selected location to provide at least a first via to the semiconductor substrate; depositing the first metal on the semiconductor substrate to form at least a first metal contact plug in the first via in contact with the semiconductor substrate; treating the semiconductor substrate with an in-situ plasma of a nitrogen containing gas wherein the plasma forms a nitride layer of the first metal at least capping a top surface of the first metal plug in the first via; and forming a second metal contact to the metal nitride layer capping at least the top surface of the first metal plug. | 12-17-2009 |
| 20100025858 | WINGED VIAS TO INCREASE OVERLAY MARGIN - Winged via structures to increase overlay margin are generally described. In one example, a method comprises depositing a sacrificial layer to an interlayer dielectric, the interlayer dielectric being coupled with a semiconductor substrate, forming at least one trench structure in the sacrificial layer wherein the trench structure comprises a first direction along a length of the trench structure and a second direction along a width of the trench structure wherein the second direction is substantially perpendicular to the first direction, depositing a light sensitive material to the trench structure and the sacrificial layer, and patterning at least one winged via structure in the light sensitive material to overlay the trench structure wherein the winged via structure extends in the second direction beyond the width of the trench structure onto the sacrificial layer. | 02-04-2010 |
| 20110003471 | Fabrication of interconnects in a low-k interlayer dielectrics - A method for forming deep lithographic interconnects between a first metal and a second metal is provided. The method comprises depositing a first insulator layer on a semiconductor substrate; etching the first insulator layer at a selected location to provide at least a first via to the semiconductor substrate; depositing the first metal on the semiconductor substrate to form at least a first metal contact plug in the first via in contact with the semiconductor substrate; treating the semiconductor substrate with an in-situ plasma of a nitrogen containing gas wherein the plasma forms a nitride layer of the first metal at least capping a top surface of the first metal plug in the first via; and forming a second metal contact to the metal nitride layer capping at least the top surface of the first metal plug. | 01-06-2011 |