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| 20080212965 | METHOD AND APPARATUS FOR DYNAMICALLY ALLOCATING UPSTREAM BANDWIDTH IN PASSIVE OPTICAL NETWORKS - One embodiment of the present invention provides a system that facilitates dynamic allocation of upstream bandwidth in a passive optical network which includes a central node and at least one remote node. Each remote node is coupled to at least one logical entity, which corresponds to a device or a user, that transmits upstream data to the central node and receives downstream data from the central node. The central node is coupled to an external network outside of the passive optical network through a shared out-going uplink. | 09-04-2008 |
| 20110058813 | Ethernet Passive Optical Network Over Coaxial (EPOC) - Embodiments of the present invention exploit the existing capabilities of the Ethernet Passive Optical Network (EPON) MAC layer, designed for fiber optics communications, to provide a low cost MAC layer with upper layer connectivity over a hybrid fiber coaxial (HFC) network. In particular, embodiments allow for the EPON MAC to be used end-to-end (i.e., from an optical line terminal (OLT) to a coaxial network unit (CNU)) in a HFC network, thereby fully leveraging the packet processing capabilities, QoS functions, and management features of the EPON MAC. Furthermore, embodiments enable unified provisioning and management for both fiber and coaxial network units in a HFC network. | 03-10-2011 |
| 20110123194 | METHOD AND APPARATUS FOR DYNAMICALLY ALLOCATING UPSTREAM BANDWIDTH IN PASSIVE OPTICAL NETWORKS - One embodiment of the present invention provides a system that facilitates dynamic allocation of upstream bandwidth in a passive optical network which includes a central node and at least one remote node. Each remote node is coupled to at least one logical entity, which corresponds to a device or a user, that transmits upstream data to the central node and receives downstream data from the central node. The central node is coupled to an external network outside of the passive optical network through a shared out-going uplink. | 05-26-2011 |
| 20110262132 | Daisy Chainable ONU - Embodiments of a scalable optical network unit (ONU) architecture for multi-dwelling units (MDUs) that has a low initial cost (or first port cost) and a low maintenance cost are provided herein. The ONU architecture is scalable in that a growing number of end users can share a single drop fiber that couples the ONU to a passive optical network. The ONU architecture utilizes a multiplexer module to allow the ONU to be daisy chained with one or more additional ONUs. | 10-27-2011 |
| 20120045209 | Cost-Effective Multi-Rate Upstream for 10GEPON Based on High Efficiency Coding - Systems and methods are disclosed to provide an upstream rate between 1 Gbps and 10 Gbps in a cost effective manner in a 10GEPON. In an embodiment, an optical network unit (ONU) transmitter includes a burst transceiver and a physical layer (PHY) including a high performance digital to analog converter (DAC), a pulse amplitude modulation (PAM) module configured to encode end user data using a modulation scheme having more than two levels, and a laser. The ONU transmitter transmits the encoded end user data to an optical line terminal (OLT) receiver, which demodulates the data using a PAM demodulator and sends it to a service provider. | 02-23-2012 |
| 20120076495 | Method and Apparatus for Supporting Differentiated Performance for Multiple Categories of Packets in a Passive Optical Network - Embodiments of an apparatus including a user network interface configured to receive from a network a packet to be transmitted upstream over a PON are provided herein. The packet is marked with a first category type or a second category type. The apparatus further includes an upstream first in, first out (FIFO) queue configured to store the packet if the packet is marked with the first category type or the second category type. | 03-29-2012 |
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| 20100098906 | PREPREGS WITH IMPROVED PROCESSING - Systems and methods for the fabrication of prepregs possessing enhanced ability for the removal of gases from within prepregs and prepreg layups prior to and/or during at least a portion of consolidation and cure process to form composite structures are disclosed. In certain embodiments, perforations of selected configurations may be introduced into the prepregs prior to, during, and after layup. The perforations provide routes for gases trapped within and between the perforated prepregs and prepreg lay-ups to escape during consolidation and cure process, reducing the residual porosity within the resulting composite. For example, composites having residual porosities less than 10 vol. %, on the basis of the volume of the composite, may be achieved in this manner. | 04-22-2010 |
| 20100098927 | PROCESSING OF POLYMER MATRIX COMPOSITES - Systems and methods for the reduction of volatile component content from shaped prepregs and prepreg layups and the layups and composites formed therefrom are disclosed. One or more shaped prepregs or prepreg layups are placed within an enclosure and a flow of a non-condensing gas is introduced adjacent at least one surface of the shaped prepregs or prepreg layups, accelerating the rate and/or the completeness of removal of volatile components from the shaped prepregs or prepreg layups. The shaped prepregs or prepreg layups may be further subjected to heat, vacuum, and external pressure to facilitate removal of the volatile components. Shaped prepregs and prepreg layups with volatiles reduced in this manner may be further consolidated with heat, external pressure and/or vacuum. Beneficially, reduced matrix bleed and reduced fiber movement may be achieved during processing, reducing manufacturing time and improving part quality. | 04-22-2010 |
