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Biar
Jeff Biar, Taipei County TW
| Patent application number | Description | Published |
|---|---|---|
| 20100164058 | CHIP PACKAGE WITH STACKED INDUCTORS - A semiconductor chip package with inductors includes a substrate, a semiconductor chip, an inductor and an insulator cover. The substrate has an active surface with a patterned circuit thereon. The inductor disposes on the active surface of the substrate. The semiconductor chip stacks over the inductor and electrically interconnects with the patterned circuit of the substrate and the inductor. The insulator cover encapsulates the inductor and the chip. | 07-01-2010 |
| 20100259350 | INDUCTOR OR TRANSFORMER FOR MICROELECTRIC SYSTEM - A microinductor comprises an insulating substrate, a lower conductive winding, an upper conductive winding, and a core. The lower conductive winding is disposed on an upper surface of the substrate. The core is made of a material with high permeability and stacked over the lower conductive winding. The upper conductive winding is disposed on an upper surface of the core. The upper conductive winding electrically interconnects with the lower conductive winding so as to form an inductor coil. | 10-14-2010 |
| 20110127191 | METHOD OF PREVENTING ELECTRONIC COMPONENT FROM DAMAGE DURING TRANSPORTATION AND TRAYMADE BASED ON THE METHOD - A method includes the steps of preparing a tray having at least one chamber with an opening facing upward; placing at least one electronic component in the chamber; filling the chamber with a liquid that does not react with the at least one electronic component; and sealing the chamber. In light of this, when the electronic component having any kind of shape is placed in the chamber, the space for movement of the electronic component is limited, so that the electronic component is not subject to damage incurred by collision during transportation. In light of this, the chances of damaging the electronic component during transportation can be effectively decreased. | 06-02-2011 |
| 20110140210 | MICROELECTROMECHANICAL SENSOR DEVICE PACKAGE AND METHOD FOR MAKING THE SAME - A microelectromechanical sensor device package includes a substrate, a microelectromechanical sensor device and a cap. The substrate has a surface on which a circuit pattern having a plurality of first conductive contacts is provided. The device is mounted on the surface of the substrate and has an active surface on which a plurality of second conductive contacts are provided. A plurality of bonding wires are used to electrically connect the first conductive contacts to the second conductive contacts respectively. The cap is made of an electrically insulating material and attached on the surface of the substrate in a way that the cap covers the microelectromechanical sensor device and a space is formed between the cap and the microelectromechanical sensor device. | 06-16-2011 |
| 20110141747 | BULB FOR ELECTRIC LAMP - A bulb for an electric lamp having a light-emitting element includes a light transmittable shell body for housing the light-emitting element. The light transmittable shell body includes an accommodation for receiving the light-emitting element of the electric lamp, and an inner surface surrounding the accommodation. On the inner surface of the light transmittable shell body a plurality of light-guiding portions are provided for guiding the light emitted from the light-emitting element towards an outside of the light transmittable shell body. | 06-16-2011 |
Jeff Biar, Hsinchu City TW
| Patent application number | Description | Published |
|---|---|---|
| 20080224299 | BASE SUBSTRATE FOR CHIP SCALE PACKAGING - A base substrate for chip scale package includes a carrier member made of electrical conductive metals with a first through opening; an active member laminated by a base layer made of electrical conductive metal and an intermediate layer made of electrical insulating or dielectric material, the active member having a through opening with a diameter larger that the diameter of the through opening of the base metal member; the active member being coupled with the carrier member in such a way that the intermediate layer is adhered to an upper surface of the carrier member, and these through openings are aligned to define a shoulder around the through opening of the base metal plate. | 09-18-2008 |
| 20080248270 | SUBSTRATE FOR THIN CHIP PACKAGINGS - A substrate for chip packaging comprises a carrier layer, an etching stopper and an active layer. The carrier layer is made of a conductive metal sheet with a predetermined thickness. The etching stopper is disposed on a side of the carrier layer. The active layer is made of conductive metal materials and disposed on a free side of the etching stopper in a wiring pattern formed by an etching process operating on the active layer. | 10-09-2008 |
Jin-Chyuan Biar, Taipei Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20080265271 | LIGHT-EMITTING ELEMENT PACKAGE AND LIGHT SOURCE APPARATUS USING THE SAME - A light-emitting element package including a heat conductive layer having a first surface and a second surface, a dielectric layer disposed on the first surface of the heat conductive layer and having an opening exposing the heat conductive layer, two electrodes disposed on the dielectric layer at a side far away from the heat conductive layer, a light-emitting element, and a transparent sealing layer. The light-emitting element is disposed in the opening, carried on the first surface of the heat conductive layer, and electrically coupled to the two electrodes. The transparent sealing layer encapsulates the light-emitting element, the heat conductive layer, and the two electrodes, and exposes part of the two electrodes and the second surface of the heat conductive layer. | 10-30-2008 |
Jin-Chyuan Biar, Hsinchu City TW
| Patent application number | Description | Published |
|---|---|---|
| 20080265356 | CHIP SIZE IMAGE SENSING CHIP PACKAGE - An image sensing chip package includes an image sensing chip having an image sensor disposed on a circuit side thereof that includes electrical conductive pads. A glue layer is applied to the circuit side and around the image sensor. A flexible film wraps the chip in such a way that an inner surface of the film faces the circuit side of the chip, an opening thereof corresponds to the image sensor, an area of the inner surface near the edges of the opening attaches to the glue layer, an inner end of each of conductors disposed on the inner surface of said film bonds to each of the electrical conductive pads, and an outer end of each of the conductors is exposed to connect with other electrical elements. A light transparent member is disposed on an outer surface of the film to seal the opening of the film. | 10-30-2008 |
| 20080265388 | ULTRA THIN IMAGE SENSING CHIP PACKAGE - An ultra thin image sensing chip package includes an image sensing chip and a flexible and optically transparent film. The chip has an image sensor and a plurality of electrical conductive pads. The flexible and optically transparent film includes a transparent window, and a pattern of conductors formed on a surface thereof and around the transparent window. The film wraps the chip in such a way that the transparent window thereof corresponds to the image sensor of the chip, a sealed space is formed between the transparent window and the image sensor, one end of each of the conductors of the film bonds to each of the electrical conductive pads of the chip, and the other end of each of the conductors of the film is opened so as to electrically connect with other electrical elements. | 10-30-2008 |