Boukai
Akram I. Boukai, Ann Arbor, MI US
Patent application number | Description | Published |
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20130019918 | THERMOELECTRIC DEVICES, SYSTEMS AND METHODS - A method for forming a thermoelectric element for use in a thermoelectric device comprises forming a mask adjacent to a substrate. The mask can include three-dimensional structures phase-separated in a polymer matrix. The three-dimensional structures can be removed to provide a plurality of holes in the polymer matrix. The plurality of holes can expose portions of the substrate. A layer of a metallic material can be deposited adjacent to the mask and exposed portions of the substrate. The mask can then be removed. The metallic material is then exposed to an oxidizing agent and an etchant to form holes or wires in the substrate. | 01-24-2013 |
20140373888 | SYSTEMS AND METHODS FOR FORMING THERMOELECTRIC DEVICES - A method for forming a thermoelectric element for use in a thermoelectric device comprises providing a mask adjacent to a substrate, the mask comprising a polymeric mixture, and bringing a template having a first pattern in contact with the mask to define a second pattern in the mask. The first pattern comprises one of holes and rods, and the second pattern comprises the other of holes and rods. Holes or rods of the second pattern expose portions of the substrate. Next, an etching layer is deposited adjacent to exposed portions of the substrate. The etching layer is configured to aid in etching the substrate. The substrate is subsequently etched with the aid of the etching layer. | 12-25-2014 |
Akram I. Boukai, San Francisco, CA US
Patent application number | Description | Published |
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20150228883 | Systems and Methods for Forming Thermoelectric Devices - A vapor phase method for forming a thermoelectric element comprises providing a substrate in a reaction space, the substrate including a pattern of a metallic material adjacent to the substrate, which metallic material is configured to catalyze the oxidation of the substrate. The metallic material is then exposed to a gas having an oxidizing agent and a chemical etchant to form holes in or wires from the substrate. | 08-13-2015 |
Akram I. Boukai, Menlo Park, CA US
Patent application number | Description | Published |
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20150280099 | THERMOELECTRIC DEVICES AND SYSTEMS - The present disclosure provides a thermoelectric element comprising a flexible semiconductor substrate having exposed surfaces with a metal content that is less than about 1% as measured by x-ray photoelectron spectroscopy (XPS) and a figure of merit (ZT) that is at least about 0.25, wherein the flexible semiconductor substrate has a Young's Modulus that is less than or equal to about 1×10 | 10-01-2015 |