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Bierhuizen

Serge Bierhuizen, Milpitas, CA US

Patent application numberDescriptionPublished
20080266900Backlight Using LED Parallel to Light Guide Surface - Various embodiments of corner-coupled backlights are described, where one or more white light LEDs are optically coupled to a truncated corner edge of a solid rectangular light guide backlight. The one or more LEDs are mounted in a small reflective cavity, whose output opening is coupled to the truncated corner of the light guide. The reflective cavity provides a more uniform light distribution at a wide variety of angles to the face of the truncated corner to better distribute light throughout the entire light guide volume. To enable a thinner light guide, the LED die is positioned in the reflective cavity so that the major light emitting surface of the LED is parallel to the top surface of the light guide. The reflective cavity reflects the upward LED light toward the edge of the light guide.10-30-2008
20080304250Thin Luminaire for General Lighting Applications - High power white light LEDs are distributed within a thin reflective cavity. The cavity depth may be less than 3 cm and, in one embodiment, is about 1 cm. A light output surface of the cavity is a flat reflector with many small openings. A small plastic lens is positioned over each opening for causing the light emitted from each opening to form a cone of light between approximately 50-75 degrees. Alternatively, each hole may be shaped to be a truncated cone to control the dispersion. The light emitted by the LEDs is mixed in the cavity by reflecting off all six reflective walls of the cavity. The light will ultimately escape through the many holes, forming a relatively uniform pattern of light on a surface to be illuminated by the luminaire.12-11-2008
20080308824Thin Flash or Video Recording Light Using Low Profile Side Emitting LED - Very thin flash modules for cameras are described that do not appear as a point source of light to the illuminated subject. Therefore, the flash is less objectionable to the subject. In one embodiment, the light emitting surface area is about 5 mm×10 mm. Low profile, side-emitting LEDs optically coupled to solid light guides enable the flash module to be thinner than 2 mm. The flash module may also be continuously energized for video recording. The module is particularly useful for cell phone cameras and other thin cameras.12-18-2008

Serge J. Bierhuizen, Milpitas, CA US

Patent application numberDescriptionPublished
20110121758TUNABLE WHITE POINT LIGHT SOURCE USING A WAVELENGTH CONVERTING ELEMENT - A uniform high brightness light source is provided using a plurality of light emitting diode (LED) chips with slightly different pump wavelengths with a wavelength converting element that includes at least two different wavelength converting materials that convert the light to different colors of light. The intensity of the light produced by the LED chips may be varied to provide a tunable CCT white point. The wavelength converting element may be, e.g., a stack or mixture of phosphor or luminescent ceramics. Moreover, the manufacturing process of the light source is simplified because the LED chips are all manufactured using the same technology eliminating the need to manufacture different types of chips.05-26-2011

Patent applications by Serge J. Bierhuizen, Milpitas, CA US

Serge J. Bierhuizen, Fremont, CA US

Patent application numberDescriptionPublished
20110233565HYBRID COMBINATION OF SUBSTRATE AND CARRIER MOUNTED LIGHT EMITTING DEVICES - A multi-chip light emitting device (LED) uses a low-cost carrier structure that facilitates the use of substrates that are optimized to support the devices that require a substrate. Depending upon the type of LED elements used, some of the LED elements may be mounted on the carrier structure, rather than on the more expensive ceramic substrate. In like manner, other devices, such as sensors and control elements, may be mounted on the carrier structure as well. Because the carrier and substrate structures are formed independent of the encapsulation and other after-formation processes, these structures can be tested prior to encapsulation, thereby avoiding the cost of these processes being applied to inoperative structures.09-29-2011