| Patent application number | Description | Published |
|---|
| 20100171227 | METHOD OF PRODUCING A VIA IN A RECONSTITUTED SUBSTRATE - A method of producing an electronic connection device, including: a) formation, in a plane of a support substrate, of at least one first contact element and, in a direction approximately perpendicular to the plane, of at least one second contact element having a first end in electrical contact with the first contact element or elements and a second end, the second contact element or elements including one or more metal tracks standing up along the direction perpendicular to the surface of the substrate; b) then positioning at least one electrical or electronic component in contact with the first contact element or elements; and c) encapsulation of the component(s) and of the first and second contact elements, at least the second end or ends of the second contact element or elements being flush with the surface of the encapsulating material. | 07-08-2010 |
| 20100181679 | 3D INTEGRATION OF VERTICAL COMPONENTS IN RECONSTITUTED SUBSTRATES - A reconstituted electronic device including: a first face and a second face; a plurality of individual chips placed perpendicular to the faces, each individual chip carrying, on one of its surfaces, at least one component, tracks, and a connection mechanism that are flush with one or other of the faces of the reconstituted electronic device; and an encapsulant that encapsulates the individual chips. | 07-22-2010 |
| 20100195299 | Integrated multicomponent device in a semiconducting die - An electronic device with integrated discrete components, including a wafer including cavities that can receive the components, an active face of the components being in a same plane as a face of the receiving wafer, and a material for laterally coating the components in the cavities. | 08-05-2010 |