| 20100222461 | EPOXY COMPOSITIONS WITH IMPROVED MECHANICAL PERFORMANCE - Polymer compositions capable of a high degree of curing at relatively low temperatures, and prepregs, adhesives, films and composites formed therefrom are discussed. The polymer compositions include epoxy resin systems and a dual curing system including one or more curing agents containing one or more hydrazine-based curing agents having hydrazine functional groups and one or more amine-based curing agents containing one or more amine functional groups. The hydrazine-amine curing systems enable the polymer composition to achieve elevated levels of gelation or degree of cure at lower temperatures than are achievable with amine functional curing agents alone. Furthermore, this elevated degree of curing of the polymer composition may be achieved with substantially no reduction in tack life and/or out life of the prepreg, adhesive or film or cured state mechanical properties of composites, adhesives or other products fabricated therefrom, such as open hole compression strength and compressive strength after impact. The glass transition temperature of the cured polymer compositions is similarly unaffected. | 09-02-2010 |
| 20100304119 | PARTICLE-TOUGHENED FIBER-REINFORCED POLYMER COMPOSITES - Particle toughened, fiber-reinforced composites include a fiber region and an interlayer region between the fibers. The fiber region includes a plurality of fibers at least partially within a first polymer composition including a first base polymer formulation and a first plurality of toughening particles. The interlayer region includes a second polymer composition including a second base polymer formulation and at least one of the first plurality of toughening particles and a second plurality of toughening particles. Examples of first and second pluralities of toughening particles, respectively, may include core shell rubbers and polyimides. Increasing concentration of the first plurality of toughening particles may improve the composite toughness while preserving thermal properties of the composite, such as weight loss after extended duration exposure to elevated temperature. It is further discovered that the relative placement of the toughening particles influences composite mechanical properties, such as compression after impact (CAI) strength. | 12-02-2010 |
| 20100305274 | PARTICLE-TOUGHENED POLYMER COMPOSITIONS - Particle-toughened polymer compositions include a base polymer formulation and a plurality of toughening particles. In certain embodiments, the base polymer formulation includes bismaleimides or other polymer resins capable of high temperature service. A first plurality of toughening particles may include core shell rubbers. A second plurality of toughening particles may be selected from a variety of polymer compositions, including polyimides, polyether ketone (PEK), polyether ether ketone (PEEK), polyether ketone ketone (PEKK), polyether imide, polyether sulfones, and polyphenylene oxide. It is found that increasing concentration of the core shell rubbers may improve the toughness of the composition while preserving thermal properties of the composition, such as glass transition temperature. | 12-02-2010 |
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| 20080271992 | Apparatus and method for plating semiconductor wafers - An electroplating apparatus for electroplating a surface of a wafer is provided. The wafer is capable of being electrically charged as a cathode. The electroplating apparatus includes a plating head capable of being positioned either over or under the surface of a wafer and capable of being electrically charged as an anode. The plating head is capable of enabling metallic plating between the surface of the wafer and the plating head when the wafer and plating head are charged. The plating head further comprises a voltage sensor pair capable of sensing a voltage present between the plating head and the surface of the wafer, and a controller capable of receiving data from the voltage sensor pair. The data received from the voltage sensor pair is used by the controller to maintain a substantially constant voltage to be applied by the anode when the plating head is placed in positions over the surface of the wafer. A method of electroplating a wafer is also provided. | 11-06-2008 |
| 20090321250 | Apparatus for Plating Semiconductor Wafers - An electroplating apparatus for electroplating a surface of a wafer is provided. The wafer is capable of being electrically charged as a cathode. The electroplating apparatus includes a plating head capable of being positioned either over or under the surface of a wafer and capable of being electrically charged as an anode. The plating head is capable of enabling metallic plating between the surface of the wafer and the plating head when the wafer and plating head are charged. The plating head further comprises a voltage sensor pair capable of sensing a voltage present between the plating head and the surface of the wafer, and a controller capable of receiving data from the voltage sensor pair. The data received from the voltage sensor pair is used by the controller to maintain a substantially constant voltage to be applied by the anode when the plating head is placed in positions over the surface of the wafer. A method of electroplating a wafer is also provided. | 12-31-2009 |
