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Baade
Jens Baade, Neubrandenburg DE
| Patent application number | Description | Published |
|---|---|---|
| 20100065098 | HEATING APPARATUS COMPRISING A THERMOELECTRIC MODULE - Disclosed is a thermoelectric module ( | 03-18-2010 |
| 20100115968 | HEATING APPARATUS COMPRISING A THERMOELECTRIC DEVICE - The invention relates to a heating apparatus ( | 05-13-2010 |
Michael J. Baade, Zimmerman, MN US
| Patent application number | Description | Published |
|---|---|---|
| 20100030227 | MEDICAL LEAD IMPLANTATION - A medical lead introducer comprises a shank, a carrier structure on the shank configured to engage a mating carrier structure of a medical lead during a lead introduction procedure, and a blunt dissection element located on a distal end of the shank. The blunt dissection element is configured to shield at least a distal portion of the medical lead when the medical lead is engaged by the carrier structure during the lead introduction procedure. In some embodiments, the medical lead introducer may be part of a kit including the medical lead. | 02-04-2010 |
| 20100304592 | Connector Assemblies and Contacts for Implantable Medical Electrical Systems - A connector assembly of a medical electrical device includes a plurality of electrical contacts, wherein at least one contact of the plurality of electrical contacts includes an electrical coupling receptacle. The electrical coupling receptacle of the at least one contact includes a first portion, which is adapted to receive a connector element of a medical electrical lead, and a second portion, in which a part of a feedthrough member extends, and to which the part of the feedthrough member is fixedly coupled. | 12-02-2010 |
| 20110029028 | MACHINING OF ENCLOSURES FOR IMPLANTABLE MEDICAL DEVICES - Enclosures for implantable medical devices are machined from biocompatible materials using processes such as electric discharge machining and/or milling. Material is machined to create an enclosure. The enclosure may include an enclosure sleeve that has top and bottom caps added where the enclosure sleeve is machined either as a whole or as two separate halves that are subsequently joined together. During construction, circuitry is installed and where the enclosure includes an enclosure sleeve, the open top and bottom may be closed by caps while a connector block module may be mounted to the complete enclosure. The machining process allows materials that are typically difficult to stamp, such as grade 5 and 9 titanium and 811 titanium, that are beneficial to telemetry and recharging features of an implantable medical device to be used while allowing for an enclosure with a relatively detailed geometry and relatively tight tolerances. | 02-03-2011 |
Michael J. Baade, Zimmeman, MN US
| Patent application number | Description | Published |
|---|---|---|
| 20100240253 | Connector Assemblies for Implantable Medical Electrical Systems - A device connector assembly includes a plurality of electrical contacts and a sealing member including a corresponding plurality of apertures; each electrical contact extends within a corresponding aperture of the plurality of apertures such that each contact is accessible for coupling with a corresponding connector element of a lead connector. The lead connector elements protrude from a first side of an insulative substrate of the lead connector, and may be coupled to the contacts of the device connector assembly by aligning each connector element with the corresponding aperture of the sealing member, and applying a force to a second side of the insulative substrate, opposite the first side, in order to press each connector element into engagement with the corresponding contact. | 09-23-2010 |
Robert Baade, Aitkenvale AU
| Patent application number | Description | Published |
|---|---|---|
| 20110031039 | WEIGHING APPARATUS - A weighing apparatus, the weighing apparatus comprising a weighing portion including means for at least temporarily retaining an item to be weighed thereon, and a measurement portion in communication with the weighing portion, wherein the measurement portion comprises at least two indicators for indicating the weight of the item attached to the weighing apparatus, each of the indicators for indicating the weight of the item in different conditions. | 02-10-2011 |
Torsten Baade, Regensburg DE
| Patent application number | Description | Published |
|---|---|---|
| 20110266571 | Semiconductor Arrangement - According to at least one embodiment of the semiconductor arrangement, the latter comprises a mounting side, at least one optoelectronic semiconductor chip with mutually opposing chip top and bottom, and at least one at least partially radiation-transmissive body with a body bottom, on which the semiconductor chip is mounted such that the chip top faces the body bottom. Moreover, the semiconductor arrangement comprises at least two electrical connection points for electrical contacting of the optoelectronic semiconductor chip, wherein the connection points do not project laterally beyond the body and with their side remote from the semiconductor chip delimit the semiconductor arrangement on the mounting side thereof. | 11-03-2011 |
William Frederick Baade, Breinigsville, PA US
| Patent application number | Description | Published |
|---|---|---|
| 20110146991 | Integrated Hydrogen Production and Hydrocarbon Extraction - Reformer and method for producing hydrogen and steam where steam is used for steam-assisted extraction of heavy hydrocarbons. Steam is injected into a hydrocarbon-containing reservoir. Hydrocarbons are extracted from the reservoir along with produced water. Hydrogen is produced in a catalytic steam hydrocarbon reformer. Combustion product gas from the reformer is used to generate wet steam in a once-through steam generator from produced water recycled from the reservoir. The wet steam is used for the steam-assisted extraction of heavy hydrocarbons. The reformer has a heat exchanger section where a heat exchanger is suitable for processing the produced water by once-through steam generation and is suitable for mechanical cleaning. | 06-23-2011 |