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Bakalski

Winfried Bakalski, Muenchen DE

Patent application numberDescriptionPublished
20080303117Integrated circuit with multi-stage matching circuit - An integrated circuit with a multi-stage matching circuit with an inductive conductive structures with a first end and a second end in the integrated circuit and a capacitor structure in the integrated circuit connected to a tap between the ends of the inductive conductive structure between the inductive conductive structure and a reference potential.12-11-2008
20080303165CIRCUIT ARRANGEMENT AND INTEGRATED CIRCUIT - A circuit arrangement includes a plurality of type-identical and identically operated active components, or separate sections of an active component, and includes a branched wiring structure for the interconnection of component connections. In each case the wiring end portions lie between a branching point and an input of different components or sections, wherein the wiring end portions are formed with predetermined geometrical asymmetry with respect to one another in such a way that there is an electrical symmetry of the interconnection configuration between all the connected type-identical components or sections. More particularly, the impedance values between the branching point and the different inputs and outputs are substantially identical.12-11-2008
20110026174Electrostatic Discharge Protection Element and Electrostatic Discharge Protection Chip and Method of Producing the Same - An electrostatic discharge (ESD) protection element is described, the ESD protection element including a collector area, a first barrier area, a semiconductor area, a second barrier area and an emitter area. The collector area has a first conductivity type. The first barrier area borders on the collector area and has a second conductivity type. The semiconductor area borders on the first barrier area and is an intrinsic semiconductor area, or has the first or second conductivity type and a dopant concentration which is lower than a dopant concentration of the first barrier area. The second barrier area borders on the semiconductor area and has the second conductivity type and a higher dopant concentration than the semiconductor area. The emitter area borders on the second barrier area and has the first conductivity type.02-03-2011

Patent applications by Winfried Bakalski, Muenchen DE

Winfried Bakalski, Munchen DE

Patent application numberDescriptionPublished
20100052789Power Amplifier With Output Power Control - This disclosure relates systems and methods for a power amplifier with output power control. The power amplifier can include multiple stages of amplification. An RF signal is fed to the power amplifier with output control that amplifies the power of the RF signal to meet operational requirements. A first stage of the power amplifier controls the output power via voltage regulation. An isolating device is introduced in the transmission path of the RF signal between the first stage and the following stages of the power amplifier. The isolating device ensures that the load impedance of the first stage remains fixed at a constant value.03-04-2010

Patent applications by Winfried Bakalski, Munchen DE

Winfried Bakalski, Munich DE

Patent application numberDescriptionPublished
20090015334Bypass Circuit for Radio-Frequency Amplifier Stages - An amplifier circuit includes an amplifier and a phase shifter coupled in parallel to the amplifier and switchable such that the phase shifter has a first impedance for an alternating signal in an on state and has a second impedance for the alternating signal in an off state. The second impedance is higher than the first impedance.01-15-2009