| 20100108652 | SYSTEM METHOD AND APPARATUS FOR DRY-IN, DRY-OUT, LOW DEFECT LASER DICING USING PROXIMITY TECHNOLOGY - A substrate processing system includes a first, movable surface tension gradient device, a dicing device and a system controller. The first, movable surface tension gradient device is capable of supporting a first process within a first meniscus. The first meniscus being supported between the first surface tension gradient device and a first surface of the substrate. The first movable surface tension gradient device capable of being moved relative to the first surface of the substrate. The dicing device is oriented to a desired dicing location. The desired dicing location being encompassed by the meniscus. The system controller is coupled to the dicing device and the surface tension gradient device. The system controller includes a process recipe. A method for dicing a substrate is also described. The method of dicing a substrate including placing a substrate in a substrate dicing system, forming a meniscus between a proximity head and a first surface of the substrate, dicing the substrate at a desired dicing location and simultaneously capturing any particles and contaminants generated by dicing the substrate within the meniscus, the meniscus including the desired dicing location and moving the meniscus in a desired dicing direction. | 05-06-2010 |
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| 20080227369 | Apparatus and Method for Confined Area Planarization - A proximity head and associated method of use is provided for performing confined area planarization of a semiconductor wafer. The proximity head includes a chamber defined to maintain an electrolyte solution. A cathode is disposed within the chamber in exposure to the electrolyte solution. A cation exchange membrane is disposed over a lower opening of the chamber. A top surface of the cation exchange membrane is in direct exposure to the electrolyte solution to be maintained within the chamber. A fluid supply channel is defined to expel fluid at a location adjacent to a lower surface of the cation exchange membrane. A vacuum channel is defined to provide suction at a location adjacent to the lower surface of the cation exchange membrane, such that the fluid to be expelled from the fluid supply channel is made to flow over the lower surface of the cation exchange membrane. | 09-18-2008 |
| 20100319726 | SUBSTRATE PREPARATION USING MEGASONIC COUPLING FLUID MENISCUS - A method for cleaning a substrate is provided. The method includes receiving the substrate using a carrier that forms a circular opening, the substrate being positioned in the circular opening of the carrier. The holding of the substrate enables exposure of both a first side and a second side of the substrate at a same time. Then, moving the substrate along a direction, and while moving the substrate: (i) applying a chemistry onto the first side of the substrate, where the first side of the substrate having material to be removed; (ii) forming a fluid meniscus against the second side of the substrate at a location that is opposite a location onto which the chemistry is applied; and (iii) applying megasonic energy to the fluid meniscus while the fluid meniscus is applied against the second side. The megasonic energy increases mass transport of the chemistry to enhance removal of the material to be removed from the first side. | 12-23-2010 |
| 20110011335 | Electroless Plating Method and Apparatus - An electroless plating system is provided. The system includes a first vacuum chuck supporting a first wafer and a second vacuum chuck supporting a second wafer such that a top surface of the second wafer is opposing a top surface of the first wafer. The system also includes a fluid delivery system configured to deliver a plating solution to the top surface of the first wafer, wherein in response to delivery of the plating solution, the top surface of the second wafer is brought proximate to the top surface of the first wafer so that the plating solution contacts both top surfaces. A method for applying an electroless plating solution to a substrate is also provided. | 01-20-2011 |
| 20110306203 | INTERCONNECT STRUCTURE AND METHOD OF MANUFACTURING A DAMASCENE STRUCTURE - An interconnect structure is provided, including a layer of dielectric material having at least one opening and a first barrier layer on sidewalls defining the opening. A ruthenium-containing second barrier layer overlays the first barrier layer, the second barrier layer having a ruthenium zone, a ruthenium oxide zone, and a ruthenium-rich zone. The ruthenium zone is interposed between the first barrier layer and the ruthenium oxide zone. The ruthenium oxide zone is interposed between the ruthenium zone and the ruthenium-rich zone. | 12-15-2011 |
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| 20080235042 | NETWORK REPUTATION AND PAYMENT SERVICE - This document discusses, among other things, example embodiments of a transaction system that may receive, over a network, a first set of transaction data associated with a transaction for an item. In an example embodiment, a reputation application may adjust a rating associated with the transaction when the first set of transaction data indicates a purchase or a return of the item. | 09-25-2008 |
| 20080235123 | MICRO PAYMENTS - In one example embodiment, a system and method is shown that includes receiving financial data generated by a widget residing on a web page, the financial data including at least one of donation, or purchase data. The system and method may further include transmitting a display update to update the widget, the updating based upon the financial data. Some example embodiments may include, selecting a widget using an input device to generate data including at least one of donation or purchase data. Moreover, the system and method may include transmitting the at least one of donation or purchase data. Further, the system and method may include storing the at least one of donation or purchase data to a cookie. | 09-25-2008 |
