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Bian, US
Brian Bian, Portland, OR US
| Patent application number | Description | Published |
|---|---|---|
| 20120030584 | METHOD AND APPARATUS FOR DYNAMICALLY SWITCHING BETWEEN SCALABLE GRAPHICAL USER INTERFACES FOR MOBILE DEVICES - A method, apparatus and system enable mobile platforms to dynamically switch between scalable graphical user interfaces. Mobile device users may couple their mobile devices to computing platforms with larger display devices. Upon detection of the larger display device, the mobile platform may select an appropriate user interface scheme to display the content on the larger display device. | 02-02-2012 |
Jiang Bian, Atlanta, GA US
| Patent application number | Description | Published |
|---|---|---|
| 20120011112 | RANKING SPECIALIZATION FOR A SEARCH - Example methods, apparatuses, and articles of manufacture are disclosed that may be used to provide or otherwise support one or more ranking specialization techniques for use with search engine information management systems. | 01-12-2012 |
Jinru Bian, Newark, DE US
| Patent application number | Description | Published |
|---|---|---|
| 20090031636 | Polymeric barrier removal polishing slurry - The aqueous slurry is useful for chemical mechanical polishing a semiconductor substrate having copper interconnects. The slurry contains by weight percent, 0 to 25 oxidizing agent, 0.1 to 50 abrasive particles, 0.001 to 5 polyvinyl pyrrolidone, 0.00002 to 5 multi-component surfactant, the multi-component surfactant having a hydrophobic tail, a nonionic hydrophilic portion and an anionic hydrophilic portion, the hydrophobic tail having 6 to 30 carbon atoms and the nonionic hydrophilic portion having 10 to 300 carbon atoms, 0.001 to 10 inhibitor for decreasing static etch of the copper interconnects, 0 to 5 phosphorus-containing compound for increasing removal rate of the copper interconnects, 0.001 to 10 complexing agent formed during polishing and balance water. | 02-05-2009 |
| 20090032765 | Selective barrier polishing slurry - The aqueous slurry is useful for chemical mechanical polishing a semiconductor substrate having copper interconnects. The slurry contains by weight percent, 0 to 25 oxidizing agent, 0.1 to 30 abrasive particles, 0.001 to 5 benzenecarboxylic acid, 0.00002 to 5 multi-component surfactant, the multi-component surfactant having a hydrophobic tail, a nonionic hydrophilic portion and an anionic hydrophilic portion, the hydrophobic tail having 6 to 30 carbon atoms and the nonionic hydrophilic portion having 10 to 300 carbon atoms, 0.001 to 10 inhibitor for decreasing static etch of the copper interconnects, 0 to 5 phosphorus-containing compound for increasing removal rate of the copper interconnects, 0 to 10 complexing agent formed during polishing and balance water. | 02-05-2009 |
| 20090280724 | Method for Polishing Semiconductor Layers - The aqueous polishing method is useful for polishing semiconductor substrates including a TEOS layer and a SiOC layer. The method removes TEOS with a polishing composition having 0.05 to 50 weight percent abrasive, 0.001 to 2 weight percent lambda type carrageenan and an anionic surfactant. The lambda type carrageenan has a concentration useful for accelerating TEOS removal rate; and the anioinic surfactant is useful for suppressing removal rate of the SiOC layer. | 11-12-2009 |
| 20100159807 | Polymeric barrier removal polishing slurry - The aqueous slurry is useful for chemical mechanical polishing semiconductor substrates having copper interconnects. The slurry includes by weight percent, 0 to 25 oxidizing agent, 1 to 50 abrasive particles, 0.001 to 10 inhibitor for decreasing static etch of the copper interconnects, 0.001 to 5 poly(methyl vinyl ether) having a formula as follows: | 06-24-2010 |
| 20110318928 | Polymeric Barrier Removal Polishing Slurry - The invention provides a aqueous slurry useful for chemical mechanical polishing a semiconductor substrate having copper interconnects. The slurry comprises by weight percent, 0 to 25 oxidizing agent, 0.1 to 50 abrasive particles, 0.001 to 10 inhibitor for decreasing static etch of the copper interconnects, 0.001 to 5 poly(methyl vinyl ether) having a formula as follows: | 12-29-2011 |
Kejian Bian, Bethlehem, PA US
| Patent application number | Description | Published |
|---|---|---|
