Patent application number | Description | Published |
20100081643 | NOVEL CYCLIC BENZIMIDAZOLE DERIVATIVES USEFUL AS ANTI-DIABETIC AGENTS - Novel compounds of the structural formula (I) are activators of AMP-protein kinase and are useful in the treatment, prevention and suppression of diseases mediated by the AMPK-activated protein kinase. The compounds of the present invention are useful in the treatment of Type 2 diabetes, hyperglycemia, metabolic syndrome, obesity, hypercholesterolemia, and hypertension. | 04-01-2010 |
20100105747 | HYDROXYMETHYL ETHER HYDROISOINDOLINE TACHYKININ RECEPTOR ANTAGONISTS - The present invention is directed to certain hydroxymethyl ether hydroisoindoline compounds which are useful as neurokinin-1 (NK-1) receptor antagonists, and inhibitors of tachykinin and in particular substance P. The invention is also concerned with pharmaceutical formulations comprising these compounds as active ingredients and the use of the compounds and their formulations in the treatment of certain disorders, including emesis, urinary incontinence, LUTS, depression, and anxiety. | 04-29-2010 |
20100197724 | 6.5 -PYRROLOPIPERIDINE TACHYKININ RECEPTOR ANTAGONISTS - The present invention is directed to certain hydroxymethyl ether hydroisoindoline compounds which are useful as neurokinin-1 (NK-1) receptor antagonists, and inhibitors of tachykinin and in particular substance P. The invention is also concerned with pharmaceutical formulations comprising these compounds as active ingredients and the use of the compounds and their formulations in the treatment of certain disorders, including emesis, urinary incontinence, LUTS, depression, and anxiety. | 08-05-2010 |
20110195964 | NOVEL CYCLIC BENZIMIDAZOLE DERIVATIVES USEFUL AS ANTI-DIABETIC AGENTS - Novel compounds of the structural formula (I) are activators of AMP-protein kinase and are useful in the treatment, prevention and suppression of diseases mediated by the AMPK-activated protein kinase. The compounds of the present invention are useful in the treatment of Type 2 diabetes, hyperglycemia, metabolic syndrome, obesity, hypercholesterolemia, and hypertension. | 08-11-2011 |
20110218174 | NOVEL CYCLIC BENZIMIDAZOLE DERIVATIVES USEFUL AS ANTI-DIABETIC AGENTS - Novel compounds of the structural formula (I) are activators of AMP-protein kinase and are useful in the treatment, prevention and suppression of diseases mediated by the AMPK-activated protein kinase. The compounds of the present invention are useful in the treatment of Type 2 diabetes, hyperglycemia, metabolic syndrome, obesity, hypercholesterolemia, and hypertension. | 09-08-2011 |
20110263533 | NOVEL CYCLIC BENZIMIDAZOLE DERIVATIVES USEFUL AS ANTI-DIABETIC AGENTS - Novel compounds of the structural formula (I) are activators of AMP-protein kinase and are useful in the treatment, prevention and suppression of diseases mediated by the AMPK-activated protein kinase. The compounds of the present invention are useful in the treatment of Type 2 diabetes, hyperglycemia, Metabolic Syndrome, obesity, hypercholesterolemia, and hypertension. | 10-27-2011 |
20130040978 | SPIRO ISOXAZOLINE COMPOUNDS AS SSTR5 ANTAGONISTS - Substituted spirocyclic amines of structural formula (I) are selective antagonists of the somatostatin subtype receptor 5 (SSTR5) and are useful for the treatment, control or prevention of disorders responsive to antagonism of SSTR5, such as Type 2 diabetes, insulin resistance, lipid disorders, obesity, atherosclerosis, Metabolic Syndrome, depression, and anxiety. | 02-14-2013 |
20130131042 | SPIROXAZOLIDINONE COMPOUNDS - Substituted spirocyclic amines of structural formula (I) are selective antagonists of the somatostatin subtype receptor 5 (SSTR5) and are useful for the treatment, control or prevention of disorders responsive to antagonism of SSTR5, such as Type 2 diabetes, insulin resistance, lipid disorders, obesity, atherosclerosis, Metabolic Syndrome, depression, and anxiety. | 05-23-2013 |
Patent application number | Description | Published |
20090042854 | Hexahydro-3H-Pyrrolizin-3-Ones Useful as Tachykinin Receptor Antagonists - The present invention is directed to certain hexahydrpyrrolidinone compounds which are useful as neurokinin-1 (NK-1) receptor antagonists, and inhibitors of tachykinin and in particular substance P. The invention is also concerned with pharmaceutical formulations comprising these compounds as active ingredients and the use of the compounds and their formulations in the treatment of certain disorders, including emesis, urinary incontinence, depression, and anxiety. | 02-12-2009 |
20090048248 | Octahydropyrano[3,4-C]Pyrrole Tachykinin Receptor Antagonists - The present invention is directed to certain hydropyranopyrrolidine compounds which are useful as neurokinin-1 (NK-1) receptor antagonists, and inhibitors of tachykinin and in particular substance P. The invention is also concerned with pharmaceutical formulations comprising these compounds as active ingredients and the use of the compounds and their formulations in the treatment of certain disorders, including emesis, urinary incontinence, depression, and anxiety. | 02-19-2009 |
20090069284 | Substituted 3-alkyl and 3-alkenyl azetidine derivatives - Novel compounds of the structural formula (I) are antagonists and/or inverse agonists of the Cannabinoid-1 (CB1) receptor and are useful in the treatment, prevention and suppression of diseases mediated by the CB1 receptor. The compounds of the present invention are useful as centrally acting drugs in the treatment of psychosis, memory deficits, cognitive disorders, migraine, neuropathy, neuro-inflammatory disorders including multiple sclerosis and Guillain-Barre syndrome and the inflammatory sequelae of viral encephalitis, cerebral vascular accidents, and head trauma, anxiety disorders, stress, epilepsy, Parkinson's disease, movement disorders, and schizophrenia. The compounds are also useful for the treatment of substance abuse disorders, the treatment of obesity or eating disorders, as well as the treatment of asthma, constipation, chronic intestinal pseudo-obstruction, and cirrhosis of the liver. | 03-12-2009 |
