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| 20080284961 | LIQUID CRYSTAL DISPLAY AND A METHOD FOR MANUFACTURING THE SAME - A liquid crystal display includes opening patterns in the electrodes or protrusions on the electrodes. The opening patterns or the protrusions have a pattern which controls the direction of the liquid crystal molecules. Thus the quality of the LCD can be improved. | 11-20-2008 |
| 20090294771 | THIN FILM TRANSISTOR ARRAY PANEL HAVING A MEANS FOR ARRAY TEST - A substrate for a display panel includes a base substrate, a plurality of signal lines, a plurality of signal pads corresponding to first end portions of the signal lines, a shorting bar corresponding to second end portions of the signal lines, a plurality of bridge lines on the base substrate disposed between the signal line and the shorting bar which electrically connects the signal line and the shorting bar. A color filter array panel opposite a TFT LCD panel substrate includes a medium dam layer which fully overlaps the bridge lines of the TFT LCD panel substrate. A data TFT for inspection having a source electrode coupled to the signal line, a drain electrode coupled to any one of the shorting bars, and a gate electrode coupled to a data TFT driving signal line ensures the normal operation of the display panel after the array test. | 12-03-2009 |
| 20110156046 | PHOTOMASK AND THIN-FILM TRANSISTOR FABRICATED USING THE PHOTOMASK - A photomask includes; a source electrode pattern including; a first electrode portion which extends in a first direction, a second electrode portion which extends in the first direction and is substantially parallel to the first electrode portion, and a third electrode portion which extends from a first end of the first electrode portion to a first end of the second electrode portion and is rounded with a first curvature, a drain electrode pattern which extends in the first direction and is disposed between the first electrode portion and the second electrode portion, wherein an end of the drain electrode pattern is rounded to correspond to the third electrode portion; and a channel region pattern which is disposed between the source electrode pattern and the drain electrode pattern, wherein a center location of the first curvature and a center location of the rounded portion of the end of the drain electrode pattern are the same. | 06-30-2011 |
| 20110187978 | LIQUID CRYSTAL DISPLAY AND METHOD FOR MANUFACTURING THE SAME - A liquid crystal display includes opening patterns in the electrodes or protrusions on the electrodes. The opening patterns or the protrusions have a pattern which controls the direction of the liquid crystal molecules. Thus the quality of the LCD can be improved. | 08-04-2011 |
| 20130093658 | DISPLAY DEVICE - A display device includes gate lines, data lines, first wires and second wires extending in the directions of the gate lines and data lines, and pixels having a first subpixel and a second subpixel each. The first subpixel has a first subpixel electrode and a first switching element, and the second subpixel has a second subpixel electrode and second and third switching elements. The control terminals of the three switching elements are connected to the same gate line, and the input terminals of the first and second switching elements are connected to the same data line. The first and second switching elements have output terminals connected to the first and second subpixel electrodes, respectively. The second switching element's output terminal connects to the third switching element, which has an output terminal connected to a second wire. The first wires and the second wires are connected in a pixel. | 04-18-2013 |
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| 20090268179 | METHOD OF ALIGNING AN EXPOSURE APPARATUS, METHOD OF EXPOSING A PHOTORESIST FILM USING THE SAME AND EXPOSURE APPARATUS FOR PERFORMING THE METHOD OF EXPOSING A PHOTORESIST FILM - An origin of a reference coordinate system is assigned to one of a plurality of center points, and center point coordinates according to the reference coordinate system are assigned to remaining center points, so that reference marks successively correspond to center points of a plurality of microscopes fixed to a base. Beam position detection marks disposed between the reference marks with exposure points of exposure heads fixed to the base are crossed to assign beam coordinates according to the reference coordinate system to the exposure points. Thus, alignment may be easily and accurately performed, and is effective for increasingly larger apparatuses. | 10-29-2009 |
| 20100097591 | Exposure apparatuses and methods - An exposure apparatus may include: a stage configured to move a substrate; an optical unit configured to generate and project a plurality of laser beams; and a control unit configured to measure straightness of the stage by controlling the projection of the laser beams to an exposed surface of the substrate while moving the stage. A method to measure straightness of a stage in an exposure apparatus may include: placing a substrate on the stage; moving the stage and substrate; generating a plurality of laser beams; projecting the laser beams to the substrate on the stage; and measuring the straightness of the stage by projecting the laser beams to an exposed surface of the substrate. | 04-22-2010 |
