Inventors list

Assignees list

Classification tree browser

Top 100 Inventors

Top 100 Assignees


Blackshear

Edmund Blackshear, Wappingers Falls, NY US

Patent application numberDescriptionPublished
20090155552IC CHIP PACKAGE SUBSTRATE HAVING OUTERMOST GLASS FIBER REINFORCED EPOXY LAYERS AND RELATED METHOD - An IC chip package having a glass reinforced outermost epoxy layers and related method are disclosed. In one embodiment, the IC chip package includes an IC chip; and a substrate coupled to the IC chip, the substrate including a glass fiber reinforced epoxy core, a plurality copper circuitry containing, particle reinforced epoxy layers symmetrically-oriented to each surface of the glass fiber reinforced epoxy core, and an outermost glass fiber reinforced epoxy layer on each surface of the plurality of layers, wherein the IC chip is coupled to copper circuitry bonded to one of the outermost glass fiber reinforced epoxy layer.06-18-2009

Edmund D. Blackshear, Wappingers Falls, NY US

Patent application numberDescriptionPublished
20090294971ELECTROLESS NICKEL LEVELING OF LGA PAD SITES FOR HIGH PERFORMANCE ORGANIC LGA - A structure comprises: a substrate; at least one conductor on the substrate; at least one contact pad on the substrate; a mask over the conductor (wherein the mask comprises an opening over the contact pad and wherein the mask comprises a bottom surface contacting the substrate and a top surface opposite the bottom surface); and a contact pad plating layer on the contact pad and within the opening of the mask. The contact pad plating layer comprises a bottom surface contacting the contact pad and a top surface opposite the bottom surface, and the top surface of the contact pad plating layer is coplanar with the top surface of the mask.12-03-2009
20100164030CHIP CARRIER BEARING LARGE SILICON FOR HIGH PERFORMANCE COMPUTING AND RELATED METHOD - Embodiments of the present invention provide a system and method for manufacturing integrated circuit (IC) chip packages. In one embodiment, the integrated circuit (IC) chip package can include an IC chip and a substrate coupled to the IC chip. The substrate can include a glass fiber re-enforced epoxy core, a plurality copper circuitry containing particle re-enforced epoxy layers symmetrically-oriented to each surface of the glass fiber re-enforced epoxy core, and an outermost amorphous glass layer on each surface of the plurality of layers. The IC chip can be coupled to copper circuitry bonded to one of the outermost amorphous glass layers.07-01-2010

Patent applications by Edmund D. Blackshear, Wappingers Falls, NY US

Perry Blackshear, Chapel Hill, NC US

Patent application numberDescriptionPublished
20100055705COMPOSITIONS AND METHODS FOR DIAGNOSING AND TREATING CANCER - The invention is drawn novel methods and compositions for the treatment of cancer, and for the diagnosis and prognosis of cancer in a subject. In particular aspects, the invention relates to the finding that the protein tristetraprolin (TTP) is decreased or repressed in a myriad and diversity of cancers. To this end, TTP represents a viable therapeutic option for the treatment of cancer. Additionally, TTP represents a clinically useful biomarker for the diagnosis and prognosis of cancer.03-04-2010

Perry J. Blackshear, Chapel Hill, NC US

Patent application numberDescriptionPublished
20090093066GLYCATED PEPTIDES AND METHODS OF USE - The invention provides glycated peptides and glycated fragments and glycated variants thereof, antibodies and aptamers which bind thereto, compositions and kits comprising the same, related conjugates, and a database comprising data indicating the concentration of glycated peptides present in diabetic and non-diabetic persons. The invention also provides a method of monitoring glycemic control, a method of treating or preventing diabetes, a method of preventing a complication of diabetes, a method of monitoring the status of diabetes, a method of determining the efficacy of a diabetes treatment, as well as methods of detecting diabetes or a predisposition thereto.04-09-2009
20110092428DETECTING AND CONTROLLING ABNORMAL HEMATOPOIESIS - A method of detecting abnormal hematopoiesis in a subject based on abnormal expression of ZFP36L2, a method of controlling hematopoiesis in a subject altering the level or activity of ZFP36L2 protein in the subject, a method of screening for compounds that modulate hematopoiesis based on changes to ZFP36L2 expression, and compounds identified thereby.04-21-2011

Patent applications by Perry J. Blackshear, Chapel Hill, NC US

Robin Blackshear, Mt. Belvieu, TX US

Patent application numberDescriptionPublished
20090211563Open fire, multi-purpose cooking grill - An open fire multipurpose cooking grill generally comprising a metal “T” shaped stake that can be optionally driven into the ground or placed into a base stand holder in positioned near a campfire, patio fire-bowl, fire-ring, or charcoal container for cooking and tending to food, generally outdoors. The cooking grill having attached to it multiple bracket sleeves allowing for quick and easy installation and removal of multiple cooking grills and food preparation trays which can be raised and lowered and swiveled side to side closer to or further from the fire as needed.08-27-2009