Inventors list |
Assignees list |
Classification tree browser |
Top 100 Inventors |
Top 100 Assignees |
Bahadur, US
Ali N. Bahadur, South Jordan, UT US
| Patent application number | Description | Published |
|---|---|---|
| 20100183212 | METHODS AND COMPOSITIONS FOR IMAGING CARTILAGE AND BONE - The present invention relates in general to compositions, processes and apparatus for imaging, and in particular for improved preparation, collection and processing of images of specimens that include cartilage, particularly specimens of intact or disarticulated joints. Images of specimens according to the present invention include images obtained from X-ray microscopic computed tomography. | 07-22-2010 |
Ali N. Bahadur, San Antonio, TX US
| Patent application number | Description | Published |
|---|---|---|
| 20090080600 | PROCESS AND APPARATUS FOR IMAGING - Processes for producing a microCT image for virtual histology using x-ray microscopic computed tomography are described along with processes for rapid and inexpensive high-throughput methods of high resolution imaging for screening an ex vivo embryo for phenotype using computed tomography imaging. Staining of particular components of specimens with one or more staining agents is described which contributes to high quality image generation and identification of anatomical structures as well as localization of molecular targets. Inventive animal and specimen holders are detailed which allow for reduced post-imaging processing of generated images. In particular, animal and specimen holders are provided which include a highly transparent bed or liner which separates the animal or specimen from a less transparent structure. A further animal holder is provided for placing and/or maintaining the animal in a desired position during an imaging procedure or multiple imaging procedures including a bed conforming to the animal's body. | 03-26-2009 |
Maneesh Bahadur, Midland, MI US
| Patent application number | Description | Published |
|---|---|---|
| 20080260337 | Epoxy-Functional Polysiloxanes, Silicone Composition, and Coated - Epoxy-functional polysiloxanes containing epoxy groups and hydrocarbyl groups free of aliphatic unsaturation, a silicone composition containing a polysiloxane selected from the aforementioned epoxy-functional polysiloxanes, a cured polysiloxane prepared by exposing the silicone composition to ultraviolet radiation, a coated optical fiber containing a cured polysiloxane, and a method of preparing a coated optical fiber. | 10-23-2008 |
| 20090146175 | THERMAL STABLE TRANSPARENT SILICONE RESIN COMPOSITIONS AND METHODS FOR THEIR PREPARATION AND USE - A curable silicone composition includes (A) a polydiorganosiloxane having an average, per molecule, of at least two aliphatically unsaturated organic groups and at least one aromatic group; (B) a branched polyorganosiloxane having an average, per molecule, of at least one aliphatically unsaturated organic group and at least one aromatic group; (C) a polyorganohydrogensiloxane having an average per molecule of at least two silicon-bonded hydrogen atoms and at least one aromatic group, (D) a hydrosilylation catalyst, and (E) a silylated acetylenic inhibitor. The curable silicone composition cures to form a cured silicone resin having a refractive index >1.40. The curable silicone composition cures by heating to form a cured silicone resin with an optical transparency >95% at a thickness of 2.0 mm or less at 400 nm wavelength after thermal aging by heating at 200° C. for 14 days. | 06-11-2009 |
| 20110070438 | Epoxy-Functional Polysiloxanes, Silicone Composition, and Coated Optical Fiber - Epoxy-functional polysiloxanes containing epoxy groups and hydrocarbyl groups free of aliphatic unsaturation, a silicone composition containing a polysiloxane selected from the aforementioned epoxy-functional polysiloxanes, a cured polysiloxane prepared by exposing the silicone composition to ultraviolet radiation, a coated optical fiber containing a cured polysiloxane, and a method of preparing a coated optical fiber. | 03-24-2011 |
Nitin Bahadur, San Francisco, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20110170426 | LSP PING AND TRACEROUTE FOR BYPASS TUNNELS - A method performed by a network device may include assembling a multiprotocol label switching (MPLS) echo request, the echo request including an instruction for a transit node to forward the echo request via a bypass path associated with the transit node, and an instruction for an egress node to send an echo reply indicating that the echo request was received on the bypass path. The method may also include sending the MPLS echo request over a functioning label switched path (LSP). | 07-14-2011 |
Raj Bahadur, Gilbert, AZ US
| Patent application number | Description | Published |