| 20100110214 | Exposure apparatuses and methods to compress exposure data - A method to compress exposure data may include converting image data into a plurality of exposure data, generating new exposure data by combining part of the plurality of exposure data or by excluding part of the plurality of exposure data, and compressing the new exposure data. An exposure apparatus may include a conversion unit that converts image data into a plurality of exposure data, a control unit that generates new exposure data by combining part of the plurality of exposure data or by excluding part of the plurality of exposure data, and a compression unit that compresses the new exposure data. | 05-06-2010 |
| 20110090478 | Lens barrel support device and maskless exposure apparatus having the same - Provided is a barrel support device for supporting a lens barrel. The barrel support device may include a guide frame configured to laterally support the lens barrel and tilt with the lens barrel, a rotation guide on a first end of the guide frame, the rotation guide being ring shaped and configured attach the lens barrel to the guide frame, and a ring-shaped tilting frame configured to support a second end of the guide frame and tilt the guide frame, wherein the guide frame, the rotation guide, and the tilting frame are configured to allow the lens barrel to pass therethrough. | 04-21-2011 |
| 20110149297 | Maskless exposure apparatus and multi-head alignment method thereof - Example embodiments are directed to a mask-less exposure apparatus configured to expose a pattern on a substrate using a light modulation device and a multi-head alignment method thereof. According to example embodiments, a beam measurement device measures positions and focuses of at least three beams from among a plurality of beams emitted from multiple heads, the measurement enabling alignment of a position and an angle of a lens barrel deviated from a reference position according to an error in position and focus of the measured at least three beams. | 06-23-2011 |
| 20110149301 | Beam position measuring apparatus and method - A beam position measuring apparatus and method using a beam expansion device may expand areas of beams irradiated onto a beam detection sensor. The beam expansion device is configured to expand areas of the beams onto the beam detection sensor is installed between a beam generator and the beam detection sensor. Central positions of the irradiated beams are detected using intensities of beams irradiated onto respective pixels of the beam detection sensor. | 06-23-2011 |
| 20110154661 | Method of fabricating printed circuit board assembly - Disclosed herein is a method for fabricating a printed circuit board assembly by adhering an element to a printed circuit board without using any solder. The printed circuit board may be fabricated by sequentially applying a conductor-containing first ink and an insulator-containing second ink onto a base substrate by ink-jet printing to form a printed circuit board, mounting an element on the printed circuit board such that an electrode of the element contacts a conductive layer and curing the conductive layer at a high temperature. | 06-30-2011 |
| 20110157569 | Maskless exposure apparatus and control method thereof - Example embodiments are directed to a maskless exposure apparatus that generates and/or corrects exposure data using at least one information of intensity information, central position information, focus information, and/or shape information of a plurality of beams acquired using a measurement optical system, and a control method thereof. The maskless exposure apparatus includes the measurement optical system including a photo sensor and an image sensor, and a control unit configured to generate and/or correct the exposure data using the information acquired by the measurement optical system. | 06-30-2011 |
| 20110181856 | Auto-focusing device and method for maskless exposure apparatus - Example embodiments are directed to an auto-focusing device for use in a maskless exposure apparatus that performs a beam focus calibration and an auto-focusing method using the same. The auto-focusing device includes a projection optical unit, a focus calibration unit, and a controller. The projection optical unit includes a distance measurement sensor and a focus controller that generate a beam of light. The focus calibration unit includes a substrate having a reference mark on which the beam generated from the projection optical unit is illuminated, a measuring optical unit configured to obtain image information of the beam illuminated on the reference mark, and a stage configured to support the substrate and the measuring optical unit. The controller is configured to control the focus controller so that a beam of the beam generated from the measuring optical unit is located on the surface of an exposed member. | 07-28-2011 |
