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Brad C. Tischendorf, Minneapolis US

Brad C. Tischendorf, Minneapolis, MN US

Patent application numberDescriptionPublished
20090229858INSULATOR FOR FEEDTHROUGH - A hermetically sealed microelectromechanical system (MEMS) package for an implantable medical device is presented. The MEMS comprises a first substrate that includes an aperture. A feedthrough assembly is coupled to the aperture; the feedthrough assembly comprises a conductive element housed in a glass insulating member. A second substrate is coupled to the first substrate.09-17-2009
20090321107FEEDTHROUGH ASSEMBLY AND ASSOCIATED METHOD - A feedthrough assembly includes a ferrule, an insulating structure, at least one terminal pin and a glass seal that fixedly secures the insulating structure within the ferrule. The insulating structure has a top portion, a bottom portion, and an inner diameter portion. The inner diameter portion defines at least one aperture extending from the top portion to the bottom portion of the insulating structure. The at least one terminal pin extends through the at least one aperture. The glass seal comprises about 30% B12-31-2009
20100230392OPTICAL FEEDTHROUGH FOR MEDICAL DEVICES - In general, the disclosure is directed toward transmitting radiant energy across a boundary of a medical device via an optical feedthrough. A system for transmitting radiant energy across a boundary of a medical device includes a first functional module of a medical device, a second functional module of the medical device, an optical feedthrough assembly coupled to the first functional module, and a radiant energy source that emits a beam through the optical feedthrough assembly to perform a manufacturing process on the first functional module and the second functional module.09-16-2010
20100234825RELEASING A MATERIAL WITHIN A MEDICAL DEVICE VIA AN OPTICAL FEEDTHROUGH - In general, the disclosure is directed toward releasing material within a medical device via an optical feedthrough. A system for releasing material with a medical device comprises a cup that holds a material, wherein the cup includes a discharge port, a seal disc that seals the material within the cup, an optical feedthrough assembly coupled to the cup, a shell that defines a chamber within a medical device, wherein the optical feedthrough assembly is coupled to the shell, and a radiant energy source that shines a beam through the optical feedthrough assembly to puncture the seal disc to allow the material to enter the chamber via the discharge port.09-16-2010
20110048770INJECTION MOLDED FERRULE FOR COFIRED FEEDTHROUGHS - Feedthrough assemblies and methods of manufacturing feedthrough assemblies are provided. Methods include molding a ferrule comprising titanium using metal injection molding and positioning the ferrule about at least a portion of an insulator, the insulator comprising alumina. Methods also include overmolding a ferrule about at least a portion of an insulator using metal injection molding, the ferrule comprising titanium and the insulator comprising alumina. Sintering densifies the ferrule and provides a hermetic seal between the ferrule and insulator. The insulator may be fired or unfired prior to sintering of the ferrule.03-03-2011
20110184479LEAD CONNECTOR WITH GLASS INSULATORS - A medical device lead connector includes two or more electrically conducting contact rings spaced apart by electrically insulating glass material. The electrically insulating glass material fixes the two or more electrically conducting contact rings in axial alignment.07-28-2011
20110184480LEAD CONNECTOR WITH GLASS BRAZE - A medical device lead connector includes two or more electrically conducting contact rings spaced apart by electrically insulating ceramic ring. An electrically insulating glass material fixes the two or more electrically conducting contact rings to the insulating ceramic ring in axial alignment.07-28-2011
20110270330DIFFUSION BONDED LEAD CONNECTOR - A medical device lead connector includes electrically conducting contact rings spaced apart by an electrically insulating ring and in axial alignment. The electrically conducting contact ring and the insulating ring having an interface bond on an atomic level.11-03-2011

Patent applications by Brad C. Tischendorf, Minneapolis, MN US