|---|---|---|
| 20090244867 | METHODS OF FABRICATING MULTICHIP PACKAGES AND STRUCTURES FORMED THEREBY - Methods and associated structures of forming a discontinuous sealant on a substrate, wherein an opening is formed at an integrated heat spreader gap region, wherein the substrate comprises a portion of a multi chip microelectronic package. A thermal interface material is placed on a top surface of a high power die disposed on the substrate, and then an integrated heat spreader lid is placed on top of the sealant and on top of the thermal interface material. A molding compound is flowed within an integrated heat spreader cavity through the opening directly on a top surface of a low power die disposed on the substrate. | 10-01-2009 |
| 20090298235 | CLIPLESS INTEGRATED HEAT SPREADER PROCESS AND MATERIALS - In one or more embodiments, a method comprising applying thermo compression to a package assembly including a lid, a die, and a package substrate to assemble the package assembly is disclosed. The method may include assembling the package assembly without coupling a biasing mechanism to the lid. Heat may be applied to a bond head coupled with a pick and place tool. Heat may be applied to a bond stage coupled to a carrier for holding the package assembly during processing. An adhesive applied to the lid or package substrate may be allowed to at least partially cure. The method may further include, in an oven, reflowing a thermal interface material (TIM) coupled to the lid and the die, curing the TIM, and/or curing the adhesive, without using clips. | 12-03-2009 |
| 20110129963 | Clipless Integrated Heat Spreader Process and Materials - In one or more embodiments, a method comprising applying thermo compression to a package assembly including a lid, a die, and a package substrate to assemble the package assembly is disclosed. The method may include assembling the package assembly without coupling a biasing mechanism to the lid. Heat may be applied to a bond head coupled with a pick and place tool. Heat may be applied to a bond stage coupled to a carrier for holding the package assembly during processing. An adhesive applied to the lid or package substrate may be allowed to at least partially cure. The method may further include, in an oven, reflowing a thermal interface material (TIM) coupled to the lid and the die, curing the TIM, and/or curing the adhesive, without using clips. | 06-02-2011 |
Vaibhav Bahadur, Schenectady, NY US
| Patent application number | Description | Published |
|---|---|---|
| 20110017454 | METHOD AND APPARATUS OF HEAT DISSIPATERS FOR ELECTRONIC COMPONENTS IN DOWNHOLE TOOLS - Devices and related methods for reducing a thermal loading of one or more components may include a housing having an interior for receiving the component(s), and a thermally conductive flowable material in thermal communication to the component(s). | 01-27-2011 |
Vaibhav A. Bahadur, Cambridge, MA US
| Patent application number | Description | Published |
|---|---|---|
| 20100112286 | SUPERHYDROPHOBIC SURFACES - Control and switching of liquid droplet states on artificially structured surfaces have applications in the field of microfluidics. The present work introduces the concept of using structured surfaces consisting of non-communicating (closed cell) roughness elements to prevent the transition of a droplet from the Cassie to the Wenzel state (which would result in the irreversible loss of the superhydrophobic non-wetting properties of the surface). The use of non-communicating roughness elements leads to a confinement of the medium under the droplet in its Cassie state. Transition to the Wenzel state on such surfaces many include expulsion of this confined medium, which offers increased resistance to the Wenzel transition unlike surfaces consisting of communicating (open cell) roughness elements. This enhances the robustness of the Cassie state and significantly minimizes the possibility of the Cassie-Wenzel transition under the influence of any external wetting pressure (pressure resulting from self weight of the droplet, dynamic pressure due to droplet impact on the surface, or electrowetting-induced pressure on the droplet). The resistance to the Cassie-Wenzel transition can be further increased by utilizing surfaces with nanostructured (instead of microstructured) non-communicating elements, since the resistance is inversely related to the dimension of the roughness element. The resistance of a surface to the Wenzel transition is measured in terms of the electrowetting (EW) voltage used to trigger this transition. Surfaces with noncommunicating roughness elements (closed cells) exhibited significantly higher voltages to trigger the Wenzel transition than corresponding surfaces with communicating roughness elements. | 05-06-2010 |