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Bedinger

Daniel Bedinger, Vacaville, CA US

Patent application numberDescriptionPublished
20080292620PRLR-Specific Antibody and Uses Thereof - PRLR-specific antibodies are provided, along with pharmaceutical compositions containing such antibody, kits containing a pharmaceutical composition, and methods of preventing and treating cancer.11-27-2008
20100184612NOVEL TRIPLE TAG SEQUENCE AND METHODS OF USE THEREOF - The present disclosure relates to novel triple tag sequences that may comprise a 6× histidine tag, a c-myc tag and a V5 tag. The present disclosure also provides polynucleotides, proteins, vectors and host cells that comprise the triple tag sequence of the present disclosure, including libraries of such polynucleotides, proteins, vectors and host cells. The novel triple tag sequences of the present disclosure may be used in phage display vectors and phage libraries and in methods for detection, screening, capture, purification, quantitation, and/or recovery of proteins of interest to which they are linked. Proteins of interest include antibodies such as single chain antibodies, single chain antibodies, and Fab fragments of antibodies or peptides such as non-antibody peptides.07-22-2010
20110274692Screening Methods - The present invention provides polypeptide binding agents, e.g. antibodies, that exhibit the ability to kinetically modulate the binding and signaling of biological signaling complexes, e.g., receptor-ligand complexes; methods of identifying such polypeptide binding agents, methods of making such polypeptide binding agents, compositions comprising such polypeptide binding agents, and methods of using such polypeptide binding agents.11-10-2011

Patent applications by Daniel Bedinger, Vacaville, CA US

Daniel Bedinger, Berkeley, CA US

Patent application numberDescriptionPublished
20110150760PRLR-Specific Antibody and Uses Thereof - PRLR-specific antibodies are provided, along with pharmaceutical compositions containing such antibody, kits containing a pharmaceutical composition, and methods of preventing and treating cancer.06-23-2011
20120010101NOVEL TRIPLE TAG SEQUENCES AND METHODS OF USE THEREOF - The present disclosure relates to novel triple tag sequences that may comprise a 6× histidine tag, a c-myc tag and a V5 tag. The present disclosure also provides polynucleotides, proteins, vectors and host cells that comprise the triple tag sequence of the present disclosure, including libraries of such polynucleotides, proteins, vectors and host cells. The novel triple tag sequences of the present disclosure may be used in phage display vectors and phage libraries and in methods for detection, screening, capture, purification, quantitation, and/or recovery of proteins of interest to which they are linked. Proteins of interest include antibodies such as single chain antibodies, single chain antibodies, and Fab fragments of antibodies or peptides such as non-antibody peptides.01-12-2012

John M. Bedinger, Garland, TX US

Patent application numberDescriptionPublished
20090288876Environmental Protection Coating System and Method - A circuit board assembly includes a circuit board having an outer surface that is configured with a plurality of discrete electrical components that are each manufactured independently of one another. The circuit board assembly further includes a first protective dielectric layer overlying the outer surface, and a second dielectric layer overlying the first protective dielectric layer and the discrete electrical components. The second dielectric layer includes a dielectric material having modulus of elasticity less than 3.5 Giga-Pascal (GPa), a dielectric constant less than 3.0, a dielectric loss less than 0.008, a moisture absorption less than 0.04 percent, a breakdown voltage strength in excess of 2 million volts/centimeter (MV/cm), a temperature stability to 300° Celsius, pinhole free in films greater than 50 Angstroms, hydrophobic with a wetting angle greater than 45 degrees, capable of being deposited conformally over and under 3D structures with thickness uniformity less than or equal to 30%.11-26-2009
20090290314Environmental Protection Coating System and Method - A circuit board assembly includes a circuit board having an outer surface, the outer surface being configured with a plurality of discrete electrical components that are each manufactured independently of one another. The circuit board assembly further includes a domed lid enclosure disposed over one of the plurality of discrete electrical components and an additional dielectric coating overlying the outer surface and the domed lid enclosure.11-26-2009
20090291200Environmental Protection Coating System and Method - A method includes providing a circuit board having an outer surface, the outer surface configured with a plurality of discrete electrical components that are each manufactured independently of one another, and coating the outer surface and the plurality of discrete electrical components with a first protective dielectric layer. The method further includes coating the first protective dielectric layer with a second dielectric layer. The second dielectric layer includes a dielectric material having a modulus of elasticity less than 3.5 Giga-Pascal (GPa), a dielectric constant less than 2.7, a dielectric loss less than 0.002, a breakdown voltage strength in excess of 2 million volts/centimeter (MV/cm), a temperature stability to 3000 Celsius, a defect densities less than 0.5/centimeter, a pinhole free in films greater than 50 Angstroms, and is capable of being deposited conformally over and under 3D structures with thickness uniformity less than or equal to 10%.11-26-2009
20100120254Passivation Layer for a Circuit Device and Method of Manufacture - According to one embodiment of the disclosure, a method for passivating a circuit device generally includes providing a substrate having a substrate surface, forming an electrical component on the substrate surface, and coating the substrate surface and the electrical component with a first protective dielectric layer. The first protective dielectric layer is made of a generally moisture insoluble material having a moisture permeability less than 0.01 gram/meter05-13-2010

Patent applications by John M. Bedinger, Garland, TX US

John Michael Bedinger, Garland, TX US

Patent application numberDescriptionPublished
20090085823REDUCED INDUCTANCE INTERCONNECT FOR ENHANCED MICROWAVE AND MILLIMETER-WAVE SYSTEMS - According to one embodiment of the present invention, a microwave or millimeter wave module includes a dielectric layer having a pocket formed substantially through the dielectric layer. The dielectric is attached to a metal substrate. The pocket has substantially vertical sidewalls. An integrated circuit is disposed in the pocket. Opposing sides of the integrated circuit are substantially parallel to the sidewalls of the pocket. An interconnect electrically couples the integrated circuit to a bond pad disposed on the outer surface of the dielectric layer. The interconnect has a length that is minimized to result in reduced inductance of the semiconductor device.04-02-2009
20090267235Reduced Inductance Interconnect for Enhanced Microwave and Millimeter-Wave Systems - According to one embodiment of the present invention, a microwave or millimeter wave module includes a dielectric layer having a pocket formed substantially through the dielectric layer. The dielectric is attached to a metal substrate. The pocket has substantially vertical sidewalls. An integrated circuit is disposed in the pocket. Opposing sides of the integrated circuit are substantially parallel to the sidewalls of the pocket. An interconnect electrically couples the integrated circuit to a bond pad disposed on the outer surface of the dielectric layer. The interconnect has a length that is minimized to result in reduced inductance of the semiconductor device.10-29-2009

Rob Bedinger, Richmond, VA US

Patent application numberDescriptionPublished
20120111152ANTI-SCALE COMPOSITION AND METHOD OF USE FOR LEACH FIELDS - Disclosed is a method for treating heap leach stacks by applying an insoluble polyimide composition, such as polysuccinimide, to the surface of an ore stack and/or incorporating the insoluble polyimide composition throughout the ore stack. The insoluble polyimide composition is then exposed to an aqueous solution to initiate hydrolysis and produce one or more water soluble products, such as hydrolyzed polyimides, polycarboxylates, polycarboxylic acids and mixtures thereof that will permeate the ore stack at a concentration sufficient to suppress scale formation within the leach stack. The water soluble products may also act to suppress scale formation in piping and channels peripheral to the leach stack, thereby reducing maintenance expenses.05-10-2012