Patent application number | Description | Published |
20080260337 | Epoxy-Functional Polysiloxanes, Silicone Composition, and Coated - Epoxy-functional polysiloxanes containing epoxy groups and hydrocarbyl groups free of aliphatic unsaturation, a silicone composition containing a polysiloxane selected from the aforementioned epoxy-functional polysiloxanes, a cured polysiloxane prepared by exposing the silicone composition to ultraviolet radiation, a coated optical fiber containing a cured polysiloxane, and a method of preparing a coated optical fiber. | 10-23-2008 |
20090146175 | THERMAL STABLE TRANSPARENT SILICONE RESIN COMPOSITIONS AND METHODS FOR THEIR PREPARATION AND USE - A curable silicone composition includes (A) a polydiorganosiloxane having an average, per molecule, of at least two aliphatically unsaturated organic groups and at least one aromatic group; (B) a branched polyorganosiloxane having an average, per molecule, of at least one aliphatically unsaturated organic group and at least one aromatic group; (C) a polyorganohydrogensiloxane having an average per molecule of at least two silicon-bonded hydrogen atoms and at least one aromatic group, (D) a hydrosilylation catalyst, and (E) a silylated acetylenic inhibitor. The curable silicone composition cures to form a cured silicone resin having a refractive index >1.40. The curable silicone composition cures by heating to form a cured silicone resin with an optical transparency >95% at a thickness of 2.0 mm or less at 400 nm wavelength after thermal aging by heating at 200° C. for 14 days. | 06-11-2009 |
20110070438 | Epoxy-Functional Polysiloxanes, Silicone Composition, and Coated Optical Fiber - Epoxy-functional polysiloxanes containing epoxy groups and hydrocarbyl groups free of aliphatic unsaturation, a silicone composition containing a polysiloxane selected from the aforementioned epoxy-functional polysiloxanes, a cured polysiloxane prepared by exposing the silicone composition to ultraviolet radiation, a coated optical fiber containing a cured polysiloxane, and a method of preparing a coated optical fiber. | 03-24-2011 |
20120065343 | Silicone Composition for Producing Transparent Silicone Materials and Optical Devices - A hydrosilylation curable composition contains a combination of high and low viscosity polyorganosiloxanes, a silicone resin, a crosslinker, and a catalyst. The composition, and the cured product thereof, is useful in optical devices such as charged coupled devices (CCDs), light emitting diodes (LEDs), lightguides, optical cameras, photo-couplers, and waveguides. Processes for fabricating the optical devices include various molding techniques, including overmolding. | 03-15-2012 |
Patent application number | Description | Published |
20130003728 | PROVIDING EXTENDED ADMINISTRATIVE GROUPS IN COMPUTER NETWORKS - In general, techniques are described for providing extended administrative groups in networks. A network device comprising an interface and a control unit may implement the techniques. The interface receives a routing protocol message that advertises a link. This message includes a field for storing first data associated with the link in accordance with the routing protocol. The field is defined by the routing protocol as a field having a different function from an administrative group field defined by the same routing protocol. The control unit determines that this field has been repurposed to store second data, wherein this second data specifies an extended administrative group for the link different from those that may be specified by the administrative group field. The control unit then updates routing information to associate the advertised link with the extended administrative group and performs path selection to select paths based on the updated routing information. | 01-03-2013 |
20130322236 | CONGESTION MANAGMENT FOR FIBRE CHANNEL OVER ETHERNET OVER WIDE AREA NETWORKS - In general, techniques are described for mapping WAN conditions to appropriate back-pressure mechanisms at the WAN edges to improve the performance of delay and/or loss-sensitive applications. In one example, a system includes a wide area network having a provider edge (PE) router to establish a Fibre Channel over Ethernet (FCoE) pseudowire over the wide area network. A Lossless Ethernet network attaches, by an attachment circuit, to the FCoE pseudowire at the PE router. A Fibre Channel Fabric connects to the Lossless Ethernet network and to a storage device that provides data for transmission over the wide area network by the FCoE pseudowire. The PE router detects a defect in the FCoE pseudowire and, in response to detecting the defect in FCoE pseudowire, injects an FCoE flow control extension into the Lossless Ethernet network by the attachment circuit. | 12-05-2013 |
20150063802 | DYNAMIC END-TO-END NETWORK PATH SETUP ACROSS MULTIPLE NETWORK LAYERS - A centralized controller provides dynamic end-to-end network path setup across multiple network layers. In particular, the centralized controller manages end-to-end network path setup that provisions a path at both the transport network layer (e.g., optical) and the service network layer (e.g., IP/MPLS). The centralized controller performs path computation for an optical path at the transport network layer and for a path at the service network layer that transports network traffic on the underlying optical transport path, based on information obtained by the centralized controller from the underlying network components at both layers. | 03-05-2015 |
Patent application number | Description | Published |
20090244867 | METHODS OF FABRICATING MULTICHIP PACKAGES AND STRUCTURES FORMED THEREBY - Methods and associated structures of forming a discontinuous sealant on a substrate, wherein an opening is formed at an integrated heat spreader gap region, wherein the substrate comprises a portion of a multi chip microelectronic package. A thermal interface material is placed on a top surface of a high power die disposed on the substrate, and then an integrated heat spreader lid is placed on top of the sealant and on top of the thermal interface material. A molding compound is flowed within an integrated heat spreader cavity through the opening directly on a top surface of a low power die disposed on the substrate. | 10-01-2009 |