20090286777 | 5,6,Fused Pyrrolidine Compounds Useful as Tachykinin Receptor Antagonists - The present invention is directed to certain 5,6-fused pyrrolidine compounds which are useful as neurokinin-1 (NK-1) receptor antagonists, and inhibitors of tachykinin and in particular substance P. The invention is also concerned with pharmaceutical formulations comprising these compounds as active ingredients and the use of the compounds and their formulations in the treatment of certain disorders, including emesis, urinary incontinence, depression, and anxiety. | 11-19-2009 |
Patent application number | Description | Published |
20140070363 | ELECTRONIC ANTI-FUSE - An electronic anti-fuse structure, the structure including an M | 03-13-2014 |
20140167268 | GRAPHENE AND METAL INTERCONNECTS - A graphene and metal interconnect structure and methods of making the same are disclosed. The graphene is a multiple layer graphene structure that is grown using a graphene catalyst. The graphene forms an electrical connection between two or more VIAs or components, or a combination of VIAs and components. A VIA includes a fill metal, with at least a portion of the fill metal being surrounded by a barrier metal. A component may be a routing track, a clock signal source, a power source, an electromagnetic signal source, a ground terminal, a transistor, a macrocell, or a combination thereof. The graphene is grown, using a graphene catalyst, from both solid and liquid carbon sources using chemical vapor deposition (CVD) at a temperature between 300° C.-400° C. The graphene catalyst can be an elemental form of, or alloy including, nickel, palladium, ruthenium, iridium or copper. | 06-19-2014 |
20140183688 | MODIFIED VIA BOTTOM FOR BEOL VIA EFUSE - An electronic fuse structure including an M | 07-03-2014 |
20140203435 | SELECTIVE LOCAL METAL CAP LAYER FORMATION FOR IMPROVED ELECTROMIGRATION BEHAVIOR - A method of forming a wiring structure for an integrated circuit device includes forming one or more copper lines within an interlevel dielectric layer (ILD); masking selected regions of the one or more copper lines; selectively plating metal cap regions over exposed regions of the one or more copper lines; and forming a conformal insulator layer over the metal cap regions and uncapped regions of the one or more copper lines. | 07-24-2014 |
20140203447 | METAL LINES HAVING ETCH-BIAS INDEPENDENT HEIGHT - A dielectric material stack including at least a via level dielectric material layer, at least one patterned etch stop dielectric material portion, a line level dielectric material layer, and optionally a dielectric cap layer is formed over a substrate. At least one patterned hard mask layer including a first pattern can be formed above the dielectric material stack. A second pattern is transferred through the line level dielectric material layer employing the at least one etch stop dielectric material portion as an etch stop structure. The first pattern is transferred through the line level dielectric material layer employing the at least one etch stop dielectric material portion as an etch stop structure while the second pattern is transferred through the via level dielectric material layer to form integrated line and via trenches, which are filled with a conductive material to form integrated line and via structures. | 07-24-2014 |
20140217612 | ELECTRONIC FUSE HAVING A DAMAGED REGION - An electronic fuse structure including an M | 08-07-2014 |
20140252538 | ELECTRONIC FUSE WITH RESISTIVE HEATER - A method of forming an electronic fuse including forming an M | 09-11-2014 |
20140319685 | Hybrid Graphene-Metal Interconnect Structures - Hybrid metal-graphene interconnect structures and methods of forming the same. The structure may include a first end metal, a second end metal, a conductive line including one or more graphene portions extending from the first end metal to the second end metal, and one or more line barrier layers partially surrounding each of the one or more graphene portions. The conductive line may further include one or more intermediate metals separating each of the one or more graphene portions. Methods of forming said interconnect structures may include forming a plurality of metals including a first end metal and a second end metal in a dielectric layer, forming one or more line trenches between each of the plurality of metals, forming a line barrier layer in each of the one or more line trenches, and filling the one or more line trenches with graphene. | 10-30-2014 |
20140332965 | High Performance Refractory Metal / Copper Interconnects To Eliminate Electromigration - An interconnect structure and method of making the same. A preferred interconnect structure has a first interconnect including a first dual damascene via and narrow line and a second interconnect at the same level as the first including a second dual damascene via and wider line. The first and second interconnects may have different aspect ratio and may have different line heights while being co-planar with each other. The second line of the second interconnect may abut or partially surround the first line of the first interconnect. The first interconnect includes a refractory metal material as the main conductor, whereas the second interconnect includes a lower resistivity material as its main conductor. | 11-13-2014 |
20150048479 | SELF-ALIGNED VIA FUSE - A method including forming a first via opening in a substrate, the first via opening is self-aligned to a first trench in the substrate, forming a second via opening in the substrate, the second via opening is self-aligned to a second trench in the substrate, a portion of the second via opening overlaps a portion of the first via opening to form an overlap region, and the overlap region having a width (w) equal to or greater than a space (s) between the first trench and the second trench, and removing a portion of the substrate in the overlap region to form a bridge opening, the bridge opening is adjacent to the first and second via openings and extends between the first and second trenches. | 02-19-2015 |