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| 20080311691 | Method of Manufacturing Image Sensor - Provided is a method of manufacturing an image sensor. A microlens of inorganic material can be formed on a substrate by forming a seed microlens having a top surface with height differences, and then blanket etching the seed microlens to form a dome shaped microlens having a curvature following the height differences of the seed microlens. The height differences in the top surface of the seed microlens can be created by implanting nitrogen at different depths into an inorganic layer to form ion implantation regions, and removing the ion implantation regions from the inorganic layer. | 12-18-2008 |
| 20080315271 | IMAGE SENSOR AND METHOD FOR FABRICATING THE SAME - Disclosed are an image sensor and a method for fabricating the same. The method may include forming a gate, a photo diode, and a floating diffusion region on a pixel region of a semiconductor substrate; forming an oxide film on the pixel region and on an edge region of the semiconductor substrate; forming a sacrificial oxide layer by etching the oxide film using a photoresist pattern as a mask; forming a metal layer on the photoresist pattern, the gate, and the floating diffusion region; forming a salicide layer on the gate and the floating diffusion region; etching a remaining non-salicided portion of the metal layer, the photoresist pattern, and at least a portion of the sacrificial oxide layer; and forming an interlayer insulating film on the semiconductor substrate and planarizing the interlayer insulating film. | 12-25-2008 |
| 20090095968 | Image Sensor and Method for Manufacturing the Same - Provided are an image sensor and a method for manufacturing the same. A trench can be formed through metal interconnection layers of the image sensor in a region corresponding to a light receiving device for each unit pixel. A passivation layer pattern can be provided at sidewalls of the trench to inhibit light incident into the metal interconnection layers and reduce cross-talk and noise. A filler material can be provided to fill the trench. A color filter layer and microlens can be formed on the filler material. The filler material can be, for example, a polymer, an oxide layer, or a photoresist. | 04-16-2009 |
| 20090142901 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE - A method for fabricating a semiconductor device is disclosed. The method includes: forming a photoresist film on a semiconductor substrate including a silicide forming region and non-silicide forming region; forming a photoresist pattern as a non-salicide pattern by patterning the photoresist film, so as to cover the non-silicide forming region and open the silicide forming region, with an overhang structure that a bottom is removed more compared to a top; forming a metal film on a top of the photoresist pattern and overall the semiconductor substrate in the silicide forming region; stripping the photoresist pattern and the metal film on the photoresist pattern; and forming a silicide metal film by annealing the metal film remaining on the semiconductor substrate. Therefore, the present invention simplifies a salicide process of a semiconductor device, making it possible to improve yields. | 06-04-2009 |
| 20090146302 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - Embodiments relate to a method for manufacturing a semiconductor device, and in particular to a method for manufacturing a semiconductor device capable of simplifying a silicide manufacturing process using a photo resist overhang structure. According to embodiments, a surface is subjected to a monochlorobenzene coating processing to cure the surface of the exposed photo resist so as not to react with developing solution and such a processed photo resist is developed to make the lower of the photo resist in the overhang structure so as to form an accurate pattern according to the clear removal of the oxide film, making it possible to simply manufacture the silicide and the non-silicide without performing an etching process by a subsequent cobalt deposition process. | 06-11-2009 |
| 20090152735 | Metal Interconnection and Method for Manufacturing the Same in a Semiconductor Device - Provided is a method for manufacturing a metal interconnection in a semiconductor device. The semiconductor device fabricated according to one embodiment comprises a copper interconnection having reduced sheet and contact resistance. In the method for manufacturing the copper interconnection, a dielectric comprising a via hole is formed on a semiconductor substrate. A diffusion barrier is deposited in the via hole of the dielectric using a process including a plasma enhanced atomic layer deposition (PEALD) process. A copper metal layer can be formed on the via hole through an electroplating process. | 06-18-2009 |
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| 20090133906 | FLEXIBLE PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A flexible printed circuit board (FPCB) and FPCB manufacturing method that improves a signal transfer characteristic at a high speed. The FPCB includes an insulating layer having a signal pattern that transfers signals, a cover layer formed on the signal pattern, and a shielding layer formed at a position opposite to the signal pattern. The shielding layer faces at least one of the insulating layer and the cover layer across anspace formed there between. | 05-28-2009 |
