| Patent application number | Description | Published |
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| 20090276359 | Multi-Product-Multi-Channel Payment Platform System and Method - Described herein is a multi-product-multi-channel payment platform system and apparatus that extends the capability of current online banking/funds-transfer systems. Different types of financial accounts are modeled in a financial management system to enable types of online, electronic funds transfer transaction that were not previously possible. Among novel elements of the system and apparatus disclosed is the enablement of real-time application of rules to different types of financial accounts and/or products across channels, such as how much money may be deposited or withdrawn in a period of time. | 11-05-2009 |
| 20100042538 | Money Movement Network Method - Embodiments of the invention include an electronic payment system that allows person-to-person (P2P) payments and requests for payment, consumer-to-consumer (C2C) payments and requests for payment, and use of a P2P service by a business which in turn offers the service to its customers for making payments and requests for payment. The system and service allow users to make payments from their existing financial accounts to anyone, anywhere without funding a special account and managing a third-party relationship separate from the relationship the user has with the financial institution. The service further allows users to receive payments without registering for a third-party service. In embodiments, the service is available as an integrated banking service alongside current financial institution electronic banking services already used by customers. A bank customer can use the payment service directly from within a bank or bank web site. | 02-18-2010 |
| 20100042539 | Money Movement Network Hub System - Embodiments of the invention include an electronic payment system that allows person-to-person (P2P) payments and requests for payment, consumer-to-consumer (C2C) payments and requests for payment, and use of a P2P service by a business which in turn offers the service to its customers for making payments and requests for payment. The system and service allow users to make payments from their existing financial accounts to anyone, anywhere without funding a special account and managing a third-party relationship separate from the relationship the user has with the financial institution. The service further allows users to receive payments without registering for a third-party service. In embodiments, the service is available as an integrated banking service alongside current financial institution electronic banking services already used by customers. A bank customer can use the payment service directly from within a bank or bank web site. | 02-18-2010 |
| 20110264583 | INTER-NETWORK INVOICING PAYMENT METHOD AND SYSTEM - An inter-bank email and mobile invoicing network is disclosed. Embodiments disclosed herein include an inter-bank email and mobile invoicing network that enables customers of banks or independent portals to send invoices to an email address or mobile phone number. The invoice can be received by the recipient within their bank's online or mobile banking site, in the case of banks that belong to a network that is managed by the proprietors of a financial management system and payment hub as disclosed herein. These banks will be referred to as “network banks” herein. The inter-bank invoicing network also refers to a common provider or connected providers of an invoicing and payment service that is linked to banks and to independent service providers. | 10-27-2011 |
| Patent application number | Description | Published |
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| 20100108133 | Thin Film Semiconductor Photovoltaic Device - A substantially transparent substrate having first and second major surfaces and a plurality of side surfaces; a thin-film semiconductor layer coupled to the first major surface of the substrate and including first and second major surfaces and at least one photo-sensitive p-n junction therein; and a light directing feature operable to cause incident light to propagate through the substrate and into the semiconductor layer in a waveguide mode such that the light reflects a plurality of times between the first and second major surfaces of the semiconductor layer and impinges upon the p-n junction a plurality of times | 05-06-2010 |
| 20100129647 | Method of Weldbonding and a Device Comprising Weldbonded Components - A method of assembling optoelectronic and/or photonic components, said method comprising: (i) providing at least two optoelectronic and/or photonic components; (ii) aligning and situating these components relative to one another and in close proximity with one another so as to: (a) provide optical coupling between these components; and (b) maintain the distance d between the adjacent parts of these components, where d is 0 to 100 μm; (iii) adhering these components to one another with while maintaining optical coupling therebetween; and (iv) laser welding these components together while maintaining optical coupling therebetween. | 05-27-2010 |
