Boyapati
Chenna Krishna Rao Boyapati, Bangalore IN
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20090071153 | METHOD AND SYSTEM FOR ENERGY STORAGE AND RECOVERY - Disclosed herein is a system for generating energy, comprising a first heat exchanger in communication with a first heat source; wherein the first heat exchanger contacts a transfer fluid that comprises a working fluid and an associating composition; and a first energy conversion device comprising a piston in reciprocatory communication with a cylinder; the cylinder comprising an inlet or an outlet valve in operative communication with a cam having multiple lobes; the cam permitting the expansion or compression of the working fluid in the cylinder two or more times in a single cycle. | 03-19-2009 |
20090071155 | METHOD AND SYSTEM FOR THERMOCHEMICAL HEAT ENERGY STORAGE AND RECOVERY - Disclosed herein is a system for generating energy, comprising a first heat exchanger in thermal communication, fluid communication, or a combination of thermal and fluid communication with a first heat source; wherein the first heat exchanger contacts a transfer fluid that comprises a working fluid and an associating composition; and a first energy conversion device comprising a piston in reciprocatory communication with a cylinder; the cylinder comprising an inlet or an outlet valve in operative communication with a cam having multiple lobes; the cam permitting the expansion or compression of the working fluid in the cylinder two or more times in a single cycle. | 03-19-2009 |
20090249783 | Locomotive Engine Exhaust Gas Recirculation System and Method - A system, in certain embodiments, includes a low pressure exhaust gas recirculation (EGR) system configure to route exhaust gas upstream of a compressor coupled to an intake of an engine in a low temperature environment. The system also includes a high pressure EGR system configure to route exhaust gas downstream of the compressor and upstream of the intake at a high altitude and/or in a low pressure environment. The system, in some embodiments, also may include a flow control configured to change flow of the exhaust gas of the low pressure and high pressure EGR systems based on operating limits and environmental conditions including temperature and pressure. | 10-08-2009 |
Sagar Boyapati, Foster City, CA US
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20110218925 | CHANGE MANAGEMENT FRAMEWORK IN DISTRIBUTED ORDER ORCHESTRATION SYSTEM - A computer-readable medium, computer-implemented method, and system are provided. In one embodiment, an original executable process is executed in a regular mode. When a change request is received, the original executable process is stopped, and a new executable process is created. The new executable process is then executed in a change mode. | 09-08-2011 |
20110218927 | COMPENSATION PATTERNS FOR ADJUSTING LONG RUNNING ORDER MANAGEMENT FULFILLMENT PROCESSES IN AN DISTRIBUTED ORDER ORCHESTRATION SYSTEM - A computer-readable medium, computer-implemented method, and system are provided. In one embodiment, a compensation pattern is defined for a step of an executable process, and the step of the executable process is executed. A change request is received, and, based on the change request, the compensation pattern is applied to the step of the executable process. | 09-08-2011 |
Shireesha Boyapati, Warangal IN
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20110269790 | NOVEL THIENOPYRIDINES AS PHARMACOLOGICALLY ACTIVE AGENTS - The present invention provides compounds and pharmaceutically acceptable salts thereof methods for synthesizing thienopyridines and methods for inhibiting TNF-α activity for the treatment of cancer, asthma, arthritis, diabetes and inflammation. Provided are compounds of formula (I). | 11-03-2011 |
Sridhar Boyapati, Sammamish, WA US
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20140350710 | Tote Based Item Tracking - This disclosure describes a system for managing inventory as it transitions into a materials handling facility, as it transitions between locations within a materials handling facility and/or as it transitions out of a materials handling facility. In some instances, a user (e.g., picker or picking agent) may retrieve an item from an inventory location and place the item into a tote. The systems described herein detect the item when it is added to or removed from the tote. | 11-27-2014 |
20140350711 | Inventory Tracking - This disclosure describes a system for managing inventory as it transitions into a materials handling facility, as it transitions between locations within a materials handling facility and/or as it transitions out of a materials handling facility. In some instances, a user (e.g., picker or picking agent) may retrieve an item from an inventory location and place the item into a tote. The systems described herein detect the item when it is added to or removed from the tote. | 11-27-2014 |
