Patent application number | Description | Published |
20080246468 | METHOD AND ALGORITHMS FOR INSPECTION OF LONGITUDINAL DEFECTS IN AN EDDY CURRENT INSPECTION SYSTEM - A collection of data processing algorithms which, used in concert, are suitable for use in place of a high pass filter stage in an eddy current inspection system and provide for a system optimized to inspect test pieces for elongated defects running parallel to the scan axis. The algorithms use mathematical techniques to eliminate baseline impedance offset between test pieces, correct for offset drift during a scan, and allow for system balancing using only a set of test pieces of unknown quality. | 10-09-2008 |
20080315871 | FLEXIBLE ARRAY PROBE FOR THE INSPECTION OF A CONTOURED SURFACE WITH VARYING CROSS-SECTIONAL GEOMETRY - A flexible array probe is disclosed suitable for use in the non-destructive testing and inspection of test pieces with varying cross-sectional geometries. Array elements—such as, but not limited to, eddy current sensors, piezoelectric sensor elements, and magnetic flux leakage sensors—are mounted on thin alignment fins and coupled together with pairs of pivot mechanisms along the axis of desired rotation. The pivot mechanisms allow rotation in exactly one dimension and force the flexible array probe to align its elements orthogonally to the surface of the structure under test. Alignment and coupling fixtures are also disclosed. | 12-25-2008 |
20090091318 | PHASED SCAN EDDY CURRENT ARRAY PROBE AND A PHASED SCANNING METHOD WHICH PROVIDE COMPLETE AND CONTINUOUS COVERAGE OF A TEST SURFACE WITHOUT MECHANICAL SCANNING - A phased scanning method and phased scan eddy current array probe suitable for in-situ eddy current inspection of a structure without mechanical scanning. Overlapping subsets of the sensor elements within the array probe are dynamically connected in series and sequentially scanned to simulate the mechanical motion of a conventional array probe along a test surface. An algorithm to effectively balance the scan data is provided which comprises obtaining a reference scan at the time of probe installation, storing the measurement data from this reference scan in a memory device located within the probe, subtracting this reference curve from the curve obtained by all subsequent measurement scans to produce an adjusted curve, and processing the resulting adjusted curve through a high pass filter. A technique for verifying sensor elements of an eddy current array probe after permanent or semi-permanent installation against a test structure is also provided. | 04-09-2009 |
20090243605 | INTELLIGENT EDDY CURRENT ARRAY PROBE WITH EMBEDDED FIRING SEQUENCE MEMORY - An intelligent eddy current array probe comprising a plurality of coil elements and an embedded non-volatile memory element is disclosed. Prior to coupling the intelligent eddy current array probe to an NDI system, a data table describing a desired firing sequence for the array probe within a given inspection operation is created. This data table is then stored within the embedded non-volatile memory element of the intelligent eddy current array probe such that when the array probe is coupled to the NDI system, the elements of the NDI system can load and execute the stored firing sequence without operator intervention. In this way, a plurality of intelligent eddy current array probes, each with its own firing sequence, can be used interchangeably within a single NDI system without the need for mechanical adjustments to the NDI system. | 10-01-2009 |
20100007342 | HIGH RESOLUTION AND FLEXIBLE EDDY CURRENT ARRAY PROBE - Disclosed is a method and an NDT/NDI probe deploying a slit or a flexible joint of probe bending region, preferably between two rows of probe elements to allow free bending between rows of probe elements and along the direction of the rows of elements and to allow two adjacent rows of elements to bend individually along its own natural bending lines perpendicular to the direction of the rows of elements. Also disclosed is the use of protective flexible pads to cover the probe elements and other probe components. | 01-14-2010 |
20110025316 | EDDY CURRENT PROBE ASSEMBLY ADJUSTABLE FOR INSPECTING TEST OBJECTS OF DIFFERENT SIZES - An eddy current probe assembly suitable for inspecting a test object with longitudinal shape, being passed through the assembly in the object's axial direction during an inspection session, the probe assembly comprising multiple probe modules being disposed in a radial plane and with the modules partially overlaying on each other forming an iris structure encircling an inspection zone, wherein a movement in unison of each of the probe modules closer to or further away from the center of the inspection zone makes the inspection zone enlarged or contracted. Spring tension is applied on each of the probe modules so that constant life-off in maintained between the probe modules and the test surface. Array of eddy current elements for each probe module and multiple layers of probe modules can be employed to achieve complete coverage of the test surface. The radial cross-sectional shapes of the test objects can be of round or polygonal. | 02-03-2011 |
