Boysel
Darl G. Boysel, Delmont, PA US
Patent application number | Description | Published |
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20090321440 | DOUBLE-WALLED CONTAINER AND METHOD OF MANUFACTURE - A double-walled container and method of manufacturing are disclosed. A first container having a smaller diameter than a second container is inserted into the second container. A portion of the first container is expanded and/or a portion of the second container may be narrowed so that first and second container is interlocked and form a double-walled container. The first and/or second containers may have ribs. An air gap between the first and second containers provides thermal insulation to contents of the double-walled container. | 12-31-2009 |
20130301273 | HEAT SINK FOR AN ELECTRONIC COMPONENT - A device for thermal management of an electronic component includes an inner shell dimensioned to house an electrical circuit and a thermally conductive metal outer shell. The metal outer shell has a thickness less than 6.3246 mm; a first closed end having a first diameter and dimensioned to support an electronic component operably connected to the electrical circuit; and a second end having a second diameter, wherein the first diameter is greater than the second diameter. The inner shell is at least partially within the outer shell. The outer shell is comprised of a single metal sheet. The thinnest portion of the outer metal shell is less than or equal to 0.75 times the thickest portion of the outer metal shell. | 11-14-2013 |
20140174144 | KNOCKOUT FOR USE WHILE NECKING A METAL CONTAINER, DIE SYSTEM FOR NECKING A METAL CONTAINER AND METHOD OF NECKING A METAL CONTAINER - A knockout has a support surface and the support surface has: (i) a first knockout outer diameter capable of supporting the first inner diameter of a container side wall when the knockout is inserted into an opening of the metal container and when the metal container is being necked with a necking die; and (ii) a second knockout outer diameter capable of supporting the second inner diameter of the container side wall when the knockout is inserted into the opening of the metal container and when the metal container is being necked with the necking die, and wherein the first knockout outer diameter is larger than the second knockout outer diameter. | 06-26-2014 |
20140230974 | HEAT TREATABLE ALUMINUM ALLOYS HAVING MAGNESIUM AND ZINC AND METHODS FOR PRODUCING THE SAME - New magnesium-zinc aluminum alloy bodies and methods of producing the same are disclosed. The new magnesium-zinc aluminum alloy bodies generally include 3.0-6.0 wt. % magnesium and 2.5-5.0 wt. % zinc, where at least one of the magnesium and the zinc is the predominate alloying element of the aluminum alloy bodies other than aluminum, and wherein (wt. % Mg)/(wt. % Zn) is from 0.6 to 2.40, and may be produced by preparing the aluminum alloy body for post-solutionizing cold work, cold working by at least 25%, and then thermally treating. The new magnesium-zinc aluminum alloy bodies may realize improved strength and other properties. | 08-21-2014 |
R. Mark Boysel, Honeoye Falls, NY US
Patent application number | Description | Published |
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20080204744 | High Speed, Optically-Multiplexed, Hyperspectral Imagers and Methods Thereof - High speed, optically-multiplexed, hyperspectral imagers and methods for producing multiple, spectrally-filtered image information of a scene. In a preferred embodiment, an array of imaging lenslets project multiple images of a scene along parallel optical paths which are then collimated, filtered into distinct wavelengths, and focused onto an array of image sensors. A digital image formatter converts output data from the image sensors into hyperspectral image information of the scene. | 08-28-2008 |
Robert M. Boysel, Honeoye Falls, NY US
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20100118176 | MICRO-ELECTROMECHANICAL MICROSHUTTER ARRAY - A microshutter array has a frame having a light transmissive portion. Linear microshutter elements extend across the light transmissive portion and in parallel to each other. Each microshutter element has a flat blade extended in a length direction and first and second torsion arms extending outwards from each side of the blade in the length direction, the blade extending across the light transmissive portion. There is at least one electrode associated with each linear microshutter element and extended in the length direction parallel to the microshutter element. | 05-13-2010 |
Robert Mark Boysel, Honeoye Falls, NY US
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20110210554 | High-Efficiency MEMS Micro-Vibrational Energy Harvester And Process For Manufacturing Same - The present invention relates generally to a High Efficiency MEMS Micro-Vibrational Energy Harvester (μVEH) having a thick beam bimorph architecture. The disclosed architecture is capable of producing a voltage of sufficient magnitude such that the requirement to connect a plurality of harvesters in series to produce an adequate voltage magnitude is eliminated. | 09-01-2011 |
Robert Mark Boysel, Montreal CA
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20150191345 | MEMS DEVICE AND METHOD OF MANUFACTURING - A MEMS device is provided. The device includes a MEMS wafer, a top cap wafer and a bottom cap wafer. The top and bottom cap wafers are respectively bonded to first and second sides of the MEMS wafer, the MEMS and cap wafers being electrically conductive. The outer side of the top cap wafer is provided with electrical contacts. The MEMS wafer, the top cap wafer and the bottom cap wafer define a cavity for housing a MEMS structure. The device includes insulated conducting pathways extending from within the bottom cap wafer, through the MEMS wafer and through the top cap wafer. The pathways are connected to the respective electrical contacts on the top cap wafer, for routing electrical signals from the bottom cap wafer to the electrical contacts on the top cap wafer. A method of manufacturing the MEMS device is also provided. | 07-09-2015 |