| 20080272331 | Hybrid nanoparticles - A method and composition for making hybrid nanoparticles and use of such nanoparticles are disclosed herein. In one embodiment of the invention, the hybrid nanoparticles comprise a phase change material (PCM) and a metal layer encapsulating the phase change material. In another embodiment of the invention, the hybrid nanoparticles comprise a phase change material, a polymer layer encapsulating the phase change material, and an outer metal layer encapsulating the polymer layer. In another embodiment of the invention, the hybrid nanoparticles comprise an inner core of a PCM encapsulated by a polymer shell containing embedded nanoparticles that have a high thermal conductivity. | 11-06-2008 |
Li Ming Bian, New York, NY US
| Patent application number | Description | Published |
|---|---|---|
| 20100036492 | OSTEOCHONDRAL IMPLANTS, ARTHROPLASTY METHODS, DEVICES, AND SYSTEMS - Implants for resurfacing or repairing one or more articular cartilage bearing surfaces of a biological organism include an engineered tissue and a biocompatible porous substrate secured to the engineered tissue for attaching the implant to a native bone of the biological organism. The engineered tissue includes a scaffold containing a biocompatible material, and a plurality of living chondrocytes supported by the scaffold. Methods for culturing chondrocytes for incorporation into a biocompatible implant are provided. A bioreactor for producing functional cartilaginous tissue from a cell-seeded scaffold and a system for producing functional cartilaginous tissue are also provided. | 02-11-2010 |
Long Xiang Bian, Sharon, MA US
| Patent application number | Description | Published |
|---|---|---|
| 20080245873 | Parcel dimensioning measurement system and method - A parcel dimension measurement system includes image sensors oriented to image a parcel, an imaging subsystem configured to stitch together outputs of the image sensors to produce at least one two-dimensional image comprised of a plurality of pixels, and a general dimension subsystem including general parcel dimension information. A fine dimensioning subsystem is configured to determine dimension measurements of the parcel using the at least one two-dimensional image and the general parcel dimension information. | 10-09-2008 |
Nanying Bian, Nashua, NH US
| Patent application number | Description | Published |
|---|---|---|
| 20090246885 | Media for affinity chromatography - The invention relates generally to solid supports for chromatography. In specific embodiments the invention provides for solid supports suitable for affinity chromatography along with methods, systems and kits which use the same. | 10-01-2009 |
| 20100063261 | Affinity chromatography matrices and methods of making and using the same - The invention provides methods of coupling protein ligands to a solid support. The invention also provides affinity chromatography matrices and methods of using affinity chromatography matrices to purify a target molecule. | 03-11-2010 |
| 20100174051 | Asymmertric porous adsorptive bead - The present invention relates to an asymmetric chromatography media suitable for separations applications, particularly as packed bed, fluidized bed or magnetized bed chromatography media. In certain embodiments, the asymmetric chromatography media comprises asymmetric particles, preferably beads, having at least two distinct, controlled pore size distributions. Preferably one of the distinct pore size distributions is in an internal region of the particle, and the other is in an external region or coating on the particle. These distinct pore size distributions can be modified with uniform or alternatively unique functional groups or mixtures of functional groups. The present invention allows for the control over pore size distribution within an asymmetric porous particle by providing a distinct internal region, preferably in the form of a bead, and a distinct external region, preferably in the form of a coating on the bead. | 07-08-2010 |
| 20100227015 | Method and apparatus for making porous agarose beads - The present invention relates to a method and apparatus for forming agarose or cored agarose beads. The process involves dissolving/gelation the agarose in a suitable liquid, mixing it with a hydrophobic liquid to form an emulsion and maintaining that emulsion at a temperature equal to or greater than the gelation point of the agarose, passing it through a static mixer to create agarose droplets and solidifying the agarose droplets in a second bath of hydrophobic liquid. The beads can then be washed and used or further processed to crosslink the agarose and/or add various functionalities on to the agarose. Another method for solidifying the agarose droplets is by using a heat exchanger to cool the stream continuously after it exits the static mixer. A similar process is used for the “cored” beads except cores, preferably in bead form, are introduced to the agarose before it enters the first hydrophobic liquid so that the agarose forms a coating on the cores. A similar process with either agarose beads (made by this or another process) or cored agarose (made by this or another process) can be used to add multiple layers of agarose on to the existing beads. An apparatus for running the process is also disclosed. | 09-09-2010 |