| 20100151916 | METHOD AND APPARATUS FOR SENSING GRIP ON MOBILE TERMINAL - A method and apparatus for sensing a grip on a mobile terminal are provided, in which the mobile terminal is switched to a manner mode, when grip sensors on both side surfaces of the mobile terminal are touched simultaneously, upon receipt incoming call, the call is started, if a vicinity sensor senses the user's face nearby in the manner mode, and the call is ended, if the vicinity sensor senses that the user's face is receding from the mobile terminal. | 06-17-2010 |
| 20100208308 | METHOD AND APPARATUS FOR RECOGNIZING CHARACTERS - A method and apparatus are provided for recognizing characters in a portable terminal with a scan module. Scanned image data is generated by the scan module by scanning a scan target through a scanning-light input/output panel provided on an external surface of the portable terminal as the portable terminal moves across the scan target. Part of the scanned image data is deleted when a current moving speed of the portable terminal is less than a lower limit of an optimal scan speed range, and character recognition is performed on remaining scanned image data. Image data most similar to the scanned image data is detected from a previously stored correction image database when the current moving speed is greater than an upper limit of the optimal scan speed range, and characters corresponding to the detected image data are output as character recognition results. | 08-19-2010 |
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| 20080212425 | APPARATUS AND METHOD TO WRITE/REPRODUCE DATA TO/FROM OPTICAL DISC - An apparatus and method to write/reproduce data to/from an optical disc, which are capable of preventing an error from occurring at the time of examination of a writing strategy and searching for an optimum writing condition for a short period of time, by examining the writing strategy after adjusting a focus in a test region, in order to set a writing condition at the time of writing data. The apparatus to write/reproduce data to/from an optical disc includes a matrix jitter measuring unit which measures length errors and jitters of edges of a mark and a space of a written data pattern from an RF signal generated at the time of reproduction of the optical disc; and a CPU which extracts at least one of the RF signal, a jitter and an error rate, controls a focus bias, and performs an optimum power calibration (OPC) for searching for optimum power of laser. | 09-04-2008 |
| 20110090777 | OPTICAL REPRODUCING APPARATUS CONNECTABLE TO OPTICAL PICKUPS AND METHOD OF CONTROLLING OPTICAL PICKUPS - An optical reproducing apparatus connectable to optical pickups and a method of controlling an optical pickup thereof are provided. The optical reproducing apparatus measures resistance of an optical pickup on a port of a connection unit to which the optical pickup is connected, and determines the type of the optical pickup according to the measured resistance. Accordingly, optical reproducing apparatuses may be controlled according to the type of optical pickups, and manufactured using various optical pickups without checking the type of optical pickups, which allows convenient manufacturing of optical reproducing apparatuses. | 04-21-2011 |
| 20120278602 | ELECTRONIC APPARATUS AND METHOD FOR PROVIDING FIRMWARE THEREOF - An electronic apparatus and a method for providing firmware thereof are provided. The electronic apparatus includes a plurality of components which perform a function of the electronic apparatus; a common memory unit which stores respective firmware for each of the plurality of components; a system bus which connects the plurality of components with the common memory unit; and a control unit which transmits from the common memory unit, after an apparatus boot, firmware corresponding to each of the plurality of components, wherein the plurality of components each establish respective connections to the system bus by executing a boot code when the electronic apparatus is booted. | 11-01-2012 |
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| 20090189229 | Semiconductor devices and methods of fabricating the same - Provided are semiconductor devices and methods of fabricating the same, and more specifically, semiconductor devices having a W—Ni alloy thin layer that has a low resistance, and methods of fabricating the same. The semiconductor devices include the W—Ni alloy thin layer. The weight of Ni in the W—Ni alloy thin layer may be in a range from approximately 0.01 to approximately 5.0 wt % of the total weight of the W—Ni alloy thin layer. | 07-30-2009 |
| 20100120211 | Methods of manufacturing Semiconductor Devices Including PMOS and NMOS Transistors Having Different Gate Structures - A semiconductor device may include a semiconductor substrate having first and second regions. A first gate structure on the first region of the semiconductor substrate may include a metal oxide dielectric layer on the first region of the semiconductor substrate and a first conductive layer on the metal oxide dielectric layer. First and second source/drain regions of a first conductivity type may be provided in the first region of the semiconductor substrate on opposite sides of the first gate structure. A second gate structure on the second region of the semiconductor substrate may include a silicon oxide based dielectric layer and a second conductive layer on the silicon oxide based dielectric layer. First and second source/drain regions of a second conductivity type may be provided in the second region of the semiconductor substrate on opposite sides of the second gate structure, wherein the first and second conductivity types are different. Related methods are also discussed. | 05-13-2010 |
