| Patent application number | Description | Published |
| 20090035565 | BONDING LAYER ON FLUOROPOLYMERS - The invention relates to a device comprising a layer made from a fluoropolymer, of which at least part of the surface is covered with a composition comprising a polymer having at least one fluorinated function and at least one acid or base function and forming a bonding layer on said fluoropolymer, said bonding layer being fully or partly covered by another layer. | 02-05-2009 |
| 20090314145 | METHOD FOR ELIMINATING ENGRAVING DEFECTS FROM A METAL FILM DEPOSITED ON A FLEXIBLE CARRIER - The invention relates to a method for eliminating mask projection laser ablation engraving defects from a metal film deposited on a flexible carrier. According to the invention, the method comprises spraying onto said defects a liquid pressurized at between about 1500 PSI and about 3000 PSI. | 12-24-2009 |
| 20100025668 | ORGANIC TRANSISTOR AND METHOD FOR FABRICATING A DIELECTRIC LAYER OF SUCH A TRANSISTOR - The present invention relates to an organic transistor comprising a conductive element which forms a drain; a conductive element which forms a source located away from the drain; a conductive element which forms a gate having a surface which faces the drain and a surface which faces the source; a semiconducting layer which is in contact with the drain and the source; and a dielectric layer located between, firstly, the gate and, secondly, the source and the drain with the dielectric layer having a dielectric permittivity which varies depending on its thickness, | 02-04-2010 |
| 20110076797 | METHOD FOR PRODUCING LOCALIZED PATTERNS - A method for producing at least one pattern on a top surface of a support made from a material presenting a first thermal conductivity comprises a step of arranging of a mask made from a material presenting a second thermal conductivity and comprising at least one recess having a shape corresponding to that of the pattern, in contact with a bottom surface of the support, the ratio of the first conductivity over the second conductivity being greater than or equal to 2, or smaller than or equal to ½, throughout the duration of the method. The method further comprises a step of depositing on the top surface a solution comprising a material designed to form the pattern, and a step of evaporating the solution. | 03-31-2011 |