Patent application number | Description | Published |
20080266510 | Liquid crystal display device - In a liquid crystal display device which has a pair of opposing substrates having a gap filled with a liquid crystal material, with a peripheral edge portion of the paired substrates being sealed by a sealing member, between the thickness (t | 10-30-2008 |
20090244040 | PLASMA DISPLAY PANEL, DRIVING METHOD OF PLASMA DISPLAY PANEL, AND PLASMA DISPLAY APPARATUS - The present invention provides a technique relating to a PDP and capable of canceling or reducing luminance unevenness due to voltage drop or the like. In a structure of the PDP, for example, two types of cells different in discharge timing are arranged in a zigzag manner on a screen. For example, the two types of cells have different discharge gap lengths because of a difference in areas and lengths of projections of electrodes of the respective cells. By the dispersion of discharge timings of cells, the voltage drop or the like is reduced. The design characteristic obtained by the arrangement pattern is superimposed on panel manufacture characteristic, whereby luminance unevenness is cancelled or reduced in display characteristic. | 10-01-2009 |
20100194727 | PLASMA DISPLAY DEVICE - In a plasma display device, a temperature-monitoring electrode for monitoring a panel temperature is parallely arranged with at least either one of a display electrode and a scan electrode, or an address electrode in a PDP. And, a resistance-value monitoring circuit for monitoring a resistance value of the temperature-monitoring electrode is connected to the temperature-monitoring electrode, and further, a temperature-converting circuit for converting the resistance value monitored by the resistance-value monitoring circuit into a temperature is connected to the resistance-value monitoring circuit. And, respective driver drives respective electrode with applying a driving waveform and/or a driving voltage suitable for the temperature converted by the temperature-converting circuit, so that a useless margin design is unnecessary, and as a result, a performance in a normal-use situation can be improved. | 08-05-2010 |
20100289726 | PLASMA DISPLAY PANEL AND ITS MANUFACTURING METHOD - A protective film ( | 11-18-2010 |
20110001427 | PLASMA DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME, AND DISCHARGE STABILIZER POWDER - A technique for achieving both discharge voltage reduction and discharge stabilization in a PDP and the like is provided. This PDP manufacturing method includes, for a structure of a front plate structure ( | 01-06-2011 |
20110018786 | PLASMA DISPLAY PANEL AND PLASMA DISPLAY DEVICE - There is provided a technique for discharge stabilization of a plasma display panel by forming magnesium oxide with a large diameter and adjusting residual amounts of impurities contained in the magnesium oxide. That is, discharge stabilization material particle, which is coated on a protective-film layer of protecting electrodes and supplies sufficient amount of priming particles into a discharge gap, is focused. By setting each impurity concentration in the magnesium oxide used as the discharge stabilization material particle to 20 ppm or lower, discharge time lag is suppressed. | 01-27-2011 |
20130341508 | THREE-DIMENSIONAL IMAGE PROJECTOR - A three-dimensional image projector, including a transparent display medium within which fluorescent substances are dispersed, the fluorescent substances being dispersed for performing the fluorescent light-emission of visible light by the irradiation with a laser beam of invisible light, a first-laser-beam scanning unit for scanning the inside of the transparent display medium by deflecting a first laser beam, the first laser beam being used for exciting the fluorescent substances, and a second-laser-beam scanning unit for scanning the inside of the transparent display medium by deflecting a second laser beam, the second laser beam being used for exciting the fluorescent substances, wherein a stereoscopic image is formed at a scanning intersection point of the first laser beam and the second laser beam inside the transparent display medium. | 12-26-2013 |
Patent application number | Description | Published |
20090230551 | SEMICONDUCTOR DEVICE - The reliability of a semiconductor device which has the semiconductor components which were mounted on the same surface of the same substrate via the bump electrodes with which height differs, and with which package structure differs is improved. | 09-17-2009 |
20110033983 | SEMICONDUCTOR DEVICE - The reliability of a semiconductor device which has the semiconductor components which were mounted on the same surface of the same substrate via the bump electrodes with which height differs, and with which package structure differs is improved. | 02-10-2011 |
20130128647 | DATA PROCESSING DEVICE - A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board. | 05-23-2013 |
20140160826 | DATA PROCESSING DEVICE - A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board. | 06-12-2014 |
20150036406 | DATA PROCESSING DEVICE - A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board. | 02-05-2015 |
Patent application number | Description | Published |
20120079238 | DATA PROCESSING DEVICE - A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board. | 03-29-2012 |
20140097547 | SEMICONDUCTOR DEVICE - This invention is to improve noise immunity to the power supply and ground of a wiring board and a second semiconductor chip in an interior of a semiconductor device. A first semiconductor chip is mounted over a wiring board, and a second semiconductor chip is mounted in a central part located over the first semiconductor chip. Bottom surface electrodes of power and ground systems in the second semiconductor chip are led to their corresponding external coupling electrodes formed in the central part of the wiring board though chip through vias formed in the central part of the first semiconductor chip. The power and ground system bottom surface electrodes, the through vias and the external coupling electrodes are respectively arranged discretely from each other between the power and ground systems. | 04-10-2014 |
20140284818 | SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE - Provided is a semiconductor chip that is flip-chip mounted where an inner chip pad array and an outer chip pad array, which are arranged on an inner side and an outer side of IO cells in a staggered manner, are arranged to be spaced away from each other by a predetermined gap or greater. The predetermined gap represents a gap where one via can be arranged between an inner substrate pad array and an outer substrate pad array on a substrate which faces and is connected to the inner chip pad array and the outer chip pad array. In addition, the predetermined gap represents a gap where a plated wire is interconnected and then a resist opening for etch-back can be formed. Even in a case where a space for forming an interconnection is not present between outer substrate pad arrays, interconnection characteristics of the substrate are improved. | 09-25-2014 |