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Blanchard, WA
James D. Blanchard, Soap Lake, WA US
| Patent application number | Description | Published |
|---|---|---|
| 20090038947 | Electroplating aqueous solution and method of making and using same - In one embodiment of the invention, an electroplating aqueous solution is disclosed. The electroplating aqueous solution includes at least two acids, copper, at least one accelerator agent, and at least two suppressor agents. The at least one accelerator agent provides an acceleration strength of at least about 2.0 and the at least two suppressor agents, collectively, provide a suppression strength of at least about 5.0. Methods of making and using such an electroplating aqueous solution are also disclosed. | 02-12-2009 |
| 20090090631 | Substrate holder and electroplating system - In one embodiment, a substrate holder comprises a base supporting a substrate that includes a surface having a peripheral region. A cover may be assembled with the base and includes at least one opening exposing only a portion of the surface therethrough. A seal assembly substantially seals a region between the cover and base and further adjacent to the peripheral region of the substrate. An electrode includes at least one contact portion positioned within the region and extending over at least a portion of the peripheral region of the substrate. A compliant member comprises a polymeric material and may be positioned within the region between the at least one contact portion and either the peripheral region of the substrate or the cover. In other embodiments, an electroplating system is disclosed that may employ such a substrate holder. | 04-09-2009 |
| 20090250352 | Methods for electroplating copper - Embodiments of the invention are directed to methods of electroplating copper onto at least one surface of a substrate in which more uniform electrical double layers are formed adjacent to the at least one surface being electroplated (i.e., the cathode) and an anode of an electrochemical cell, respectively. In one embodiment, the electroplated copper may be substantially-free of dendrites, exhibit a high-degree of (111) crystallographic texture, and/or be electroplated at a high-deposition rate (e.g., about 6 μm per minute or more) by electroplating the copper under conditions in which a ratio of a cathode current density at the at least one surface to an anode current density at an anode is at least about 20. In another embodiment, a porous anodic film may be formed on a consumable copper anode using a long conditioning process that promotes forming a more uniform electrical double layer adjacent to the anode. | 10-08-2009 |
Sophie Blanchard, Seattle, WA US
| Patent application number | Description | Published |
|---|---|---|
| 20100209951 | METHODS FOR ASSAYING ALPHA-L-IDURONIDASE ENZYMATIC ACTIVITY - Methods for assaying α-L-iduronidase enzymatic activity and methods for screening newborns for Mucopolysaccharidosis Type-I. | 08-19-2010 |
Steve Blanchard, Issaquah, WA US
| Patent application number | Description | Published |
|---|---|---|
| 20100276064 | BONDED PATCHES WITH BOND LINE CONTROL - A patch may be used to rework a composite structure in the filed. The patch is bonded to the structure by a layer of adhesive and includes perforations that allow the escape of air from the adhesive as the patch is compressed against the structure. A spacer may be introduced between the patch and the structure to control the thickness of the adhesive layer. | 11-04-2010 |
| 20100276065 | Bonded Patches With Bond Line Control - A patch is used to rework an area of a structure. The patch is bonded to the structure by a layer of adhesive. A spacer placed between the patch and the structure is used to control the thickness of the adhesive and/or a bondline. | 11-04-2010 |
Steven D. Blanchard, Issaquah, WA US
| Patent application number | Description | Published |
|---|---|---|
| 20100132875 | COPPER GRID REPAIR TECHNIQUE FOR LIGHTNING STRIKE PROTECTION - A method for reworking an electrically conductive layer of a composite skin is disclosed in which a patch replaces the altered section of the electrically conductive layer. The method is performed by removing a portion of the electrically conductive layer to reveal the underlying composite skin. A patch is formed, having an electrically conductive section coupled to an adhesive having a low dielectric breakdown strength, and is then introduced over the underlying composite skin such that the adhesive layer covers the underlying composite skin and overlaps an unremoved portion of the electrically conductive layer. The patch is applied such that the electrically conductive section within the patch covers the adhesive layer and overlaps the unremoved section of the electrically conductive layer. The adhesive layer preferably has a low dielectric breakdown strength, so that electricity from lightning which strikes the composite skin may be conducted through the adhesive. | 06-03-2010 |
Steven Donald Blanchard, Issaquah, WA US
| Patent application number | Description | Published |
|---|---|---|
| 20100274545 | Bonded Rework Simulation Tool - A method and apparatus may be present for managing rework. A section in a location of a platform having a number of composite materials needing rework may be identified to form an identified section. A layup for the number of composite materials in the identified section of the platform may be determined. A patch for the identified section of the platform and the layup for the number of composite materials may be generated. A simulation may be performed of a selected rework process and the patch in the identified section. | 10-28-2010 |
Todd Blanchard, Bainbridge Island, WA US
| Patent application number | Description | Published |
|---|---|---|
| 20090144176 | System and method for replicating objects from providers in communication displays from other providers - A communication system facilitates the replication of display objects from first providers into displays provided, upon request from subscribers, by second providers. The first providers may specify which second providers or classes of second providers may incorporate the replicated display objects, and which portions thereof the second providers may customize. The second providers may select which available replicates they will display, and may customize them as specified permissible by the first providers. Changes made to the objects become available immediately to subscribers. | 06-04-2009 |