| Patent application number | Description | Published |
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| 20090009063 | Seal for light emitting device and method - A glass package is disclosed comprising a first substrate and a second substrate, where the substrates are attached in at least two locations, both attachments comprising frits, and wherein the frits comprise a glass portion comprising: a base component comprising and at least one absorbing component. Also disclosed is a method of sealing a light emitting display device comprising providing a light emitting layer, a first substrate and a second substrate, where a frits are deposited between the substrates, and where the frits are sealed with a radiation source. | 01-08-2009 |
| 20090044496 | Method and apparatus for sealing a glass package - An apparatus for sealing a glass package by applying a force to a glass assembly while simultaneously irradiating a sealing material disposed between the two glass substrates with a beam of radiation. The applied force is translated in unison with the radiation beam. The radiation cures and/or melts the sealing material, depending upon the sealing material. The applied force beneficially improves contact between the glass substrates and the sealing material during the sealing process, therefore assisting in achieving a hermetic seal between the substrates. | 02-19-2009 |
| 20090155555 | Frit-containing pastes for producing sintered frit patterns on glass sheets - Pastes for use in producing sintered frit patterns ( | 06-18-2009 |
| 20090297862 | Method for sintering a frit to a glass plate - A method is described herein for sintering a frit to a glass plate where the sintered frit and glass plate are subsequently sealed to another glass plate to form a sealed glass package. Examples of the sealed glass package include a light-emitting device (e.g., organic light emitting diode (OLED) device), a photovoltaic device, a food container, and a medicine container. | 12-03-2009 |
| 20110089587 | METHODS FOR ASSEMBLING AN OPTOELECTRONIC DEVICE - Methods for assembling an optoelectronic device are provided. The optoelectronic device includes a first transparent substrate, a second substrate, and environmentally sensitive components. The methods comprise the step of applying a fill material to a surface of at least one of the substrates, and lowering a viscosity of the fill material. The methods further comprise the step of pressing the first transparent substrate and the second substrate together such that the fill material substantially fills an area between the first transparent substrate and the second substrate and substantially encapsulates exposed portions of the environmentally sensitive components. The methods still further comprise the step of sealing the first transparent substrate and the second substrate together to hermetically seal the fill material within the area. | 04-21-2011 |
| Patent application number | Description | Published |
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| 20090061151 | Formation of a fabric seam by ultrasonic gap welding of a flat woven fabric - The invention relates to ultrasonic gap welding of flat woven fabrics. Specifically, the invention relates to a method of ultrasonic welding the seam termination yarn ends of a fabric using a controlled gap. A mechanical stop may be employed to control the distance or gap between the horn and anvil to a predetermined level based on the depth of welding and amount of weld energy. By adding another degree of control, the ultrasonic gap welding technique of the present invention is able to achieve fabric seams that are stronger than conventional seams, and even those enhanced with gluing, and is conducive to formation of fabric seams by spot welding or along the termination yarn ends of the fabric. | 03-05-2009 |
| 20100230064 | INDUSTRIAL FABRIC INCLUDING SPIRALLY WOUND MATERIAL STRIPS - An industrial fabric, belt or sleeve and a method of making the fabric, belt or sleeve are disclosed. The industrial fabric, belt or sleeve is produced by spirally winding strips of polymeric material, such as an industrial strapping or ribbon material, and joining the adjoining sides of the strips of material using ultrasonic welding or laser welding techniques. The fabric, belt or sleeve may then be perforated using a suitable technique to make it permeable to air and/or water. | 09-16-2010 |
| 20100236034 | INDUSTRIAL FABRIC INCLUDING SPIRALLY WOUND MATERIAL STRIPS - An industrial fabric such as an endless belt or sleeve for use in the production of nonwovens, and a method of making thereof are disclosed. The industrial fabric is produced by spirally winding strips of polymeric material, such as an industrial strapping or ribbon material, and joining the adjoining sides of the strips of material using ultrasonic welding or laser welding techniques. The fabric may then be perforated using a suitable technique to make it permeable to air and/or water. | 09-23-2010 |
| 20100323148 | FORMATION OF A FABRIC SEAM BY ULTRASONIC GAP WELDING OF A FLAT WOVEN FABRIC - The invention relates to ultrasonic gap welding of flat woven fabrics. Specifically, the invention relates to a method of ultrasonic welding the seam termination yarn ends of a fabric using a controlled gap. A mechanical stop may be employed to control the distance or gap between the horn and anvil to a predetermined level based on the depth of welding and amount of weld energy. By adding another degree of control, the ultrasonic gap welding technique of the present invention is able to achieve fabric seams that are stronger than conventional seams, and even those enhanced with gluing, and is conducive to formation of fabric seams by spot welding or along the termination yarn ends of the fabric. | 12-23-2010 |