| 20100154877 | Semiconductor Core, Integrated Fibrous Photovoltaic Device - A cane having optical properties includes: a core formed of a semiconductor material; and a transparent cladding formed of glass, glass-ceramic, or polymer coaxially oriented about the core, the cane may be used to produce a photovoltaic device, including: a semiconductor core including at least one p-n junction, defined by respective n-type and p-type regions; a substantially transparent cladding in coaxial relationship with the semiconductor core, forming a longitudinally oriented cane; and first and second electrodes, each being electrically coupled to a respective one of the n-type and p-type regions. | 06-24-2010 |
| 20100159242 | Semiconductor Core, Integrated Fibrous Photovoltaic Device - A cane having optical properties includes: a core formed of a semiconductor material; and a transparent cladding formed of glass, glass-ceramic, or polymer coaxially oriented about the core, the cane may be used to produce a photovoltaic device, including: a semiconductor core including at least one p-n junction, defined by respective n-type and p-type regions; a substantially transparent cladding in coaxial relationship with the semiconductor core, forming a longitudinally oriented cane; and first and second electrodes, each being electrically coupled to a respective one of the n-type and p-type regions. | 06-24-2010 |
| 20100303109 | Proximity Coupled Athermal Optical Package Comprising Laser Source And Compound Facet Wavelength Conversion Device - Particular embodiments of the present disclosure bring an SHG crystal, or other type of wavelength conversion device, into close proximity with a laser source to eliminate the need for coupling optics, reduce the number of package components, and reduce package volume. According to one embodiment of the present disclosure, an optical package is provided comprising a laser source and a wavelength conversion device. The laser source is positioned such that the output face of the laser source is proximity-coupled to a waveguide portion of the input face of the wavelength conversion device. The input face of the wavelength conversion device comprises an α-cut facet and β-cut facet. The α-cut facet of the input face is oriented at a horizontal angle α, relative to the waveguide of the wavelength conversion device to permit proximity coupling of the output face of the laser source and the input face of the wavelength conversion device. The β-cut facet of the input face is oriented at a horizontal angle β, relative to the waveguide of the wavelength conversion device to cooperate with the horizontal tilt angle of the device to reduce back reflections from the input face of the wavelength conversion device into the laser source. Additional embodiments are disclosed. | 12-02-2010 |
| 20100303110 | Edge Bonded Optical Packages - Particular embodiments of the present disclosure bring an SHG crystal, or other type of wavelength conversion device, into close proximity with a laser source to eliminate the need for coupling optics, reduce the number of package components, and reduce package volume. According to one embodiment of the present disclosure, an optical package is provided comprising a laser source subassembly comprising a laser base and a wavelength conversion device subassembly comprising a converter base. The bonding interface of the laser base is bonded the complementary bonding interface of the converter base such that the laser output face can be proximity-coupled to the converter input face at an predetermined interfacial spacing x. Additional embodiments are disclosed and claimed. | 12-02-2010 |
| 20110069929 | Methods for Passively Aligning Opto-Electronic Component Assemblies on Substrates - A method for aligning an opto-electronic component assembly (OECA) on a substrate includes positioning a substrate on an assembly surface and positioning an OECA on the substrate such that a first OECA alignment face projects from a first substrate alignment face. The substrate and the OECA are advanced towards a contact face of a first assembly alignment mechanism such that the first substrate alignment face contacts the contact face of the first assembly alignment mechanism after the first OECA alignment face contacts the contact face. The OECA is displaced relative to the first substrate alignment face when the first OECA alignment face contacts the contact face and the substrate continues to move towards the contact face thereby aligning the OECA on the substrate relative to the first substrate alignment face. | 03-24-2011 |
| 20110129189 | CLAD METAL SUBSTRATES IN OPTICAL PACKAGES - Embodiments of the present disclosure bring a wavelength conversion device into close proximity with a laser source to eliminate the need for coupling optics, reduce the number of package components, and reduce package volume. According to one embodiment of the present disclosure, an optical package is provided comprising a laser diode chip and a clad metal substrate. The clad metal substrate comprises a clad metal region that is mechanically coupled to a base metal region. The laser diode chip is coupled to the clad metal region. The clad metal region comprises a clad metal material having a thermal conductivity that is greater than a thermal conductivity of the base metal material. The clad metal region further comprises a coefficient of thermal expansion that is approximately equal to a coefficient of thermal expansion of the base metal material and is greater than a coefficient of thermal expansion of the laser diode chip. | 06-02-2011 |