| 20110105730 | AFFINITY CHROMATOGRAPHY MATRICES AND METHODS OF MAKING AND USING THE SAME - The invention provides methods of coupling protein ligands to a solid support. The invention also provides affinity chromatography matrices and methods of using affinity chromatography matrices to purify a target molecule. | 05-05-2011 |
Nanying Bian, Lexington, MA US
| Patent application number | Description | Published |
|---|---|---|
| 20100112597 | Methods for Quantifying Protein Leakage From Protein Based Affinity Chromatography Resins - The present invention provides methods of quantifying protein leakage from a protein based affinity chromatography media (e.g., protein A, protein G and protein L based affinity chromatography media), where such a protein is used for isolating and/or removing a molecule which binds the protein (e.g., an immunoglobulin). | 05-06-2010 |
| 20100221844 | Caustic stable chromatography ligands - The present invention relates to chromatography ligands having improved caustic stability, e.g., ligands based on immunoglobulin-binding proteins such as, | 09-02-2010 |
Zailong Bian, Manassas, VA US
| Patent application number | Description | Published |
|---|---|---|
| 20110241096 | ISOLATION REGIONS - Methods and apparatus are provided. An isolation region is formed by lining a trench formed in a substrate with a first dielectric layer by forming the first dielectric layer adjoining exposed substrate surfaces within the trench using a high-density plasma process, forming a layer of spin-on dielectric material on the first dielectric layer so as to fill a remaining portion of the trench, and densifying the layer of spin-on dielectric material. | 10-06-2011 |
Zailong Bian, Boise, ID US
| Patent application number | Description | Published |
|---|---|---|
| 20100248472 | Methods Of Forming Copper-Comprising Conductive Lines In The Fabrication Of Integrated Circuitry - A method of forming copper-comprising conductive lines in the fabrication of integrated circuitry includes depositing damascene material over a substrate. Line trenches are formed into the damascene material. Copper-comprising material is electrochemically deposited over the damascene material. The copper-comprising material is removed and the damascene material is exposed, and individual copper-comprising conductive lines are formed within individual of the line trenches. The damascene material is removed selectively relative to the conductive copper-comprising material. Dielectric material is deposited laterally between adjacent of the individual copper-comprising conductive lines. The deposited dielectric material is received against sidewalls of the individual copper-comprising conductive lines. A void is received laterally between immediately adjacent of the individual copper-comprising conductive lines within the deposited dielectric material. Other embodiments are contemplated. | 09-30-2010 |
| 20100276780 | Memory Arrays - The invention includes semiconductor constructions having trenched isolation regions. The trenches of the trenched isolation regions can include narrow bottom portions and upper wide portions over the bottom portions. Electrically insulative material can fill the upper wide portions while leaving voids within the narrow bottom portions. The trenched isolation regions can be incorporated into a memory array, and/or can be incorporated into an electronic system. The invention also includes methods of forming semiconductor constructions. | 11-04-2010 |
| 20120019349 | CONFINED RESISTANCE VARIABLE MEMORY CELLS AND METHODS - Methods, devices, and systems associated with resistance variable memory device structures are described herein. In one or more embodiments, a method of forming a confined resistance variable memory cell structure includes forming a resistance variable material such that a first unmodified portion of the resistance variable material contacts a bottom electrode and a second unmodified portion of the resistance variable material contacts a top electrode. | 01-26-2012 |