20090298235 | CLIPLESS INTEGRATED HEAT SPREADER PROCESS AND MATERIALS - In one or more embodiments, a method comprising applying thermo compression to a package assembly including a lid, a die, and a package substrate to assemble the package assembly is disclosed. The method may include assembling the package assembly without coupling a biasing mechanism to the lid. Heat may be applied to a bond head coupled with a pick and place tool. Heat may be applied to a bond stage coupled to a carrier for holding the package assembly during processing. An adhesive applied to the lid or package substrate may be allowed to at least partially cure. The method may further include, in an oven, reflowing a thermal interface material (TIM) coupled to the lid and the die, curing the TIM, and/or curing the adhesive, without using clips. | 12-03-2009 |
20110129963 | Clipless Integrated Heat Spreader Process and Materials - In one or more embodiments, a method comprising applying thermo compression to a package assembly including a lid, a die, and a package substrate to assemble the package assembly is disclosed. The method may include assembling the package assembly without coupling a biasing mechanism to the lid. Heat may be applied to a bond head coupled with a pick and place tool. Heat may be applied to a bond stage coupled to a carrier for holding the package assembly during processing. An adhesive applied to the lid or package substrate may be allowed to at least partially cure. The method may further include, in an oven, reflowing a thermal interface material (TIM) coupled to the lid and the die, curing the TIM, and/or curing the adhesive, without using clips. | 06-02-2011 |
Patent application number | Description | Published |
20140151009 | THERMAL INTERFACE ELEMENT AND METHOD OF PREPARATION - An article and method of assembling the article is disclosed. The method of assembling includes positioning a pre-fabricated thermal interface element between a heat source and a heat-sink. The pre-fabricated thermal interface element includes an indium substrate and a plurality of nanosprings disposed on the indium substrate. | 06-05-2014 |
20140160677 | ELECTRONIC DEVICE COOLING WITH MICROJET IMPINGEMENT AND METHOD OF ASSEMBLY - An integrated circuit device including a die with a substrate with a first surface and a second surface opposite the first surface is provided. The die includes at least one circuit element positioned on the first surface. Formed on the second surface, is a wetting feature that includes an array of spaced-apart nanoscale structures and/or an array of spaced-apart microscale structures. The wetting feature also includes a wettability coating applied to at least a portion of the second surface. The integrated circuit device includes a spacer coupled to the die adjacent to the second surface. In addition, an injector plate is coupled to the spacer. The injector plate includes at least one microjet and at least one exit hole defined through the injector plate. The at least one exit hole is positioned adjacent to the at least one microjet. | 06-12-2014 |
20140185778 | MULTILAYER X-RAY SOURCE TARGET WITH HIGH THERMAL CONDUCTIVITY - In one embodiment, an X-ray source is provided that includes one or more electron emitters configured to emit one or more electron beams and one or more source targets configured to receive the one or more electron beams emitted by the one or more electron emitters and, as a result of receiving the one or more electron beams, to emit X-rays. Each source target of the X-ray source includes a first layer having one or more first materials; and a second layer in thermal communication with the first layer and having one or more second materials. The first layer is positioned closer to the one or more emitters than the second layer, the first material has a higher overall thermal conductivity than the second layer, and the second layer produces the majority of the X-rays emitted by the source target. | 07-03-2014 |
Patent application number | Description | Published |
20110017454 | METHOD AND APPARATUS OF HEAT DISSIPATERS FOR ELECTRONIC COMPONENTS IN DOWNHOLE TOOLS - Devices and related methods for reducing a thermal loading of one or more components may include a housing having an interior for receiving the component(s), and a thermally conductive flowable material in thermal communication to the component(s). | 01-27-2011 |
20140174103 | SYSTEMS AND METHODS FOR OXIDATION OF BOIL-OFF GAS - A system in one embodiment includes a mixing module, an oxidation module, and a heat exchanger. The mixing module is configured to receive and mix a boil-off gas stream from a cryotank. The oxidation module is configured to receive the mixed stream, and to oxidize the boil-off gas in the mixed stream to produce an exhaust stream. The heat exchanger is configured to exchange heat between streams passing through a first passage configured to receive at least a portion of the exhaust stream, and a second passage configured to receive a fluid including the boil-off gas. The heat exchanger is configured to heat the fluid including the boil-off gas and cool the at least a portion of the exhaust stream. The fluid including the boil-off gas is heated by the heat exchanger upstream of the oxidation module. | 06-26-2014 |
20140174105 | SYSTEMS AND METHODS FOR RE-CONDENSATION OF BOIL-OFF GAS - A system in one embodiment includes a heat exchanger, a detection unit, and a controller. The heat exchanger includes a first passage and a second passage configured for exchange of heat therebetween. The first passage is configured to receive a boil-off gas stream of a first cryogenic fluid. The second passage is configured to receive a liquid stream of a second cryogenic fluid. The detection unit is configured to detect a characteristic of the boil-off gas stream. The controller is configured to, responsive to information acquired from the detection unit corresponding to the characteristic, control the flow of the second cryogenic fluid to provide sufficient exchange of heat from the boil-off gas stream via the heat exchanger to condense at least a portion of the boil-off gas stream. A liquid stream of the first cryogenic fluid is output from the first passage and returned to a first tank. | 06-26-2014 |
20150083227 | REDUCED FLUID DRAG ACROSS A SOLID SURFACE WITH A TEXTURED COATING - An article includes a substrate with a coating having asperities such that an average spacing between the asperities is between about 0.01 and about 1.5 micron. An average surface roughness of the coating is up to about 2 microns, and an average porosity of the coating is in the range from about 35% to about 70%. A material to reduce surface energy is disposed on the coating. A method for making such an article and a method for decreasing fluid drag across such an article are also provided. | 03-26-2015 |