| 20100235280 | METHOD AND SYSTEM TO VERIFY A TRANSACTION - A method and system to verify a transaction are described. The system may include an escrow module to receive funds from a client, a communication module to receive a request from the provider to redeem a provider set of tokens, and a redemption module to selectively redeem the provider set of tokens. The funds received by the escrow module are associated with a transaction between the client and a provider. The redemption module may be configured to examine the provider set of tokens and selectively redeem the provider set of tokens based on the results of the examination. | 09-16-2010 |
| 20110178897 | SYSTEMS AND METHODS FOR PROCESSING INCOMPLETE TRANSACTIONS OVER A NETWORK - In accordance with one or more embodiments of the present disclosure, a system and method for facilitating electronic commerce over a network includes communicating with a user via a user device and a merchant via a merchant device over the network, storing an incomplete purchase transaction between the user and the merchant, generating a portable checkout link to the incomplete purchase transaction, providing the portable checkout link to the user over the network, allowing the user to select the incomplete purchase transaction for processing, and processing the incomplete purchase transaction upon user selection. The system and method may include notifying the user of the incomplete purchase transaction over the network. | 07-21-2011 |
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| 20090138393 | SYSTEM AND METHOD FOR DELIVERING FINANCIAL SERVICES - A delivery system and method allow a financial institution to provide financial services to a plurality of remote devices, such as personal computers, personal data assistants, and screen phones. In addition to providing services to these remote devices, the system and method provide services to automatic teller machines (ATMs), external service providers, and internally within the financial institution to staff terminals and to the individual branches of the financial institution. The delivery of financial services is not limited to any particular network but rather may be provided through dial-in access, Internet access, on-line service provider access, or other types of delivery networks. The system is comprised of a set of re-usable global components which are modular and are organized into services sets. By separating the components of the system into independent components, the system and method can be developed and tested on a component level rather than the entire system level, thereby substantially reducing the development and maintenance cycle time. The system and method operate in sessions and, for instance, employ a dialog component for gathering information from a customer, a rule broker component for providing answers to the various legal and regulatory rules in a particular country, a language man component for selecting appropriate language, a transaction executor component for performing transactions, and a presentation manager component for formatting outputs to the customer. The system and method provide state-of-the art interfaces with interface components and support legacy applications with legacy app bridge components. A system management aspect of invention makes use of an agent set that provides a communication mechanism such that managed components of the system can be queried for their status, as well as the concept of instrumentation in which software monitors the hardware devices that are part of the system. | 05-28-2009 |
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| 20100028890 | COMPOSITIONS, METHODS, AND KITS FOR ANALYZING DNA METHYLATION - Compositions, methods, and kits for reducing strand amplification bias using bisulfite treated gDNA are provided. Methods for detecting and for quantitating the amplified bisulfite treated gDNA and inferring the presence, absence, and/or degree of methylation of target cytosine(s) in the gDNA are also provided. Such methods typically employ tailed first primer pairs, which can, but need not comprise nucleotide analogs, and optionally second primer pairs. | 02-04-2010 |
| 20100087641 | Method and Materials for Quaternary Amine Catalyzed Bisulfite Conversion of Cytosine to Uracil - The invention provides methods and materials for the conversion of cytosine to uracil. A nucleic acid, such a gDNA, is reacted with bisulfate, such as magnesium bisulfite, in the presence of a quaternary amine catalyst. Examples of suitable quaternary amine catalysts include but are not limited to quaternary ammonium compounds, quaternary alkyl ammonium salts, quaternary alkyl ammonium halides, quaternary methyl ammonium bromide, quaternary ammonium chloride, tetraethyl ammonium hydroxide, tetraethylammonium chloride, tetrabutyl ammonium chloride, tetrabutyl ammonium bromide. The invention also contemplates kits of premeasured ingredients for carrying out the methods of the invention either on an individual sample or on a plurality of samples. | 04-08-2010 |
| 20110195405 | COMPOSITIONS, METHODS, AND KITS FOR ANALYZING DNA METHYLATION - Compositions, methods, and kits for reducing strand amplification bias using bisulfite treated gDNA are provided. Methods for detecting and for quantitating the amplified bisulfite treated gDNA and inferring the presence, absence, and/or degree of methylation of target cytosine(s) in the gDNA are also provided. Such methods typically employ tailed first primer pairs, which can, but need not comprise nucleotide analogs, and optionally second primer pairs. | 08-11-2011 |