20140350715 | Inventory Transitions - This disclosure describes a system for managing inventory as it transitions into a materials handling facility, as it transitions between locations within a materials handling facility and/or as it transitions out of a materials handling facility. In some instances, a user (e.g., picker or picking agent) may retrieve an item from an inventory location and place the item into a tote. The systems described herein detect the item when it is added to or removed from the tote. | 11-27-2014 |
20150019391 | DETECTING ITEM INTERACTION AND MOVEMENT - This disclosure describes a system for tracking removal or placement of items at inventory locations with a materials handling facility. In some instances, a user may remove an item from an inventory location and the inventory management system may detect that removal and update a user item list associated with the user to include an item identifier representative of the removed item. Likewise, if the user places an item at an inventory location, the inventory management system may detect that placement and update the user item list to remove an item identifier representative of the placed item. | 01-15-2015 |
Sri Ranga Boyapati, Chandler, AZ US
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20150279817 | LASER CAVITY FORMATION FOR EMBEDDED DIES OR COMPONENTS IN SUBSTRATE BUILD-UP LAYERS - An apparatus including a package substrate including a plurality of layers of conductive material, the package substrate including a cavity; and a device in the cavity, wherein an ultimate layer of the plurality of layers of conductive material defines contacts to contact points of the device. An apparatus including a package substrate comprising a plurality of conductive layers and a silicon bridge die disposed between ones of the plurality of conductive layers and an ultimate layer of the plurality of conductive layers defines contact points to contact points of the silicon bridge die; and a logic die coupled to the contact points of the ultimate layer of the plurality of layers of conductive layers. | 10-01-2015 |
Sriranga S. Boyapati, Austin, TX US
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20090114542 | PROCESS OF FORMING AN ELECTRONIC DEVICE INCLUDING DEPOSITING A CONDUCTIVE LAYER OVER A SEED LAYER - A process of forming an electronic device can include placing a seed layer into an electroplating solution within an electroplating tool. The electroplating tool can include a first electrode and a second electrode, wherein the first electrode is electrically connected to the seed layer. The process can also include depositing a first portion of a conductive layer using a first signal of a first type (e.g., direct current) between the first electrode and a second electrode, and depositing a second portion of the conductive layer over the first portion of the conductive layer, using a second signal of a second type (e.g., alternating current) between the first electrode and the second electrode of the electroplating tool. | 05-07-2009 |
Sri Ranga Sai Boyapati, Chandler, AZ US
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20140353831 | METHODS OF FORMING SUBSTRATE MICROVIAS WITH ANCHOR STRUCTURES - Methods of forming anchor structures in package substrate microvias are described. Those methods and structures may include forming a titanium layer in an opening of a package substrate using a first deposition process, wherein the opening comprises an undercut region, and wherein the first conductive layer does not substantially form in an anchor region of the undercut region. The titanium layer may then be re-sputtered using a second deposition process, wherein the titanium layer is formed in the anchor region. | 12-04-2014 |
20150179593 | LOW Z-HEIGHT PACKAGE ASSEMBLY - In embodiments, a package assembly may include a die coupled with one or more conductive pads. A barrier layer may be directly coupled with and between the die and one or more of the conductive pads. The package assembly may further include a solder resist layer coupled with the die and the conductive pads, and one or more interconnects positioned at least partially within the solder resist layer and directly coupled with one or more of the conductive pads. | 06-25-2015 |
Vijay Boyapati, Seattle, WA US
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20140207544 | RANKING LIMITED TIME DISCOUNTS OR DEALS - Briefly, the disclosure describes embodiments of methods or systems for providing an offer to potential recipients based on an appeal score and/or preference indicators of the potential recipients. | 07-24-2014 |