| 20100210105 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE HAVING BURIED WIRING - A method of fabricating a semiconductor device can include forming a trench in a semiconductor substrate, forming a first conductive layer on a bottom surface and side surfaces of the trench, and selectively forming a second conductive layer on the first conductive layer to be buried in the trench. The second conductive layer may be formed selectively on the first conductive layer by using an electroless plating method or using a metal organic chemical vapor deposition (MOCVD) or an atomic layer deposition (ALD) method. | 08-19-2010 |
| 20120083117 | Method Of Forming Hardened Porous Dielectric Layer And Method Of Fabricating Semiconductor Device Having Hardened Porous Dielectric Layer - Example embodiments relate to a method of forming a hardened porous dielectric layer. The method may include forming a dielectric layer containing porogens on a substrate, transforming the dielectric layer into a porous dielectric layer using a first UV curing process to remove the porogens from the dielectric layer, and transforming the porous dielectric layer into a crosslinked porous dielectric layer using a second UV curing process to generate crosslinks in the porous dielectric layer. | 04-05-2012 |
| 20120094437 | METHOD OF FORMING THROUGH SILICON VIA OF SEMICONDUCTOR DEVICE USING LOW-K DIELECTRIC MATERIAL - A method of forming through silicon vias (TSVs) includes forming a primary via hole in a semiconductor substrate, depositing low-k dielectric material in the primary via hole, forming a secondary via hole by etching the low-k dielectric in the primary via hole, in such a manner that a via insulating layer and an inter metal dielectric layer of the low-k dielectric layer are simultaneously formed. The via insulating layer is formed of the low-k dielectric material on sidewalls and a bottom surface of the substrate which delimit the primary via hole and the inter metal dielectric layer is formed on an upper surface of the substrate. Then a metal layer is formed on the substrate including in the secondary via hole, and the metal layer is selectively removed from an upper surface of the semiconductor substrate. | 04-19-2012 |
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| 20100262398 | Methods of Selecting Sensors for Detecting Abnormalities in Semiconductor Manufacturing Processes - A method of selecting a sensor in a semiconductor manufacturing process is provided. The method includes measuring responses of a plurality of sensors when a first of a plurality of process conditions is varied, identifying one or more of the sensors having a steady state response after the first of the process conditions is varied, and selecting a sensor having a highest value within a response range from among the sensors having the steady state response for the first process condition that is varied. This methodology may be performed for multiple different process conditions. Thus, when process conditions in multiple processes of manufacturing a semiconductor device are varied, sensors having a steady state response can be selected from among multiple sensors for detecting abnormalities in the processes. | 10-14-2010 |
| 20110140719 | METHOD OF MONITORING SEMICONDUCTOR PROCESS - A method of monitoring a semiconductor process is provided. The method includes preparing a process chamber including first and second electrodes spaced apart from and facing each other, and connecting the first electrode to a ground and connecting the second electrode to a radio frequency power source. An impedance in the process chamber is measured using a voltage value and a current value at the second electrode. The consumption amount of consumables in the process chamber is checked using the impedance. Varied process conditions are adjusted within an initial set range. | 06-16-2011 |
| 20110215072 | PLASMA APPARATUS HAVING A CONTROLLER FOR CONTROLLING A PLASMA CHAMBER AND METHODS FOR CONTROLLING THE PLASMA APPARATUS - Provided is a method for controlling a plasma apparatus. The method includes measuring a plasma spectrum in a plasma chamber by an optical emission spectroscopy, setting a baseline of the measured plasma spectrum, normalizing the measured plasma spectrum by dividing a value of the measured plasma spectrum by a value of the baseline, and controlling the plasma chamber by setting parameters of a plasma process using the normalized plasma spectrum. A plasma apparatus is also provided. | 09-08-2011 |
