Patent application number | Description | Published |
20100307575 | SOLAR CELL AND METHOD MANUFACTURING THE SAME - Disclosed is a solar cell and a manufacturing method thereof. The solar cell includes: a substrate; an adhesive electrode disposed on the substrate; a first electrode adhered to the substrate by the adhesive electrode; a light absorption layer disposed on the first electrode; a window layer disposed on the light absorption layer; and a second electrode disposed on the window layer. | 12-09-2010 |
20120313484 | ULTRASONIC SENSOR - Disclosed herein is an ultrasonic sensor, including: a conductive case having at least one groove disposed on a bottom surface thereof; a piezoelectric element fixed to the bottom surface of the case through a non-conductive adhesive; a conductive adhesive injected into the groove to electrically connect the case to the piezoelectric element; a temperature compensation capacitor disposed on an upper portion of the piezoelectric element; a first lead wire led-in from the outside of the case and being electrically connected to one surface of the temperature compensation capacitor and the piezoelectric element; and a second lead wire led-in from the outside of the case and being electrically connected to the other surface of the temperature compensation capacitor and the case. | 12-13-2012 |
20120313487 | ULTRASONIC SENSOR - Disclosed herein is an ultrasonic sensor, including: a conductive case having a groove disposed at a bottom surface thereof; a piezoelectric element inserted into the groove and fixed to the groove by a conductive adhesive; a temperature compensation capacitor disposed on a top of the piezoelectric element, electrically connected to the piezoelectric element, and fixed to the case by a non-conductive adhesive; a first lead wire led-in from an outside of the case and electrically connected to one surface of the temperature compensation capacitor and the case; and a second lead wire lead-in from the outside of the case and electrically connected to the other surface of the temperature compensation capacitor, whereby the piezoelectric element which is easily damaged can be protected by the temperature compensation capacitor, without using the separate substrate for fixing the temperature compensation capacitor. | 12-13-2012 |
20120326563 | ULTRASONIC SENSOR AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are an ultrasonic sensor and a method of manufacturing the same. The ultrasonic sensor includes: a conductive case; a piezoelectric element fixed to a bottom. surface of the case through a conductive adhesive; a temperature compensation capacitor positioned over the piezoelectric element; a first lead wire lead from the outside of the case and electrically connected to one surface of the temperature compensation capacitor and the piezoelectric element; a second lead wire lead from the outside of the case and electrically connected to the other surface of the temperature compensation capacitor and the case; and a first molding part closely adhered to outer portions of the temperature compensation capacitor and the first and second lead wires. | 12-27-2012 |
20130020842 | PIEZOELECTRIC MODULE AND SEAT FOR VEHICLE INCLUDING THE SAME - Disclosed herein are a piezoelectric module and a sheet for a vehicle including the same. The sheet includes: a seat board part supporting a passenger's lower body; a backplate part formed to be extended in a direction perpendicular to one side of the seat board part and supporting the passenger's upper body; and a piezoelectric module formed in the seat board part and generating warm air or cold air using a flow of a current generated by vehicle vibration to thereby transfer the generated warm air or cold air to the passenger's body. | 01-24-2013 |
20130026884 | ULTRASONIC SENSOR - Disclosed herein is an ultrasonic sensor including: a case including an inner space formed therein; a substrate seated on a bottom surface of the case in the inner space thereof and including a plurality of piezoelectric elements and temperature compensation capacitors mounted in a row therein; and a sound absorbing material mounted on an upper portion of the substrate. | 01-31-2013 |
20130026885 | ULTRASONIC SENSOR - An ultrasonic sensor includes a case having an inner space provided therein, and having an upper stepped part and a lower stepped part respectively provided at an upper part and a lower part on an inside wall surface thereof; a piezoelectric element seated on a bottom surface of the case; a sound absorbent fixed above the piezoelectric element, a lateral portion of the sound absorbent being seated on the lower stepped part; and a substrate fixed above the sound absorbent, and configurated in a cross (+) shape of which respective lateral portions are seated on the upper stepped part. | 01-31-2013 |
20130038174 | ULTRASONIC SENSOR - Disclosed herein is an ultrasonic sensor including: a case including an inner space formed therein and including an electrode layer formed on an inner side wall surface thereof; a piezoelectric element seated on the electrode layer on a lower surface of the case, configured in a stack type, and including anode and cathode terminals formed on an outer peripheral surface thereof; a sound absorbing material fixed to an upper portion of the piezoelectric element; and first and second lead wires led from the outside of the case and electrically connected to the electrode layer formed on the inner side wall surface of the case. | 02-14-2013 |
20130043764 | ULTRASONIC SENSOR - Disclosed herein is an ultrasonic sensor including: a conductive case; a piezoelectric element fixed to a bottom surface of the case through a conductive adhesive; a temperature compensation capacitor positioned on the piezoelectric element; a first lead wire and electrically connected to one surface of the temperature compensation capacitor; a first wire electrically connecting one surface of the temperature compensation capacitor and the case to each other; a second lead wire and electrically connected to the other surface of the temperature compensation capacitor; a second wire electrically connecting the other surface of the temperature compensation capacitor and an upper surface of the piezoelectric element to each other; and a fixing part fixing the first lead wire and the first wire to one surface of the temperature compensation capacitor and fixing the second lead wire and the second wire to the other surface thereof. | 02-21-2013 |
