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Behun

Bryan S. Behun, White Bear Lake, MN US

Patent application numberDescriptionPublished
20080317637ROTATING REAGENT DISPENSER AND METHODS - Devices and methods of dispensing and mixing reagents with samples in an enclosed container in which the amounts of the reagents dispensed into the sample are predetermined. The devices include a rotating dispenser element attached to a base, wherein an ampoule is located within a cavity in the base. The dispenser elements contain two or more dispensing chambers that are sealed and that can be opened and any reagent(s) located therein dispensed into the ampoule at selected times.12-25-2008
20090030341SAMPLE RELEASE SYSTEM - Devices to process a sample are configured to releasably attach a sample acquisition device to a drive mechanism that provides rotational and/or vibrational motion to the sample acquisition device. The devices can be used in sample processing methods to dislodge sample materials from the sample acquisition device. Sample processing methods using rotational or vibrational motion may further include the use of a liquid medium into which the sample is released. Sample processing methods may further include the detection of an analyte in the sample.01-29-2009
20090030342APPARATUS AND METHOD FOR RELEASING A SAMPLE OF MATERIAL - A first aspect of the present invention provides for devices to facilitate the release of sample materials from sample acquisition devices. The device comprises an abrasion element comprising at least one constriction or projection. A second aspect of the present invention provides for methods in which to use the devices to facilitate the release of sample materials from a sample acquisition device. Optionally, the device may contain at least one reagent to facilitate the release and/or detection of a microorganism, or component thereof, in a sample. Preferably, the devices and methods may be used in conjunction with a liquid medium in which the sample may be further processed.01-29-2009

J. Richard Behun, Essex Junction, VT US

Patent application numberDescriptionPublished
20100327405ELECTRICAL PROPERTY ALTERING, PLANAR MEMBER WITH SOLDER ELEMENT IN IC CHIP PACKAGE - A structure includes a solder element for electrically coupling a substrate of an integrated circuit (IC) chip package and a printed circuit board (PCB); and a first electrical property altering, substantially planar member positioned between the solder element and at least one of a landing pad of the substrate and a landing pad of the PCB. In another embodiment, the electrical property altering, planar member can be applied to the solder element(s) between the IC chip and the package substrate.12-30-2010

J. Richard Behun, Williston, VT US

Patent application numberDescriptionPublished
20090283876ELECTROMAGNETIC INTERFERENCE SHIELD FOR SEMICONDUCTORS USING A CONTINUOUS OR NEAR-CONTINUOUS PERIPHERAL CONDUCTING SEAL AND A CONDUCTING LID - A semiconductor package structure including a conductive adhesive material which is used to form an electromagnetic interference shield-forming Faraday cage. The Faraday cage incorporates a module lid as the top surface thereof, the conductive material as the sides and a laminate ground plane(s) or substrate as its bottom. Also disclosed is a method for fabricating the foregoing semiconductor package structure.11-19-2009