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Bing-Chu Du, Beijing CN

Bing-Chu Du, Beijing CN

Patent application numberDescriptionPublished
20090282781Vacuum device and method for packaging same - A method for establishing a vacuum in a container includes the following steps. The container having an exhaust through hole defined therein is provided. A sealing cover including a connecting material located on the periphery of the sealing cover is provided. The sealing cover is spaced from the exhaust through hole for forrn at least gaps between the sealing cover and the exhaust through hole. A vacuum is established in the container. The connecting material is heated. The sealing cover covers the exhaust through hole and the connecting material is cooled. After that the container is packaged.11-19-2009
20090288363VACUUM PACKAGING SYSTEM - A vacuum packaging system for packaging a vacuum apparatus includes a first accommodating room, a second container, a vacuum room, a first hatch, a second hatch, a delivery apparatus, a discharge device, and a heating apparatus. The delivery apparatus transports the vacuum apparatus from the first accommodating room to the vacuum room to the second accommodating room. The discharge device discharges a sealing element to seal an exhaust through hole of the vacuum apparatus. The heating apparatus is mounted on the inner wall of the vacuum room between the second hatch and the transport pipeline to heat and soften the sealing element.11-26-2009
20090288364VACUUM PACKAGING SYSTEM - A vacuum packaging system includes a vacuum room, a delivery apparatus, a discharge device, a second heating apparatus. The delivery apparatus transport the pre-packaged container into the vacuum room. The discharge device discharges a sealing material to seal an exhaust through hole of the pre-packaged container. The discharge device includes a vessel configured for containing sealing material, a transport pipeline, a first heating, and a controlling element. The first heating apparatus softens the sealing material into viscous liquid. The second heating apparatus is mounted on the inner wall of the vacuum room between the second hatch and the transport pipeline.11-26-2009
20090313946VACUUM DEVICE AND METHOD FOR PACKAGING SAME - A method for packaging the vacuum device includes providing a pre-packaged container having an exhaust through hole defined therein and a sealing element placed into the exhaust through hole, pumping the pre-packaged container to create a vacuum, heating and softening the sealing element to seal the exhaust through hole, and cooling the melted low-melting glass to package the pre-packaged container.12-24-2009
20110074274FIELD EMISSION CATHODE STRUCTURE AND FIELD EMISSION DISPLAY USING THE SAME - A field emission cathode structure includes a dielectric layer, a field emission unit, a grid electrode, and a conductive layer. The dielectric layer is positioned on the insulating substrate and defines a cavity. A field emission unit is attached on the cathode electrode and received in the cavity of the dielectric layer. The field emission unit is electrically attached to the cathode electrode. The grid electrode is located on the dielectric layer, and electrons emitted from the field emission unit emit through the grid electrode. The conductive layer is electrically attached to the grid electrode and insulated from the field emission unit. A field emission display device using the above-mentioned field emission cathode structure is also provided.03-31-2011
20110285271FIELD EMISSION DEVICE - A field emission device includes an insulative substrate, an electron pulling electrode, a secondary electron emission layer, a first dielectric layer, a cathode electrode, and an electron emission layer. The electron pulling electrode is located on a surface of the insulative substrate. The secondary electron emission layer is located on a surface of the electron pulling electrode. The cathode electrode is located apart from the electron pulling electrode by the first dielectric layer. The cathode electrode has a surface oriented to the electron pulling electrode and defines a first opening as an electron output portion. The electron emission layer is located on the surface of the cathode electrode and oriented to the electron pulling electrode.11-24-2011
20110287684METHOD FOR MAKING FIELD EMISSION DEVICE - A method for making a field emission device includes the following steps. An insulative substrate is provided. An electron pulling electrode is formed on the insulative substrate. A secondary electron emission layer is formed on the electron pulling electrode. A first dielectric layer is fabricated. The first dielectric layer has a second opening to expose the secondary electron emission layer. A cathode plate having an electron output portion is provided. An electron emission layer is formed on part surface of the cathode plate. The cathode plate is placed on the first dielectric layer. The electron output portion and the second opening have at least one part overlapped, and at least one part of the electron emission layer is oriented to the secondary electron emission layer via the second opening.11-24-2011
20120007490ION SOURCE - An ion source using a field emission device is provided. The field emission device includes an insulative substrate, an electron pulling electrode, a secondary electron emission layer, a first dielectric layer, a cathode electrode, and an electron emission layer. The electron pulling electrode is located on a surface of the insulative substrate. The secondary electron emission layer is located on a surface of the electron pulling electrode. The cathode electrode is located apart from the electron pulling electrode by the first dielectric layer. The cathode electrode has a surface oriented to the electron pulling electrode and defines a first opening as an electron output portion. The electron emission layer is located on the surface of the cathode electrode and oriented to the electron pulling electrode.01-12-2012

Patent applications by Bing-Chu Du, Beijing CN