Patent application number | Description | Published |
20120091861 | CERAMIC COMPOSITION FOR PIEZOELECTRIC ACTUATOR AND PIEZOELECTRIC ACTUATOR COMPRISING THE SAME - The present invention relates to a ceramic composition for a piezoelectric actuator and a piezoelectric actuator comprising the same. The ceramic composition for piezoelectric actuator includes a piezoelectric ceramic powder expressed by a Chemical Formula: (1-x)Pb(Zr | 04-19-2012 |
20120139850 | HAPTIC DRIVING ASSEMBLY AND ELECTRONIC DEVICE USING THE SAME - There is provided a haptic driving assembly capable of providing more uniform haptic feedback, and an electronic device using the same. The haptic driving assembly includes: at least one actuator; and a vibration transferring part disposed to contact at least one surface of the actuator and transferring vibrations generated in the actuator to the outside through a liquid phase medium. | 06-07-2012 |
20120139851 | HAPTIC DRIVING ASSEMBLY AND ELECTRONIC DEVICE USING THE SAME - There are provided a haptic driving assembly capable of providing stronger and more accurate vibration feedback, and an electronic device using the same. The haptic driving assembly includes: a support plate having a plate shape; and at least one actuator having one end thereof coupled to the support plate in order that the other end thereof is spaced apart from an upper surface of the support plate by a predetermined interval. | 06-07-2012 |
20130042690 | ULTRASONIC SENSOR - Disclosed herein is an ultrasonic sensor including: a case; a piezoelectric element mounted on an inner side bottom surface of the case; a first sound absorbing material having a through-hole formed at an area thereof corresponding to a mounting area of the piezoelectric element and including the piezoelectric element disposed at a portion thereof based on a thickness of the through-hole; and a second sound absorbing material formed on the first sound absorbing material so as to cover the entire surface of the first sound absorbing material including the through-hole, wherein the through-hole formed has a thickness thicker than that of the piezoelectric element. | 02-21-2013 |
20130043772 | CASE FOR ULTRASONIC SENSOR AND ULTRASONIC SENSOR USING THE SAME - Disclosed herein are a case for an ultrasonic sensor and an ultrasonic sensor using the same. The case for an ultrasonic sensor has a cylindrical shape and includes a disposition area of a piezoelectric element and a first groove formed in an inner side bottom surface thereof, wherein the first groove is formed along an edge of the disposition area of the piezoelectric element. | 02-21-2013 |
20130081469 | MULTI-SENSING APPARATUS AND METHOD THEREOF - Disclosed herein are a multi-sensing apparatus and a method thereof. The multi-sensing apparatus includes a plurality of ultrasonic sensors including a wave transmission unit transmitting an ultrasonic wave signal of a corresponding transmission frequency, and a wave reception unit receiving and outputting the ultrasonic wave signal transmitted from the wave transmission unit, and an analyzed integrated circuit controlling each of the wave transmission units of the plurality of ultrasonic sensors to transmit the ultrasonic wave signal of the corresponding transmission frequency, receiving an ultrasonic reflected signal received from each of the reception wave units, and computing and outputting a distance of an object sensed by a corresponding ultrasonic sensor using a time difference between a transmission time and a reception time. | 04-04-2013 |
20130081470 | ULTRASONIC SENSOR AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are an ultrasonic sensor including: a cylindrical case; a piezoelectric element; a sound absorbing material; a temperature compensation capacitor inserted into and fixed to the groove; a first pin terminal connected to one electrode of the temperature compensation capacitor and an exposed electrode of the piezoelectric element while penetrating through the groove of the sound absorbing material; a second pin terminal inserted into and fixed to the groove of the sound absorbing material and connected to the other electrode of the temperature compensation capacitor; and a lead wire inserted into and fixed to the groove of the sound absorbing material and having one terminal connected to the second pin terminal and the other terminal connected to an inner wall of the case, and a method for manufacturing the same. | 04-04-2013 |
20130112000 | ULTRASONIC SENSOR - Disclosed herein is an ultrasonic sensor, including: a case partitioning an inner space; a temperature-compensation ceramic maintaining a temperature of a sensor to be constant; sockets accommodating the temperature-compensation ceramic; a negative (−) terminal and a positive (+) terminal connected to the sockets, respectively; a piezoelectric ceramic connected to the positive (+) terminal and vibrating when power is supplied thereto; and an acoustic absorbent absorbing vibration of the piezoelectric ceramic. | 05-09-2013 |
20130134833 | ULTRASONIC SENSOR AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are an ultrasonic sensor and a method of manufacturing the same. The ultrasonic sensor includes: a case having one end closed and the other end opened; a piezoelectric element fixedly coupled to one end of an inner portion of the case; a sound absorbing member coupled to an upper surface of the piezoelectric element so as to cover a portion of the piezoelectric element; a conductive member having one end connected to the piezoelectric element and the other end connected to the sound absorbing member; and a lead wire electrically coupled to the conductive member and the case. | 05-30-2013 |