| 20110295554 | Equipment For Manufacturing Semiconductor Device And Seasoning Process Method Of The Same - Disclosed is an apparatus for processing a semiconductor and a method for generating a seasoning process of a reaction chamber. The method may include generating plasma in the reaction chamber using a production process recipe, obtaining at least one reference measurement value related to a byproduct of the generated plasma, performing a plurality of seasoning tests on the chamber to obtain a plurality of test results, generating an empirical model by forming at least one relational expression correlating variables manipulated during the performing of the plurality of seasoning tests to the plurality of test results, and estimating a seasoning process by using the at least one relational expression to estimate at least one estimated calculation value. | 12-01-2011 |
| 20120055908 | ETCHING SYSTEM AND METHOD OF CONTROLLING ETCHING PROCESS CONDITION - Provided is an etching system and a method of controlling etching process condition. The etching system includes a light source that irradiates incident light into a target wafer, a light intensity measuring unit that measures light intensity according to the wavelength of interference light generated by interference between reflected light beams from the target wafer, a signal processor that detects a time point at which an extreme value in the intensity is generated when the intensity of interference light varies according to the wavelength, and a controller that compares the extreme value generating time point detected from the signal processor with a reference time point corresponding to the extreme value generating time point and controls a process condition according to the comparison result. | 03-08-2012 |
| 20120150330 | METHOD OF CONTROLLING SEMICONDUCTOR PROCESS DISTRIBUTION - A method of controlling process distribution of a semiconductor process includes receiving process distribution data representing the process distribution of the semiconductor process, receiving a parameter related to the process distribution, generating a virtual metrology model corresponding to the process distribution based on a relationship between the process distribution data and the parameter, and modifying a process variable affecting the process distribution based on the virtual metrology model. | 06-14-2012 |
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| 20110096280 | LIQUID CRYSTAL DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - Disclosed are a liquid crystal display device and a method of manufacturing the liquid crystal display device. The liquid crystal display device includes a first insulating substrate, a gate line and a data line formed on the first insulating substrate and crossing each other, a first pixel electrode formed on the first insulating substrate and including a first part and a second part which are physically separated, a second pixel electrode formed on the first insulating substrate and forming an electric field with the first pixel electrode, a connection bridge including at least one conductive layer and electrically connecting the first part with the second part through a contact hole, and at least one insulating layer positioned between the first pixel electrode and the connection bridge, wherein the contact hole is formed in the at least one insulating layer. | 04-28-2011 |
| 20110169799 | LIQUID CRYSTAL DISPLAY AND DRIVING METHOD THEREOF - A liquid crystal display includes a liquid crystal layer disposed between first and second substrates. A gate line transmits gate signals; a first data line transmits data voltages; a first voltage line alternately transmits a first voltage and a second voltage that is than greater than the first voltage; a first switching element is connected to the gate line and the first data line; a second switching element is connected to the gate line and the first voltage line; a first pixel electrode is connected to the first switching element; and a second pixel electrode is connected to the second switching element. The first pixel electrode and the second pixel electrode form a liquid crystal capacitor along with the liquid crystal layer, and at least one of the first voltage and the second voltage is variable. | 07-14-2011 |
| 20110221988 | LIQUID CRYSTAL DISPLAY - A liquid crystal display includes first and second substrates, and a liquid crystal layer disposed therebetween. First and second gate lines are disposed on the first substrate. First and second data lines, and a power line are disposed on the first substrate. A first switching element is connected to the first gate line and the first data line, a second switching element is connected to the first gate line and the power line, a third switching element is connected to the second gate line and the second data line, a first pixel electrode is connected to the first switching element, a second pixel electrode is connected to the second switching element, a third pixel electrode is connected to the second switching element, and a fourth pixel electrode is connected to the third switching element, and a gate-on voltage can be simultaneously applied to the first and second gate lines. | 09-15-2011 |
| 20120320294 | LIQUID CRYSTAL DISPLAY - A liquid crystal display (LCD) including a liquid crystal panel, and a gate driver which applies a gate signal having a driving frequency equal to or greater than 100 Hz to the liquid crystal panel. The liquid crystal panel comprises a first display panel, a second display panel facing the first display panel, and a liquid crystal composition disposed between the first display panel and the second display panel and includes liquid crystals. | 12-20-2012 |