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| 20110227603 | Secure Anti-Tamper Integrated Layer Security Device Comprising Nano-Structures - A device and method using one or more electrically conductive nano-structures defined on one or more surfaces of a microelectronic circuit such as an integrated circuit die, microelectronic circuit package a stacked microelectronic circuit package, or on the surface of one or more layers in a stack of layers containing one or more ICs. The nano-structure is in connection with a monitoring circuit and acts as a “trip wire” to detect unauthorized tampering with the device or module. Such a monitoring circuit may include a power source such as an in-circuit or in-module battery and a “zeroization” circuit within the chip or package to erase the contents of a memory when the nano-structure is breached or altered. One or more electrically conductive nano-structures interconnect and reroute one or more electrical connections between one or more ICs to create an “invisible” set of electrical connections on the chip or stack to obfuscate an attempt to reverse engineer the device. microscope. | 09-22-2011 |
| 20120068333 | Wire Bond Through-Via Structure and Method - A stackable integrated circuit chip layer and module device that avoids the use of electrically conductive elements on the external surfaces of a layer containing an integrated circuit die by taking advantage of conventional wire bonding equipment to provide an electrically conductive path defined by a wire bond segment that is encapsulated in a potting material so as to define an electrically conductive wire bond “through-via” accessible from at least the lower or second surface of the layer. | 03-22-2012 |
| 20120068336 | Method for Fabricating a Neo-Layer Using Stud Bumped Bare Die - A method for fabricating a stackable integrated circuit layer and a device made from the method are disclosed. A stud bump is defined on the contact pad of an integrated circuit die and the stud-bumped die encapsulated in a potting material to define a potted assembly. A predetermined portion of the potting material is removed whereby a portion of the stud bump is exposed. One or more electrically conductive traces are defined on the layer surface and in electrical connection with the stud bump to reroute the integrated circuit contacts to predetermined locations on the layer to provide a stackable neolayer. | 03-22-2012 |
| 20120068341 | Method for Depackaging Prepackaged Integrated Circuit Die and a Product from the Method - A method for providing a known good integrated circuit die having enhanced planarity from a prepackaged integrated circuit die having a surface warpage such as in a ball grid array (BGA) package is provided. A partially-depackaged integrated circuit package is affixed to a substrate with a spacer element there between such that the active surface of the die within the partially depackaged integrated circuit die is “bowed” slightly upwardly to define a convex surface. The exposed encapsulant on the now-convex surface of the mounted, partially-depackaged integrated circuit package is then lapped or ground away to a predetermined depth so that an integrated circuit die is provided having an enhanced planarity and surface uniformity. | 03-22-2012 |
| 20120069528 | Method for Control of Solder Collapse in Stacked Microelectronic Structure - A process and product made from the process is disclosed to minimize solder collapse during solder reflow. | 03-22-2012 |
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| 20110031749 | Energy harvesting buoy - An energy-harvesting buoy is provided comprising an air-pressure generator, such as a piezo-electric generator, or any other generator that can harvest energy from an air pressure. The energy harvesting buoy consists of a first float and a second float. An air pressure is created when relative vertical motion occurs between the first float and the second float which drives an air pressurization means such as a piston driven air pump using a linkage member pivotably mounted between the respective floats. The generator uses the air pressure from the air pressurization means to drive the generator to generate electrical power. | 02-10-2011 |
| 20110031982 | Tamper-resistant electronic circuit and module incorporating electrically conductive nano-structures - A device and method are disclosed comprising one or more electrically conductive nano-structures defined on one or more surfaces of a microelectronic circuit such as an integrated circuit die, microelectronic circuit package (such as a TSOP, BGA or other prepackaged IC) a stacked microelectronic circuit package, or on the surface of one or more layers in a stack of layers containing one or more ICs. | 02-10-2011 |
| 20110147568 | High density array module and connector - In a preferred embodiment of the invention, a high density interconnect structure is provided comprised of a dielectric structure and one or more compressible conductive member for the electrical connection of a plurality of inputs and outputs of a three-dimensional module to external circuitry using a compression frame and a flex connector. The compression frame has a surface equal to or less than the surface area of the module surface upon which it is mounted and permits a plurality of modules to be “butted” together to provide, for instance, a buttable focal plane array module comprising a mosaic of buttable focal plane arrays. | 06-23-2011 |
