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Bietsch
Alexander Bietsch, Rueschlikon CH
| Patent application number | Description | Published |
|---|---|---|
| 20090038493 | Printing in a medium - A method for transferring a pattern from an elastic stamp to a substrate in the presence of a third medium is described. A proximity contact is achieved between the stamp and the substrate. A layer of the third medium between the stamp and the substrate is controlled to a predetermined thickness. Stamps for carrying out this method are also described. | 02-12-2009 |
| 20100180782 | Printing in a Medium - A method for transferring a pattern from an elastic stamp to a substrate in the presence of a third medium is described. A proximity contact is achieved between the stamp and the substrate. A layer of the third medium between the stamp and the substrate is controlled to a predetermined thickness. Stamps for carrying out this method are also described. | 07-22-2010 |
| 20110094404 | Printing in a Medium - A method for transferring a pattern from an elastic stamp to a substrate in the presence of a third medium is described. A proximity contact is achieved between the stamp and the substrate. A layer of the third medium between the stamp and the substrate is controlled to a predetermined thickness. Stamps for carrying out this method are also described. | 04-28-2011 |
Alexander Bietsch, Ruschlikon CH
| Patent application number | Description | Published |
|---|---|---|
| 20090159200 | SPACER ELEMENT AND METHOD FOR MANUFACTURING A SPACER ELEMENT - A spacer wafer ( | 06-25-2009 |
| 20110039048 | SPACER ELEMENT AND METHOD FOR MANUFACTURING A SPACER ELEMENT - A spacer wafer for a wafer stack includes a spacer body with a first surface and a second surface, and is intended to be sandwiched between a first wafer and a second wafer. That is, the spacer is to keep a first wafer placed against the first surface and a second wafer placed against the second surface at a constant distance from each other. The spacer provides openings arranged such that functional elements of the first wafer and of the second wafer can be aligned with the openings. The spacer is formed from a forming tool by means of a shape replication process and is preferably made of a material hardened by curing. At least one of the first and second surface includes edges separating the surface from the openings, and the thickness of the spacer wafer at the edges exceeds the thickness of the spacer wafer at surface locations around the edges. | 02-17-2011 |
Michael B. Bietsch, Rio Rico, AZ US
| Patent application number | Description | Published |
|---|---|---|
| 20110167702 | GUN SIGHT ADJUSTMENT DEVICE - A device for adjusting a gun sight disposed in a dovetail groove on a gun slide is presented. The device includes a pushing member having a protrusion and an opening formed for receiving the gun sight therethrough, where the pushing member is movable in a first direction. The device further includes a pressure plate moveable in the first direction and a tail assembly opposing the pressure plate and movable in a second direction, where the tail assembly and the pressure plate are for securing the gun slide therebetween. When the gun slide is secured between the tail assembly and the pressure plate, moving the pushing member moves the gun sight. | 07-14-2011 |