Patent application number | Description | Published |
20130082895 | Antenna Structures with Molded and Coated Substrates - Electronic devices may be provided with antenna structures. The antenna structures may be used in wirelessly transmitting and receiving radio-frequency signals. Antenna structures may be formed from molded dielectric substrates. Patterned conductive material may be formed on the dielectric substrates. The dielectric substrates may be formed from molded materials such as glass or ceramic. Sheets of dielectric or dielectric powder may be compressed to form a dielectric substrate of a desired shape. The patterned conductive material may be formed from metallic paint or other conductors. A hollow antenna chamber may be formed by joining molded dielectric structures. An antenna such as an indirectly-fed loop antenna or other antennas may be formed from the molded dielectric substrates and patterned conductors. | 04-04-2013 |
20130127672 | Distributed Loop Antennas with Extended Tails - Electronic devices may be provided with antenna structures such as distributed loop antenna resonating element structures. A distributed loop antenna may be formed on an elongated dielectric carrier and may have a longitudinal axis. The distributed loop antenna may include a loop antenna resonating element formed from a sheet of conductive material that extends around the longitudinal axis. A gap may be formed in the sheet of conductive material. The gap may be located under an opaque masking layer on the underside of a display cover glass associated with a display. The loop antenna resonating element may have a main body portion that includes the gap and may have an extended tail portion that extends between the display and conductive housing structures. The main body portion and extended tail portion may be configured to ensure that undesired waveguide modes are cut off during operation of the loop antenna. | 05-23-2013 |
20130293424 | Corner Bracket Slot Antennas - A display cover layer may be mounted in an electronic device housing using housing structures such as corner brackets. A slot antenna may be formed from a corner bracket opening, metal traces on a hollow plastic support structure, or other conductive structures. The slot antenna may have a main portion with opposing ends. An antenna feed may be located at one of the ends. The slot antenna may have a slot with one or more bends. The bends may provide the slot antenna with a C-shaped outline. A side branch slot may extend from the main portion of the slot at a location between the two bends. The presence of the side branch slot may enhance antenna bandwidth. A hollow enclosure may serve as an antenna support structure and as a speaker box enclosing a speaker driver. The antenna feed may be positioned so as to overlap the speaker driver. | 11-07-2013 |
20130328730 | Methods for Forming Elongated Antennas With Plastic Support Structures for Electronic Devices - Electronic devices may be provided with antenna structures. The antenna structures may include an antenna support structure covered with patterned antenna traces. An antenna support structure may be mounted in an electronic device so that a surface of the antenna support structure that is covered with patterned antenna traces lies flush with a planar surface of the electronic device housing. A display cover layer or other planar structure may be attached to the surface of the antenna support structure and the planar surface of the housing adhesive. Injection molding and extrusion techniques may be used in forming a support structure with elongated parallel cavities. An injection molding tool may have a mold core supported by a support structure at one end, supporting engagement features at the ends of mating mold core structures, or support pins. Molded interconnect devices may be soldered to laser direct structuring components to form antennas. | 12-12-2013 |
20140166867 | Electronic Devices with Light Sensors - Electronic devices may be provided with light sensors. Light sensors may be proximity sensors or ambient light sensors. Proximity sensors may include a light-emitting component and a light-sensitive component. The electronic device may include an enclosure formed from housing structures and some or all of a display for the device. The enclosure may include openings such as openings formed from clusters of smaller openings. Each light sensor may receive light through one of the clusters of openings. The light sensor may receive the light directly through the openings or may receive light that passes through the openings and is guided to the light sensor by light guiding structures. The light guiding structures may include fiber optic structures or light-reflecting structures. Fiber optic structures may fill or partially fill the openings. Light reflecting structures may be machined cavities in an internal support structure. | 06-19-2014 |
20140240195 | Electronic Device With Diverse Antenna Array Having Soldered Connections - A wireless electronic device may be provided with antenna structures. The antenna structures may be formed from an antenna ground and an array of antenna resonating elements. The antenna resonating elements may be electrically connected to the antenna ground using solder. The antenna resonating elements may be formed from metal traces on a dielectric support structure that surrounds the antenna ground. The antenna ground may be formed form stamped sheet metal and may have slanted steps adjacent to the antenna resonating elements. To form a solder joint between the metal antenna resonating element traces and the sheet metal of the antenna ground, laser light may be applied to the sheet metal of the antenna ground in the vicinity of the solder paste. Separate metal members may also be provided in the vicinity of the solder paste and may be heated using the laser to join metal traces on plastic carriers. | 08-28-2014 |
20140306845 | Electronic Device With Foam Antenna Carrier - Electronic devices may include radio-frequency transceiver circuitry and antenna structures. The antenna structures may include a dielectric carrier such as a foam carrier. The foam carrier may be formed from a material that can withstand elevated temperatures. Metal traces for antennas can be formed on the foam carrier by selectively activating areas on a powder coating with a laser and plating the laser-activated areas. Metal for the antennas may also be formed by attaching layers such as flexible printed circuit layers and metal foil layers to the foam carrier. Solder may be used to attach a coaxial cable or other transmission line, electrical components, and other electrical structures to the metal antenna structures on the foam carrier. The foam carrier may be formed from open cell or closed cell foam. The surface of the foam may be smoothed to facilitate formation of metal antenna structures. | 10-16-2014 |
20140370821 | Methods and Apparatus for Testing Electronic Devices with Antenna Arrays - A wireless electronic device may be provided with antenna structures. The antenna structures may be formed from an antenna ground and an array of antenna resonating elements formed along its periphery. The antenna resonating elements may be formed from metal traces on a dielectric support structure that surrounds the antenna ground. The electronic device may be tested using a test system for detecting the presence of manufacturing/assembly defects. The test system may include an RF tester and a test fixture. The device under test (DUT) may be attached to the test fixture during testing. Multiple test probes arranged along the periphery of the DUT may be used to transmit and receive RF test signals for gathering scattering parameter measurements on the device under test. The scattering parameter measurements may then be compared to predetermined threshold values to determine whether the DUT contains any defects. | 12-18-2014 |
20150050893 | Methodology and Apparatus for Testing Conductive Adhesive Within Antenna Assembly - Damage to conductive material that serves as bridging connections between conductive structures within an electronic device may result in deficiencies in radio-frequency (RF) and other wireless communications. A test system for testing device structures under test is provided. Device structures under test may include substrates and a conductive material between the substrates. The test system may include a test fixture for increasing tensile or compressive stress on the device structures under test to evaluate the resilience of the conductive material. The test system may also include a test unit for transmitting RF test signals and receiving test data from the device structures under test. The received test data may include scattered parameter measurements from the device structures under test that may be used to determine if the device structures under test meet desired RF performance criteria. | 02-19-2015 |