Inventors list

Assignees list

Classification tree browser

Top 100 Inventors

Top 100 Assignees


Balasubramaniam, NY

Mahadevan Balasubramaniam, Ballston Lake, NY US

Patent application numberDescriptionPublished
20090003991SYSTEM AND METHOD FOR TURBINE ENGINE CLEARANCE CONTROL WITH RUB DETECTION - A method of detecting rubs during operation of a turbomachine comprising at least one rotating object having a tip and a shelf is provided. The method includes generating signals representative of a sensed parameter and processing the signals to generate height versus time data for the tip. The height of the tip corresponds to the distance between the tip and the shelf. The method further includes monitoring the height versus time data, in order to determine whether a change in the height data exceeds a threshold value, and detecting a rub of the rotating object(s) on a second object, when the change in the height data exceeds the threshold value. A rub detection system for a turbomachine and a turbine engine system with rub detection are also provided.01-01-2009
20090014659DIGITAL X-RAY DETECTORS - An x-ray detector is provided for use in imaging systems. The x-ray detector includes a detector subsystem configured to output electrical signals in response to reception of x-rays. The detector subsystem includes an imaging panel, a support layer and a low density core disposed between the imaging panel and the support layer.01-15-2009
20100038058HEAT SINK AND COOLING AND PACKAGING STACK FOR PRESS-PACKAGES - A heat sink for directly cooling at least one electronic device package is provided. The electronic device package has an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material. The cooling piece defines multiple inlet manifolds configured to receive a coolant and multiple outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved. The cooling piece further defines multiple millichannels configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to directly cool one of the upper and lower contact surface of the electronic device package by direct contact with the coolant, such that the heat sink comprises an integral heat sink.02-18-2010
20100077830ELECTRONIC SELF-CALIBRATION FOR SENSOR CLEARANCE - Self-calibration of a multiple channel clearance sensor system, which in one embodiment includes at least one sensor for measuring at least one clearance parameter signal between a stationary object and a rotating object of a rotating machine. The sensor output is processed as a clearance parameter by an offset correction section configured to determine an offset error in the clearance parameter signal which is used by a level shifter. The level shifter is also switchably coupled to the clearance parameter signal wherein the output of the level shifter, which may be amplified and digitally converted, is processed by a signal level analyzer to determine a channel gain signal.04-01-2010
20100188100AUTOMATED SENSOR SPECIFIC CALIBRATION THROUGH SENSOR PARAMETER DOWNLOAD - A sensor system for measuring a clearance parameter between a stationary component and a rotating component of a rotating machine is provided. The system includes a clearance sensor to output a clearance measurement signal. A sensor memory is attached to the sensor for storing a first sensor information. A second sensor information is stored in a electronics interface memory. The first and the second sensor information are read and the clearance sensor is matched with a respective plurality of calibration data by an electronic interface based on the first and the second sensor information.07-29-2010
20100191502SYSTEM AND METHOD FOR CLEARANCE ESTIMATION BETWEEN TWO OBJECTS - A processing system for clearance estimation in a rotating machine includes one or more sensors and one or more digital signal processors for calculating the estimated clearance. The processing system may include techniques for obtaining real-time clearance estimates and techniques for obtaining averaged clearance estimates. Aspects of the processing system may also include a method of switching between real-time clearance estimates and averaged clearance estimates depending on the operating conditions of the rotating machine. Other aspects of the processing system include the use of two digital signal processors: a first digital signal processor configured to receive signals from a clearance sensor and perform a first set of high speed processing tasks, and a second digital signal processor configured to receive signals from the first digital signal processor and perform a second set of lower speed processing tasks.07-29-2010
20100242293TIME-INDICATING RUB PIN FOR TRANSIENT CLEARANCE MEASUREMENT AND RELATED METHOD - A transient clearance measurement apparatus for determining a minimum clearance between stationary and rotating components includes: at least one rub pin secured to the stationary component and projecting toward a surface of the rotating component. The at least one rub pin has one or more embedded wires completing an electrical circuit, such that, in use, when the at least one rub pin is rubbed by the surface of the rotating component, the electrical circuit is broken.09-30-2010

Patent applications by Mahadevan Balasubramaniam, Ballston Lake, NY US

Vaidyanathan Balasubramaniam, Albany, NY US

Patent application numberDescriptionPublished
20100216310Process for etching anti-reflective coating to improve roughness, selectivity and CD shrink - A method of dry developing an anti-reflective coating (ARC) layer on a substrate is described. The method comprises disposing a substrate comprising a multi-layer mask in a plasma processing system, wherein the multi-layer mask comprises a lithographic layer overlying a silicon-containing ARC layer and wherein the lithographic layer comprises a feature pattern formed therein using a lithographic process. The method further comprises: introducing a process gas to the plasma processing system according to a process recipe, the process gas comprising a nitrogen-containing gas, a hydrogen-containing gas, and a C08-26-2010
20100243604Method of pattern etching a dielectric film while removing a mask layer - A method of pattern etching a thin film on a substrate is described. The method comprises preparing a film stack on a substrate, wherein the film stack comprises a dielectric layer formed on the substrate and a mask layer formed above the dielectric layer. A pattern is created in the mask layer, and the pattern is transferred from the mask layer to the dielectric layer by performing a plasma etching process. While transferring the pattern to the dielectric layer, the mask layer is substantially removed using the plasma etching process. The plasma etching process can use a process gas comprising a first gaseous component that etches the dielectric layer at a greater rate than the mask layer, and a second gaseous component that etches the dielectric layer at a lesser rate than the mask layer.09-30-2010