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Blaschke

Chris E. Blaschke, Brazoria, TX US

Patent application numberDescriptionPublished
20110086963Processes to Control Fouling and Improve Compositions - Improved reaction processes comprise reacting a mixture to form a product comprising a metal alkyl, metal oxide, or mixture thereof and then passing said product to a post-reactor heat exchanger. The improvement comprises one or more of the following: (1) reacting said metal alkyl compound with an acid to produce a soluble metal ester; or (2) adding an ionic surfactant; or (3) adding a mixture comprising an antioxidant to the product under conditions sufficient to avoid formation of significant amounts of insoluble metal or metal compounds derived from said metal alkyl compound; or (4) purging said post-reactor heat exchanger with an inert gas under conditions to remove metal oxide from the post-reactor heat exchanger.04-14-2011

Christina Blaschke, White Pigeon, MI US

Patent application numberDescriptionPublished
20120037514Enzymatic Electrochemical Biosensor - An electrochemical sensor strip has a base and a first electrode and a second electrode on the base. An oxidoreductase enzyme and a mediator are on the first electrode, and a soluble redox species is on the second electrode. The soluble redox species may be an organotransition metal complex, a transition metal coordination complex, an electroactive organic molecule, or mixtures thereof.02-16-2012

David Earl Blaschke, Austin, TX US

Patent application numberDescriptionPublished
20080212946Personal Video Recorder With Storage Space Loans - Automated personal video recording for multi-user personal video recorders having a multiplicity of registered users, each user having allocated storage space on the PVR which allocated storage space for each user includes storage space upon which shows are recorded and storage space upon which shows have not been recorded (free space), including recording for a borrower a show owned by the borrower, the show having a storage space requirement exceeding the borrower's free space by a deficit amount; selecting, in dependence upon the deficit amount, one or more lenders, wherein the lenders are users, registered on the PVR, having free space; and borrowing, in dependence upon the deficit amount, from the lenders for the borrower, at least one loan amount of storage space. Embodiments include returning from the borrower to the lender the deficit amount after displaying the show to the borrower or upon repossession by a lender.09-04-2008

Keith Blaschke, Duncan, OK US

Patent application numberDescriptionPublished
20080197605Method for Constructing and Treating Subterranean Formations - A method for servicing a well comprises providing at least one trailer, providing at least one towing vehicle, providing servicing equipment, supporting the equipment with the trailer, and moving the towing vehicle, so as to move the trailer along with the equipment. The combination gross weight rating or combination gross vehicle weight of the trailer and the towing vehicle may be less than 26,001 pounds or less than less than the commercial drivers license threshold, under the Federal Motor Carrier Safety Administration's regulations.08-21-2008
20110061525In Situ Testing of Mechanical Properties of Cementitious Materials - A system for measuring one or more physical properties of cementitious material is operable to cure a slurry of cementitious material under desired conditions of temperature and pressure. Particularly, the system may be operable to cure the slurry under a temperature and pressure expected to be experienced downhole. The system may also be used to determine properties of the cured cementitious material, such as maximum yield strength and shear bond strength at the desired temperature and pressure. The desired conditions of temperature and pressure may be applied both during curing and testing of the cementitious material.03-17-2011

Volker Blaschke, Irvine, CA US

Patent application numberDescriptionPublished
20110018109Deep silicon via for grounding of circuits and devices, emitter ballasting and isolation - According to an exemplary embodiment, a semiconductor die including at least one deep silicon via is provided. The deep silicon via comprises a deep silicon via opening that extends through at least one pre-metal dielectric layer of the semiconductor die, at least one epitaxial layer of the semiconductor die, and partially into a conductive substrate of the semiconductor die. The deep silicon via further comprises a conductive plug situated in the deep silicon via opening and forming an electrical contact with the conductive substrate. The deep silicon via may include a sidewall dielectric layer and a bottom conductive layer. A method for making a deep silicon via is also disclosed. The deep silicon via is used to, for example, provide a ground connection for power transistors in the semiconductor die.01-27-2011