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Blakers
Andrew William Blakers, Aranda AU
| Patent application number | Description | Published |
|---|---|---|
| 20100258161 | Semiconductor Device - The invention provides a method for increasing the usable surface area of a semiconductor wafer having a substantially planar surface and a thickness dimension at right angles to said substantially planar surface, the method including the steps of selecting a strip thickness for division of the wafer into a plurality of strips, selecting a technique for cutting the wafer into the strips at an angle to the substantially planar surface, in which the combined strip thickness and width of wafer removed by the cutting is less than the thickness of the wafer, cutting the wafer into strips using the selected technique and separating the strips from each other. | 10-14-2010 |
| 20100269899 | Solar Cell - The invention provides a method for increasing the usable surface area of a semiconductor wafer having a substantially planar surface and a thickness dimension at right angles to said substantially planar surface, the method including the steps of selecting a strip thickness for division of the wafer into a plurality of strips, selecting a technique for cutting the wafer into the strips at an angle to the substantially planar surface, in which the combined strip thickness and width of wafer removed by the cutting is less than the thickness of the wafer, cutting the wafer into strips using the selected technique and separating the strips from each other. | 10-28-2010 |
Andrew William Blakers, Aranda Act AU
| Patent application number | Description | Published |
|---|---|---|
| 20100267218 | Semiconductor Wafer Processing to Increase the Usable Planar Surface Area - The invention provides a method for increasing the usable surface area of a semiconductor wafer having a substantially planar surface and a thickness dimension at right angles to said substantially planar surface, the method including the steps of selecting a strip thickness for division of the wafer into a plurality of strips, selecting a technique for cutting the wafer into the strips at an angle to the substantially planar surface, in which the combined strip thickness and width of wafer removed by the cutting is less than the thickness of the wafer, cutting the wafer into strips using the selected technique and separating the strips from each other. | 10-21-2010 |
Andrew William Blakers, Australian Capital Territory AU
| Patent application number | Description | Published |
|---|---|---|
| 20080223429 | Solar Cell (Sliver) Sub-Module Formation - A solar cell sub-module ( | 09-18-2008 |
| 20090308430 | Solar Cell Interconnection Process - A solar cell interconnection process for forming a solar cell sub-module for a photovoltaic device, the process including the steps of mounting a plurality of elongate solar cells ( | 12-17-2009 |
| 20100218805 | SUBSTRATE, AN ASSEMBLY PROCESS, AND AN ASSEMBLY APPARATUS - A substrate assembly ( | 09-02-2010 |
Andrew William Blakers, Kaleen Act AU
| Patent application number | Description | Published |
|---|---|---|
| 20100173441 | METHOD FOR PROCESSING ELONGATE SUBSTRATES AND SUBSTRATE SECURING APPARATUS - A method for processing elongate substrates, including forming a plurality of parallel elongate openings ( | 07-08-2010 |