| Patent application number | Description | Published |
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| 20080260505 | CARRIER FOR CARRYING A PACKAGED CHIP AND HANDLER EQUIPPED WITH THE CARRIER - A carrier for carrying a packaged chip includes a housing having a holding space and at least one guiding hole. A guiding block ascends and descends along the guiding hole. A latch moves backwards and forwards as the guiding block ascends and descends to move into and out of the holding space. | 10-23-2008 |
| 20080260976 | CARRIER FOR CARRYING A PACKAGED CHIP AND HANDLER EQUIPPED WITH THE CARRIER - A carrier for carrying a packaged chip includes a housing having a space into which the packaged chip is placed and at least one guiding hole formed between outside and inside lateral surfaces thereof A moving block moves along the guiding hole and engages with a latch, which is also provided in the guiding hole. The latch rotates to hold and release a packaged chip placed into the space. Corresponding steps on the moving block and the latch prevent the latch from rotating when the moving block makes small movements caused by jolts or shocks. | 10-23-2008 |
| 20090153168 | HI-FIX BOARD, TEST TRAY, TEST HANDLER, AND METHOD FOR MANUFACTURING PACKAGED CHIPS - A hi-fix board, a test tray, a test handler, and a packaged chip manufacturing method are provided. The hi-fix board includes: test sockets to which packaged chips to be tested are connected; and a main frame in which the test sockets are disposed in at least one first area to form an a×b matrix (where a and b are integers greater than 0) and the test sockets are disposed in at least one second area to form a c×d matrix (where c is an integer greater than a and d is an integer greater than 0). By allowing the test tray to contain more packaged chips at a time and minimizing a difference in length between a horizontal direction and a vertical direction, it is possible to reduce the index time. By allowing all the packaged chips contained in a test tray to be subjected to a testing process at the same time, it is possible to reduce the time for the testing process and to enhance the stability. | 06-18-2009 |
| 20090167294 | TEST HANDLER, METHOD FOR LOADING AND MANUFACTURING PACKAGED CHIPS, AND METHOD FOR TRANSFERRING TEST TRAYS - A test handler, a packaged chip loading method, a test tray transferring method, and a packaged chip manufacturing method are provided. The test handler may include a loading unit, a chamber system, an unloading unit, at least one rotating unit and a transferring unit. The loading unit may include a loading buffer disposed to be movable along a moving path formed over a loading position and a loading picker to perform a loading process on the test tray located at the loading position. The chamber system having the packaged chips connected to a hi-fix board and tested. The unloading unit may include an unloading picker to perform an unloading process on the test tray located at an unloading position. The at least one rotating unit may be disposed between the loading unit and the unloading unit to rotate the test tray transferred from the loading unit from a horizontal posture to a vertical posture, and to rotate the test tray transferred from the chamber system from a vertical posture to a horizontal posture. The transferring unit may transfer the test tray. | 07-02-2009 |
| 20090261817 | TEST HANDLER, METHOD OF UNLOADING AND MANUFACTURING PACKAGED CHIPS AND METHOD FOR TRANSFERRING TEST TRAYS - A test handler, a method for unloading packaged chips, a method for transferring test trays, and a method for manufacturing packaged chips are provided. The test handler may include: a loading unit having a loading picker to perform a loading process on a test tray located at a loading position, a chamber system in which the packaged chips contained in the test tray transferred from the loading unit are connected to a hi-fix board and tested, and an unloading unit having at least one unloading buffer to move along an unloading moving path formed over a test tray located at an unloading position and an unloading picker to perform an unloading process on the test tray located at the unloading position. The test handler may further include a passage site disposed between the loading unit and the unloading unit and connecting the loading unit and the unloading unit to the chamber system, and a transferring unit transferring the test trays. | 10-22-2009 |
| 20100109652 | APPARATUS FOR CORRECTING POSITION OF A USER TRAY AND A TEST HANDLER - The present invention relates to an apparatus for correcting position of a user tray including at least one first position member and at least one second position member that determine position of a user tray, a plate where the user tray is received, a first correcting unit that moves the user tray in a direction where the first position member is installed, a second correcting unit that moves the user tray in a direction where the second position member is installed, and an operating unit that operates the first correcting unit and the second correcting unit, which has a simple configuration, and moves a user tray to the accurate position, thereby reducing manufacturing costs and maintenance costs | 05-06-2010 |
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| 20110233589 | LIGHT-EMITTING DEVICE, LIGHT-EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM - Disclosed is a light-emitting device including a substrate, a light-emitting structure on the substrate, the light-emitting structure including a first semiconductor layer, an active layer and a second semiconductor layer, a light-transmitting electrode layer on the second semiconductor layer, and a first reflective layer on the light-transmitting electrode layer, wherein the first reflective layer comprises a first layer having a first index of refraction and a second layer having a second index of refraction different from the first index of refraction. Based on this configuration, it is possible to protect the light-emitting device and improve luminous efficiency thereof. | 09-29-2011 |
