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Benoit Lepage, Quebec CA

Benoit Lepage, Quebec CA

Patent application numberDescriptionPublished
20080246468METHOD AND ALGORITHMS FOR INSPECTION OF LONGITUDINAL DEFECTS IN AN EDDY CURRENT INSPECTION SYSTEM - A collection of data processing algorithms which, used in concert, are suitable for use in place of a high pass filter stage in an eddy current inspection system and provide for a system optimized to inspect test pieces for elongated defects running parallel to the scan axis. The algorithms use mathematical techniques to eliminate baseline impedance offset between test pieces, correct for offset drift during a scan, and allow for system balancing using only a set of test pieces of unknown quality.10-09-2008
20080315871FLEXIBLE ARRAY PROBE FOR THE INSPECTION OF A CONTOURED SURFACE WITH VARYING CROSS-SECTIONAL GEOMETRY - A flexible array probe is disclosed suitable for use in the non-destructive testing and inspection of test pieces with varying cross-sectional geometries. Array elements—such as, but not limited to, eddy current sensors, piezoelectric sensor elements, and magnetic flux leakage sensors—are mounted on thin alignment fins and coupled together with pairs of pivot mechanisms along the axis of desired rotation. The pivot mechanisms allow rotation in exactly one dimension and force the flexible array probe to align its elements orthogonally to the surface of the structure under test. Alignment and coupling fixtures are also disclosed.12-25-2008
20090091318PHASED SCAN EDDY CURRENT ARRAY PROBE AND A PHASED SCANNING METHOD WHICH PROVIDE COMPLETE AND CONTINUOUS COVERAGE OF A TEST SURFACE WITHOUT MECHANICAL SCANNING - A phased scanning method and phased scan eddy current array probe suitable for in-situ eddy current inspection of a structure without mechanical scanning. Overlapping subsets of the sensor elements within the array probe are dynamically connected in series and sequentially scanned to simulate the mechanical motion of a conventional array probe along a test surface. An algorithm to effectively balance the scan data is provided which comprises obtaining a reference scan at the time of probe installation, storing the measurement data from this reference scan in a memory device located within the probe, subtracting this reference curve from the curve obtained by all subsequent measurement scans to produce an adjusted curve, and processing the resulting adjusted curve through a high pass filter. A technique for verifying sensor elements of an eddy current array probe after permanent or semi-permanent installation against a test structure is also provided.04-09-2009
20090243605INTELLIGENT EDDY CURRENT ARRAY PROBE WITH EMBEDDED FIRING SEQUENCE MEMORY - An intelligent eddy current array probe comprising a plurality of coil elements and an embedded non-volatile memory element is disclosed. Prior to coupling the intelligent eddy current array probe to an NDI system, a data table describing a desired firing sequence for the array probe within a given inspection operation is created. This data table is then stored within the embedded non-volatile memory element of the intelligent eddy current array probe such that when the array probe is coupled to the NDI system, the elements of the NDI system can load and execute the stored firing sequence without operator intervention. In this way, a plurality of intelligent eddy current array probes, each with its own firing sequence, can be used interchangeably within a single NDI system without the need for mechanical adjustments to the NDI system.10-01-2009
20100007342HIGH RESOLUTION AND FLEXIBLE EDDY CURRENT ARRAY PROBE - Disclosed is a method and an NDT/NDI probe deploying a slit or a flexible joint of probe bending region, preferably between two rows of probe elements to allow free bending between rows of probe elements and along the direction of the rows of elements and to allow two adjacent rows of elements to bend individually along its own natural bending lines perpendicular to the direction of the rows of elements. Also disclosed is the use of protective flexible pads to cover the probe elements and other probe components.01-14-2010
20110025316EDDY CURRENT PROBE ASSEMBLY ADJUSTABLE FOR INSPECTING TEST OBJECTS OF DIFFERENT SIZES - An eddy current probe assembly suitable for inspecting a test object with longitudinal shape, being passed through the assembly in the object's axial direction during an inspection session, the probe assembly comprising multiple probe modules being disposed in a radial plane and with the modules partially overlaying on each other forming an iris structure encircling an inspection zone, wherein a movement in unison of each of the probe modules closer to or further away from the center of the inspection zone makes the inspection zone enlarged or contracted. Spring tension is applied on each of the probe modules so that constant life-off in maintained between the probe modules and the test surface. Array of eddy current elements for each probe module and multiple layers of probe modules can be employed to achieve complete coverage of the test surface. The radial cross-sectional shapes of the test objects can be of round or polygonal.02-03-2011
20110118991MULTI-FREQUENCY BOND TESTING - A multi-frequency bond-testing system using acoustic probes in conjunction with NDT/NDI inspection instruments. Bond-testing of test objects is carried out at multiple discrete frequencies to produce a single, combined amplitude C-scan. Alternatively, or in combination, the system provides a single, combined phase C-scan to enable proper interpretation of the C-scans. Amplitude and/or phase readings on test objects are normalized at the selected frequencies relative to tests performed on a defect-free object at those frequencies. In this manner, the non-linear behavior of a bond-testing probe over a frequency range chosen for a given inspection is compensated for. The invention enables providing more easily interpretable and sharper images which enable a more reliable and faster reading and identification of defects in the test objects.05-19-2011
201200075952D COIL AND A METHOD OF OBTAINING EC RESPONSE OF 3D COILS USING THE 2D COIL CONFIGURATION - The invention herein disclosed provides a 2D coil and a method of using the 2D wound EC sensor for reproducing the Eddy Current Testing (ECT) response of a prior art 3D orthogonal sensor. The 3D orthogonal sensor is conventionally wound onto a 3D core, with at least some of the surfaces being un-parallel to the surface be inspected. Using the herein disclosed 2D configuration allows the use of printed circuit board technologies for the manufacturing of these EC sensors. The herein disclosed method and the associated 2D EC sensors are particularly useful for reproducing the EC effect of conventional orthogonal probe arrays.01-12-2012

Patent applications by Benoit Lepage, Quebec CA