Patent application number | Description | Published |
20090020774 | PACKAGE OF LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME - Provided is a package of a light emitting diode. The package includes a metal plate, a light-emitting diode chip, an insulating layer, a lead frame, a reflective coating layer, and a molding material. The light-emitting diode chip is surface-mounted on the metal plate, and the insulating layer is formed on the metal plate and is separated from the light-emitting diode chip. The lead frame is provided on the insulating layer, the reflective coating layer is formed on the lead frame, and the molding material molds the light-emitting diode chip in a predetermined shape. | 01-22-2009 |
20100327308 | LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME - According to an embodiment, a light emitting apparatus includes a substrate; at least two distinct electrodes on the substrate, wherein the at least two distinct electrodes are spaced from each other; a light emitting device on one of the at least two distinct electrodes; lenses including a first lens and a second lens on the substrate, wherein the second lens is disposed on the first lens, wherein an outermost portion of the second lens is spaced from the substrate; and a supporting unit configured to directly contact the second lens, wherein the supporting unit is formed of a non-conductivity material. | 12-30-2010 |
20110079812 | LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME - Disclosed are a light emitting device and a method for manufacturing the same. The light emitting device includes a substrate having a lead frame, a light emitting diode mounted on the substrate, a mold member formed on the substrate and the light emitting diode, and a reflecting member having an opening portion at one side thereof and being inclined at an outer portion of the mold member. | 04-07-2011 |
20110169021 | PACKAGE OF LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME - Provided is a package of a light emitting diode. The package according to an embodiment includes a base layer, a light emitting diode chip on the base layer, a lead frame electrically connected to the light emitting diode chip, a reflective coating layer directly on the lead frame, and a molding material covering the light emitting diode chip in a predetermined shape. | 07-14-2011 |
20110169032 | PACKAGE OF LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME - Provided is a package of a light emitting diode. The package according to an embodiment includes a package of a light emitting diode, the package comprising: a base layer including an entire top surface that is substantially flat; a light emitting diode chip on the base layer; a lead frame electrically connected to the light emitting diode chip; and a reflective coating layer comprising titanium oxide, wherein a top surface of the reflective coating layer is substantially parallel to a top surface of the base layer, and wherein ends of the reflective coating layer and base layer are aligned with each other. | 07-14-2011 |
20110233577 | LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME - Disclosed are a light emitting device and a method for manufacturing the same. The light emitting device includes a substrate having a lead frame, a light emitting diode mounted on the substrate, a mold member formed on the substrate and the light emitting diode, and a reflecting member having an opening portion at one side thereof and being inclined at an outer portion of the mold member. | 09-29-2011 |
20140008689 | PACKAGE OF LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME - Provided is a package of a light emitting diode. The package according to an embodiment includes a package of a light emitting diode, the package comprising: a base layer including an entire top surface that is substantially flat; a light emitting diode chip on the base layer; a lead frame electrically connected to the light emitting diode chip; and a reflective coating layer comprising titanium oxide, wherein a top surface of the reflective coating layer is substantially parallel to a top surface of the base layer, and wherein ends of the reflective coating layer and base layer are aligned with each other. | 01-09-2014 |
20140367728 | LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF - A light emitting device including a substrate including an entire top surface that is flat, a light emitting diode on the substrate, a lead frame disposed on the flat top surface of the substrate, the lead frame electrically connected to the light emitting diode, a dam member disposed on the substrate and being adjacent to the light emitting diode, the dam member having a circular configuration which has an opening, a first member disposed on the light emitting diode, the first member including a fluorescent substance to convert a light emission spectrum of light from the light emitting diode, a second member disposed in the opening of the dam member, a circumference of the second member being defined by the dam member and a lens disposed on the second member is provided. | 12-18-2014 |