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Blander

Alexandre Blander, Bromont CA

Patent application numberDescriptionPublished
20100200271ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER - In one embodiment of the present invention, inert nano-sized particles having dimensions from 1 nm to 1,000 nm are added into a solder ball. The inert nano-sized particles may comprise metal oxides, metal nitrides, metal carbides, metal borides, etc. The inert nano-sized particles may be a single compound, or may be a metallic material having a coating of a different material. In another embodiment of the present invention, a small quantity of at least one elemental metal that forms stable high melting intermetallic compound with tin is added to a solder ball. The added at least one elemental metal forms precipitates of intermetallic compounds with tin, which are dispersed as fine particles in the solder.08-12-2010
20110121469PASSIVATION LAYER SURFACE TOPOGRAPHY MODIFICATIONS FOR IMPROVED INTEGRITY IN PACKAGED ASSEMBLIES - A structure and method for producing the same is disclosed. The structure includes an organic passivation layer with solids suspended therein. Preferential etch to remove a portion of the organic material and expose portions of such solids creates enhanced surface roughness, which provides a significant advantage with respect to adhesion of that passivation layer to the packaging underfill material.05-26-2011

Alexandre Blander, Montreal CA

Patent application numberDescriptionPublished
20110292621GROUNDED LID FOR MICRO-ELECTRONIC ASSEMBLIES - An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface.12-01-2011

Emanuel Blander, Noridiya IL

Patent application numberDescriptionPublished
20080282254Geographic Resiliency and Load Balancing for SIP Application Services - A mechanism for achieving resiliency and load balancing for SIP application services and, in particular, in geographic distributed sites. A method performs a distribution of SIP requests among SIP servers, where at least two sites with a load balancer in each site is configured. The method includes receiving a SIP request by a first load balancer in a first site; determining whether the SIP request should be redirected to a second site; and redirecting the SIP request to an address of a second load balancer in the second site. The invention also includes a SIP proxy including a receiving unit receiving SIP requests; a load balancing unit distributing SIP requests between SIP entities; and a health monitoring unit verifying availability of the SIP entities. The SIP proxy may further be configured with a proximity measuring unit determining a proximity to a SIP entity.11-13-2008
20090132714Method and System for Providing Connection Resiliency - A system, method and device for providing connection resiliency. The method including maintaining, by a first proxy, a TCP connection with a TCP client and a TCP connection with a TCP server through one or more TCP networks; maintaining information of both TCP connections by a forwarding component between the TCP networks and the first proxy; establishing, by the forwarding component, a new TCP connection with a second proxy for each of the TCP connections maintained by the first proxy; and forwarding data, to and from both the client and the server, to and from the second proxy without disconnection of the TCP connections of the TCP client and TCP server.05-21-2009

Gil Blander, Lexington, MA US

Patent application numberDescriptionPublished
20110009474SIRTUIN BASED METHODS AND COMPOSITIONS FOR TREATING BETA-CATENIN-RELATED CONDITIONS - Provided herein are methods and compositions relating to sirtuin modulation of Wnt pathway signaling, including the use of sirtuin and sirtuin-modulating agents in the prevention and treatment of cancer and other diseases.01-13-2011

Julie Magarian Blander, North Haven, CT US

Patent application numberDescriptionPublished
20120039841T-Helper Cell Type 17 Lineage-Specific Adjuvants, Compositions and Methods - The present invention relates to compositions and methods for the modulation of T02-16-2012