| 20130050157 | DISPLAY DEVICE - A display device includes: a display panel including a display area, and a peripheral area disposed in the vicinity of the display area; a scan driver including a plurality of stages integrated on the peripheral area; a plurality of gate lines connected to the plurality of stages, respectively; and a plurality of pixel rows in the display area and connected with the plurality of gate lines, respectively. The plurality of stages and the plurality of pixel rows are each arranged in a first direction in a line, the peripheral area includes a fan-out region between the plurality of stages and the plurality of pixel rows, and at least one of the plurality of gate lines in the fan-out region is inclined with respect to the first direction, and a second direction perpendicular to the first direction. | 02-28-2013 |
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| 20080304855 | Image forming apparatus with external air circulation chamber - An image forming apparatus capable of minimizing a temperature rise of a cover is disclosed. The image forming apparatus includes a main body, a fusing unit mounted in the main body to fuse an image to paper, a cover mounted to the main body to expose the fusing unit, a heat shielding member mounted proximate to an inner side of the cover to block heat transferred from the fusing unit, an external air circulation chamber formed between the heat shielding member and the cover, in which external air circulates by convection, and at least one external air flow hole, through which the air flows into/out of the external air circulation chamber. | 12-11-2008 |
| 20090052924 | Image forming apparatus with opening/closing member - An image forming apparatus capable of minimizing a temperature rise of a cover by substantially preventing heat emission from a fusing device to an outside is disclosed. The image forming apparatus includes a main body, a fusing device mounted in the main body, the fusing device having an outlet to discharge paper, an opening/closing member opening and closing the outlet of the fusing device, a cam member moving the opening/closing member between a first position in which the opening/closing member closes the outlet to prevent heat in the fusing device from being emitted through the outlet and a second position in which the opening/closing member opens the outlet to permit the paper to pass through the outlet, a driving part rotating the cam member, and a control unit controlling the driving part to determine a rotational position of the cam member. | 02-26-2009 |
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| 20110008653 | POLYMER BATTERY PACK - A polymer battery pack including: a polymer bare cell; a frame surrounding the polymer bare cell and having protrusions formed on a top thereof; and a case positioned on the top of the frame and having grooves formed on a bottom thereof to correspond to the protrusions. The protrusions and the grooves are coupled to each other. | 01-13-2011 |
| 20110039128 | BATTERY PACK AND METHOD OF MANUFACTURING THE SAME - A battery pack and a method of manufacturing the same provide a battery pack that can improve durability against external impacts and increase efficiency in a manufacturing process and reduce the number of manufacturing processes. The battery pack includes a bare cell, a circuit module electrically coupled to the bare cell, a tube-type case surrounding the bare cell, a top cover covering the circuit module, the top cover being coupled to the tube-type case, and a bottom cover covering a bottom surface of the bare cell. | 02-17-2011 |
| 20110039133 | Secondary battery - A battery includes an external terminal, a thermal fuse, a bare cell, an electrode assembly disposed within the bare cell and electrically coupled to the external terminal via the thermal fuse, such that the thermal fuse electrically disconnects the electrode assembly from the external terminal when a temperature of the battery reaches a predetermined value, a top cover, a protective circuit module within the top cover and on the bare cell, and a thermally insulating top sheet disposed on the thermal fuse, between the thermal fuse and the protective circuit module, the top sheet having a recess configured to receive the thermal fuse, such that the top sheet covers the top surface of the thermal fuse. | 02-17-2011 |
| 20110059338 | Battery Pack - A battery pack having increased resistance against an external impact by increasing a coupling strength between a bare cell and a case resulting in increased reliability and quality. The battery pack includes a bare cell; a circuit module electrically connected to the bare cell; a frame case surrounding the bare cell and including a channel groove arranged at a region facing the bare cell; and a coupling reinforcement portion arranged in the channel groove to couple the frame case to the bare cell. | 03-10-2011 |
