| Patent application number | Description | Published |
|---|
| 20090039140 | Solder Mold With Venting Channels - A solder mold for transferring solder to a wafer includes a substrate, a plurality of solder cavities for holding solder, and a plurality of ventilation channels formed between the plurality of solder cavities. | 02-12-2009 |
| 20090039142 | Method for Forming a Solder Mold with Venting Channels and Method for Using the Same - A method for forming a solder mold for transferring solder to a wafer includes etching a plurality of solder cavities into a substrate. A plurality of ventilation channels are etched on the substrate connecting the plurality of solder cavities. | 02-12-2009 |
| 20090283244 | Stacked and Redundant Chip Coolers - A cooler includes a base layer, a cooling layer including at least one inlet slot and at least one outlet slot for flowing a coolant across a cooling structure including a plurality of staggered fins arranged in rows and columns, wherein fins of adjacent columns are staggered, and at least one manifold layer disposed on the cooling layer for flowing the coolant from a cooler inlet to the at least inlet slot and from the at least one outlet slot to a cooler outlet, the at least one manifold layer having a top layer comprising the cooler inlet and the cooler outlet. | 11-19-2009 |
| 20090283902 | Semiconductor Package Structures Having Liquid Coolers Integrated with First Level Chip Package Modules - Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include structures in which a liquid cooler device is thermally coupled directly to the back side of an integrated circuit chip flip-chip mounted on flexible chip carrier substrate. The liquid cooler device is mechanically coupled to the package substrate through a metallic stiffener structure that is bonded to the flexible package substrate to provide mechanical rigidity to the flexible package substrate. | 11-19-2009 |
| 20100012294 | Structure and Apparatus for Cooling Integrated Circuits Using Cooper Microchannels - A cooler having a unitary construction including a channel portion including a plurality of fins on a base, the plurality of fins defining a plurality of microchannels therebetween, a tapered opening formed in a set of the plurality of fins, a manifold portion disposed on an edge portion of the base, the manifold portion including an inlet port and an outlet port disposed above the tapered opening in the plurality of fins, and a separator sheet including at least two elongated openings disposed between the channel portion and the manifold portion. | 01-21-2010 |
