| Patent application number | Description | Published |
|---|
| 20080270100 | Method, Apparatus, and Computer Program Product for Implementing Optimized Channel Routing With Generation of FIR Coefficients - A method, apparatus and computer program product implement optimized channel routing in an electronic package design. Electronic package physical design data are received. A physical design including a netlist including a plurality of nets is generated. Finite impulse response (FIR) driver coefficients are determined for each net in the netlist from simulation with generation of impulse responses of the netlist. | 10-30-2008 |
| 20090081813 | Method and Apparatus for Measurement and Control of Photomask to Substrate Alignment - A method, structure, system of aligning a substrate to a photomask. The method comprising: directing light through a clear region of the photomask in a photolithography tool, through a lens of the tool and onto a set of at least three diffraction mirror arrays on the substrate, each diffraction mirror array of the set of at least three diffraction mirror arrays comprising a single row of mirrors, all mirrors in any particular diffraction mirror array spaced apart a same distance, mirrors in different diffraction mirror arrays spaced apart different distances; measuring an intensity of light diffracted from the set of at least three diffraction mirror arrays onto an array of photo detectors; and adjusting a temperature of the photomask or photomask and lens based on the measured intensity of light. | 03-26-2009 |
| 20090195787 | Method and Apparatus for Measurement and Control of Photomask to Substrate Alignment - A method, structure, system of aligning a substrate to a photomask. The method includes: directing incident light through a pattern of clear regions transparent to the incident light in an opaque-to-the-incident-light region of a photomask, through a lens and onto a photodiode formed in a substrate, the photodiodes electrically connected to a light emitting diode formed in the substrate, the light emitting diode emitting light of different wavelength than a wavelength of the incident lights; measuring an intensity of emitted light from light emitting diode; and adjusting alignment of the photomask to the substrate based on the measured intensity of emitted light. | 08-06-2009 |
| 20100063781 | Enhanced Conductivity in an Airgapped Integrated Circuit - A method, program product and apparatus include extending lengths that project from a microchip trace into dielectric material. The extending lengths may not connect to another trace. Placement of the extending lengths may be optimized to increase the dissipation of heat from the trace, while maintaining an acceptable level of capacitance. | 03-11-2010 |
| 20100064270 | Cost-Benefit Optimization for an Airgapped Integrated Circuit - A computer implemented method, apparatus and program product provide automated processes for determining the most cost-effective use of airgaps in a microchip. The performance gains realized by using airgaps for a given net or layer may be calculated. These improvements may be paired to a monetary cost associated with implementing the applicable airgaps at that net/layer. The paired benefit and cost of the airgap scenario may be compared to other possible airgap uses at other layers/nets to determine which airgaps provide the best improvement for the lowest cost. | 03-11-2010 |
| 20100270682 | Implementing Vertical Airgap Structures Between Chip Metal Layers - A method and structure are provided for implementing vertical airgap structures between chip metal layers. A first metal layer is formed. A first layer of silicon dioxide dielectric is deposited onto the first metal layer. A vertical air gap is etched from the first layer of silicon dioxide dielectric above the first metal layer. A second layer of silicon dioxide dielectric is deposited and the vertical air gap is sealed. A next trace layer is etched from the second layer of silicon dioxide dielectric and a via opening is etched from the second and first layers of silicon dioxide dielectric. Then metal is deposited into the next trace layer and metal is deposited into the via opening. | 10-28-2010 |
| 20110008719 | METHOD AND APPARATUS FOR MEASUREMENT AND CONTROL OF PHOTOMASK TO SUBSTRATE ALIGNMENT - A method, structure, system of aligning a substrate to a photomask. The method comprising: directing light through a clear region of the photomask in a photolithography tool, through a lens of the tool and onto a set of at least three diffraction mirror arrays on the substrate, each diffraction mirror array of the set of at least three diffraction minor arrays comprising a single row of mirrors, all mirrors in any particular diffraction mirror array spaced apart a same distance, mirrors in different diffraction mirror arrays spaced apart different distances; measuring an intensity of light diffracted from the set of at least three diffraction mirror arrays onto an array of photo detectors; and adjusting a temperature of the photomask or photomask and lens based on the measured intensity of light. | 01-13-2011 |
| 20110013187 | METHOD AND APPARATUS FOR MEASUREMENT AND CONTROL OF PHOTOMASK TO SUBSTRATE ALIGNMENT - A method, structure, system of aligning a substrate to a photomask. The method comprising: directing light through a clear region of the photomask in a photolithography tool, through a lens of the tool and onto a set of at least three diffraction mirror arrays on the substrate, each diffraction mirror array of the set of at least three diffraction mirror arrays comprising a single row of mirrors, all mirrors in any particular diffraction mirror array spaced apart a same distance, mirrors in different diffraction mirror arrays spaced apart different distances; measuring an intensity of light diffracted from the set of at least three diffraction mirror arrays onto an array of photo detectors; and adjusting a temperature of the photomask or photomask and lens based on the measured intensity of light. | 01-20-2011 |
| 20110096310 | METHOD AND APPARATUS FOR MEASUREMENT AND CONTROL OF PHOTOMASK TO SUBSTRATE ALIGNMENT - A method, structure, system of aligning a substrate to a photomask. The method includes: directing incident light through a pattern of clear regions transparent to the incident light in an opaque-to-the-incident-light region of a photomask, through a lens and onto a photodiode formed in a substrate, the photodiodes electrically connected to a light emitting diode formed in the substrate, the light emitting diode emitting light of different wavelength than a wavelength of the incident lights; measuring an intensity of emitted light from light emitting diode; and adjusting alignment of the photomask to the substrate based on the measured intensity of emitted light. | 04-28-2011 |
| 20110096329 | METHOD AND APPARATUS FOR MEASUREMENT AND CONTROL OF PHOTOMASK TO SUBSTRATE ALIGNMENT - A method, structure, system of aligning a substrate to a photomask. The method includes: directing incident light through a pattern of clear regions transparent to the incident light in an opaque-to-the-incident-light region of a photomask, through a lens and onto a photodiode formed in a substrate, the photodiodes electrically connected to a light emitting diode formed in the substrate, the light emitting diode emitting light of different wavelength than a wavelength of the incident lights; measuring an intensity of emitted light from light emitting diode; and adjusting alignment of the photomask to the substrate based on the measured intensity of emitted light. | 04-28-2011 |