| 20110086244 | SECONDARY BATTERY - A secondary battery that includes a lower case and a label that are securely adhered to each other. The secondary battery includes a bare cell that receives an electrode assembly and having one end to which an electrode terminal is exposed, a protective circuit module electrically connected to the electrode terminal to control charging and discharging, an upper case accommodating the protective circuit module and installed at an upper portion of the bare cell, a hollow label having its top and bottom ends opened, accommodating the bare cell and including a bent portion adhered to the upper case at the top end and bent to extend inward at the bottom end, and a lower case sealing the bottom end of the label. | 04-14-2011 |
| 20110171498 | Pouch type battery - A pouch type battery, including a pouch type bare cell having a terrace and having an electrode tab adjacent to the terrace, the terrace being an empty space defined where a sealing area of the electrode tab is not bent, the sealing area positioned in a direction in which the electrode tab extends, a protective circuit board electrically connected to the electrode tab, the protective circuit board positioned in the terrace and including a protection circuit, an upper case supporting the protective circuit board and encasing an upper portion of the bare cell, and a first barrier protruding downwardly from the upper case and electrically separating the protective circuit board from the electrode tab. | 07-14-2011 |
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| 20080292913 | BATTERY PACK - A battery case including: first case body having a main wall and opposing side walls; a second case body including a second main wall and opposing side walls. The first and second side walls include coupling parts to be coupled together when the first and second case bodies are pressed together to form a space to receive a bare cell. The battery case can also include clips to couple the first and second side walls. | 11-27-2008 |
| 20080305367 | BATTERY PACK - A battery pack including: a bare cell, a case to house the bare cell, having at least one hole formed therein; a protection circuit board connected to bare cell; an adhesive applied onto the case, and to the bare cell via the hole, and a label attached to the bare cell and the case, by the adhesive. | 12-11-2008 |
| 20110123840 | Secondary battery - A secondary battery includes a bare cell, a protective circuit module, a lead plate connecting the protective circuit module with the bare cell, and a cap plate in a top of the bare cell, the cap plate including at least one clad metal layer. | 05-26-2011 |
| 20110129695 | Battery Pack - A battery pack includes a bare cell having a pair of first side portions, a pair of second side portions, and a pair of plane portions, each of which are opposite to each other. The second side portions and the plane portions are connected to ends of the first side portions. A protection circuit module is electrically connected to the bare cell. An inner frame exposes one side portion of the pair of first side portions and accommodates the bare cell. An outer frame exposes the pair of plane portions and accommodates the bare cell, the protection circuit module and the inner frame. In the battery pack, outer ribs extending away from the bare cell are further formed at the inner frame that comes in contact with the pair of second side portions of the bare cell so that the outer frame is surrounded by the outer ribs. | 06-02-2011 |
| 20110129698 | Secondary battery and method of manufacturing the same - A secondary battery and a method of manufacturing the same, the secondary battery including a bare cell for charging and discharging electricity; a protective circuit module for protecting the bare cell; an upper case, the upper case being coupled to the protective circuit module and disposed at an upper part of the bare cell; a protective film surrounding an external surface of the bare cell; and a resin molding unit disposed in the protective film, in the upper case, and in a lower part and on a bottom surface of the bare cell. | 06-02-2011 |
| 20110129699 | Battery pack - A battery pack including a bare cell, the bare cell having a pair of first side portions opposite to each other, a pair of second side portions opposite to each other, and a pair of plane portions opposite to each other, the second side portions and the plane portions being connected to ends of the first side portions; a protection circuit module electrically connected to the bare cell; an inner frame between the bare cell and the protection circuit module, the inner frame accommodating the bare cell and exposing one side portion of the pair of first side portions; and an outer frame, the outer frame accommodating the bare cell, the protection circuit module, and the inner frame and exposing the pair of plane portions. | 06-02-2011 |
| 20110129725 | SECONDARY BATTERY - A secondary battery according to the present invention includes a polymer cell in which insulating wing portions are provided on lead tabs and a top case assembled to the polymer cell and having an evasion portion to reduce interference with the insulating wing portions. A secondary battery can reduce interference which occurs between an insulating wing portion having an irregular shape. Further, as a result, it is possible to reduce the variance of the external dimension of an inner pack and achieve a more stable manufacturing process of the inner pack, and increase the reliability and competency of the inner pack to which the polymer cell is applied. | 06-02-2011 |