| 20120007129 | LIGHT EMITTING DEVICE - Disclosed is a light emitting device including a substrate, a light emitting structure arranged on the substrate, the light emitting structure including a first semiconductor layer, a second semiconductor layer and an active layer arranged between the first semiconductor layer and the second semiconductor layer, a first electrode electrically connected to the first semiconductor layer, and a second electrode electrically connected to the second semiconductor layer, wherein the light emitting structure has a top surface including a first side and a second side which face each other, and a third side and a fourth side which face each other. | 01-12-2012 |
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| 20110204399 | LIGHT EMITTING DEVICE, METHOD OF MANUFACTURING THE LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING SYSTEM - A light emitting device includes a substrate, at least one electrode, a first contact layer, a second contact layer, a light emitting structure layer, and an electrode layer. The electrode is disposed through the substrate. The first contact layer is disposed on a top surface of the substrate and electrically connected to the electrode. The second contact layer is disposed on a bottom surface of the substrate and electrically connected to the electrode. The light emitting structure layer is disposed above the substrate at a distance from the substrate and electrically connected to the first contact layer. The light emitting structure layer includes a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer. The electrode layer is disposed on the light emitting structure layer. | 08-25-2011 |
| 20110233590 | LIGHT EMITTING DEVICE, METHOD FOR FABRICATING LIGHT EMITTING DEVICE, AND LIGHT EMITTING DEVICE PACKAGE - Provided are a light emitting device, a method for fabricating the light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a first conductive type semiconductor layer having a first top surface and a second top surface under the first top surface, an active layer on the first top surface of the first conductive type semiconductor layer, a second conductive type semiconductor layer on the active layer, a first electrode on the second top surface of the first conductive type semiconductor layer, an intermediate refractive layer on the second top surface of the first conductive type semiconductor layer, and a second electrode connected to the second conductive type semiconductor layer. | 09-29-2011 |
| 20110254035 | LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND ILLUMINATION SYSTEM - Disclosed are a light emitting device, a light emitting device package, and an illumination system. The light emitting device includes a substrate; a light emitting structure layer including a first conductive type semiconductor layer formed on the substrate and having first and second upper surfaces, in which the second upper surface is closer to the substrate than the first upper surface, an active layer on the first conductive type semiconductor layer, and a second conductive type semiconductor layer on the active layer; a second electrode on the second conductive type semiconductor layer; and at least one first electrode extending at least from the second upper surface of the first conductive type semiconductor layer to a lower surface of the substrate by passing through the substrate. | 10-20-2011 |
| 20110284894 | LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING DEVICE SYSTEM - A light emitting device includes a substrate, a light emitting structure including a first conductive semiconductor layer having an exposed region, an active layer, and a second conductive semiconductor layer on the substrate, a first electrode on the exposed region of the first conductive semiconductor layer, and a second electrode on the second conductive semiconductor layer, wherein a side of the light emitting structure includes a first sloped side sloped from a reference plane, the first sloped side includes a concave-convex pattern having a concave-convex structure in which a first direction length is greater than a second direction length, the reference plane is a plane perpendicular to a direction in which the substrate faces the light emitting structure, and the first direction is a sloped direction of the first sloped side and the second direction is a lateral direction of the first sloped side. | 11-24-2011 |
| 20110284901 | LIGHT EMITTING DEVICE, METHOD OF FABRICATING THE SAME AND LIGHT EMITTING DEVICE PACKAGE - Disclosed herein is a light emitting device including a first nitride semiconductor and a second nitride semiconductor, each of which includes a first conductivity-type semiconductor layer, an active layer and a second conductivity-type semiconductor layer, and a connection layer formed between the second conductivity-type semiconductor layer of the second nitride semiconductor and the first conductivity-type semiconductor layer of the first nitride semiconductor, wherein the first nitride semiconductor and the second nitride semiconductor are connected by the connection layer, and the light emitting device further comprises electrodes formed on at least a part of the second conductivity-type semiconductor layer of the first nitride semiconductor, at least a part of the first conductivity-type semiconductor layer of the second nitride semiconductor, and at least a part of the second conductivity-type semiconductor layer of the second nitride semiconductor. The light emitting device may be driven and emit light using AC power. | 11-24-2011 |
| 20110309383 | LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING SYSTEM - Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a crystalline substrate having a plurality of side surfaces, a light emitting structure layer comprising a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer on the substrate, and a first electrode on the first conductive type semiconductor layer and a second electrode on the second conductive type semiconductor layer. An amorphous region is defined in a side surface of the substrate, and the amorphous regions of two sides adjacent to each other have different depths from a top surface of the substrate. | 12-22-2011 |