20110118991 | MULTI-FREQUENCY BOND TESTING - A multi-frequency bond-testing system using acoustic probes in conjunction with NDT/NDI inspection instruments. Bond-testing of test objects is carried out at multiple discrete frequencies to produce a single, combined amplitude C-scan. Alternatively, or in combination, the system provides a single, combined phase C-scan to enable proper interpretation of the C-scans. Amplitude and/or phase readings on test objects are normalized at the selected frequencies relative to tests performed on a defect-free object at those frequencies. In this manner, the non-linear behavior of a bond-testing probe over a frequency range chosen for a given inspection is compensated for. The invention enables providing more easily interpretable and sharper images which enable a more reliable and faster reading and identification of defects in the test objects. | 05-19-2011 |
20120007595 | 2D COIL AND A METHOD OF OBTAINING EC RESPONSE OF 3D COILS USING THE 2D COIL CONFIGURATION - The invention herein disclosed provides a 2D coil and a method of using the 2D wound EC sensor for reproducing the Eddy Current Testing (ECT) response of a prior art 3D orthogonal sensor. The 3D orthogonal sensor is conventionally wound onto a 3D core, with at least some of the surfaces being un-parallel to the surface be inspected. Using the herein disclosed 2D configuration allows the use of printed circuit board technologies for the manufacturing of these EC sensors. The herein disclosed method and the associated 2D EC sensors are particularly useful for reproducing the EC effect of conventional orthogonal probe arrays. | 01-12-2012 |
20120025816 | ORTHOGONAL EDDY CURRENT PROBE FOR MULTI-DIRECTIONAL INSPECTION - Disclosed is an improved orthogonal eddy current probe with at least three coils, each of the coils is wound across the two facing sides of an at least six-sided right polygonal prism, such as a hexagonal core. At each time interval, two of the three coils are used as driver coils, being charged simultaneously with electric current driven in coherent directions to induce a combined eddy current and one of the coils is used as a receiver coil to sense the eddy current, with the combined eddy current to be orthogonal to the receiver coil. Each coil alternates to be one of the driver coils or the receiver coil at a predetermined switching sequence and a predetermined switching frequency during consecutive time intervals. The eddy current probe as disclosed provides the advantages of inspecting a test surface for flaws of any flaw orientation with one pass of scan, providing sufficient sensitivity and desirable noise cancellation in all directions. | 02-02-2012 |
20120206132 | SHIELDED EDDY CURRENT COILS AND METHODS FOR FORMING SAME ON PRINTED CIRCUIT BOARDS - A shielded eddy current coil probe is formed on a printed circuit board and comprises a first coil component forming a test coil and a second coil component forming an active shielding coil. The test coil and the active shielding coil are concentrically arranged and the number of coil windings in the active shielding coil and the field direction thereof are configured to limit the induced field or the sensed field in the test object to the footprint area of the test coil on the test object. Multiple sets of test coils with active shielding coils can be provided on the same or different layers of the printed circuit board to realize different driver, receiver and combined driver/receiver coil configurations. | 08-16-2012 |
20130199297 | PHASED ARRAY SYSTEM AND METHOD FOR INSPECTING HELLICAL SUBMERGED ARCS WELD (HSAW) - A phased array system and the inspection method which is configured to inspect the weld seam of an HSAW for all standard types of flaws located both near pipe's internal and external surfaces in one scan pass, diminishing the need of making mechanical adjustment for the probes during the one pass of scan. The configuration includes the usage of at least one linear PA probe for Lamination inspection right above HAZ zone, at least one pair of PA probes for longitudinal defects inspection and holes detection and at least two pairs of PA probes for transversal defect inspections. | 08-08-2013 |
20130249540 | EDDY CURRENT ARRAY PROBE AND METHOD FOR LIFT-OFF COMPENSATION DURING OPERATION WITHOUT KNOWN LIFT REFERENCES - The invention provides a method for compensating the sensitivity variations induced by lift-off variations for an eddy current array probe. The invention uses the eddy current array probe coils in two separate ways to produce a first set of detection channels and a second set of lift-off measurement channels without the need to add coils dedicated to the lift-off measurement operation. Another aspect of the invention provides an improved calibration process which combines the detection and lift-off measurement channel calibration on a simple calibration block including a reference defect without the need of a pre-defined lift-off condition. | 09-26-2013 |
20140002072 | EDDY CURRENT ARRAY CONFIGURATION WITH REDUCED LENGTH AND THICKNESS | 01-02-2014 |
20140028608 | METHOD OF MANIPULATING IMPEDANCE PLANE WITH A MULTI-POINT TOUCH ON TOUCH SCREEN - A touch screen is disclosed which responds to a user's touch for re-drawing, re-scaling, re-translating and re-positioning an impedance plane signal received from non-destructive testing equipment, such as an eddy current sensor. The impedance plane is manipulated by slidingne, two or more fingers simultaneously to an end position to effectuate a complete re-drawing operation of the image. | 01-30-2014 |