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Azumi

Azumi Ito, Tokyo JP

Patent application numberDescriptionPublished
20110068086PLASMA ETCHING METHOD - A plasma etching method includes etching an etching target under plasma conditions using a process gas, the process gas including a saturated fluorohydrocarbon shown by the formula (1): C03-24-2011

Azumi Kondo, Ota-Ku JP

Patent application numberDescriptionPublished
20100000654ADHESIVE TAPE ATTACHING METHOD - An adhesive tape attaching method for attaching an adhesive tape to the back side of a wafer, the wafer having a device area where a plurality of devices are formed on the front side of the wafer and a peripheral marginal area surrounding the device area, wherein the back side of the wafer is formed with a circular recess corresponding to the device area and an annular reinforcing portion surrounding the circular recess so as to correspond to the peripheral marginal area. The adhesive tape attaching method includes the steps of holding the wafer and the adhesive tape in a low-pressure condition so that the back side of the wafer is opposed to the adhesive surface of the adhesive tape, fixedly providing a plate member in the condition where the plate member is opposed to the nonadhesive surface of the adhesive tape, pressing the back side of the wafer against the adhesive surface of the adhesive tape, and engaging the plate member into the circular recess formed on the back side of the wafer in the condition where the adhesive tape is closely fitted in the circular recess.01-07-2010
20100055877WAFER PROCESSING METHOD - Disclosed herein is a wafer processing method for dividing a wafer along a plurality of streets. The wafer processing method includes a back grinding step of grinding the back side of the wafer in an area corresponding to a device area to thereby reduce the thickness of the device area to a predetermined finished thickness and to simultaneously form an annular reinforcing portion on the back side of the wafer in an area corresponding to a peripheral marginal area, a wafer supporting step of attaching the back side of the wafer to a dicing tape, a kerf forming step of cutting the front side of the wafer along each street to thereby form a kerf having a depth corresponding to the thickness of the device area along each street, thereby dividing the device area into individual devices, and a peripheral marginal area removing step of peeling off the peripheral marginal area from the dicing tape.03-04-2010

Azumi Miyaake, Chiba JP

Patent application numberDescriptionPublished
20110294064TONER, METHOD OF MANUFACTURING TONER, DEVELOPER, IMAGE FORMING METHOD, AND IMAGE FORMING APPARATUS - A toner comprising a colorant, a release agent, an amorphous polyester, and a crystalline polyester having an endothermic peak temperature of 60 to 80° C. and an endothermic quantity of 3.0 to 20.0 J/g. The endothermic peak temperature is determined from a constant rate component curve of the crystalline polyester obtained in a second heating of temperature-modulated differential scanning calorimetry. The endothermic quantity is determined from an area between the constant rate component curve and its base line drawn between 0 and 100° C., within a temperature range of 0 to 50° C.12-01-2011

Azumi Nakamura, Kanagawa JP

Patent application numberDescriptionPublished
20120064431POLYMER ELECTROLYTE-CATALYST COMPOSITE STRUCTURE PARTICLE AND MANUFACTURING METHOD THEREOF, ELECTRODE, MEMBRANE ELECTRODE ASSEMBLY (MEA), AND ELECTROCHEMICAL DEVICE - Polymer electrolyte-catalyst particles that are effective in preventing agglomeration of catalyst particles and polymer electrolyte particles, effective in the formation of ion pathways by polymer electrolyte particles and electron pathways by catalyst particles, and that are able to realize strong catalytic performance by improving the use efficiency of the catalyst particles and a manufacturing method thereof, electrodes formed using such composite structure particles, a membrane electrode assembly (MEA), and an electrochemical device are provided.03-15-2012

Azumi Sato, Tokyo JP

Patent application numberDescriptionPublished
20090202750COLORED ALKALI-DEVELOPABLE PHOTOSENSITIVE RESIN COMPOSITION AND COLOR FILTER USING THE SAME - A colored alkali-developable photosensitive resin composition comprising an alkali-developable resin composition that contains a reaction product obtained by esterification of an epoxy-adduct with a polybasic acid anhydride (C) and then with a polyfunctional epoxy compound (D), wherein the epoxy-adduct has a structure in which an unsaturated monobasic acid (B) is added to an epoxy resin (A) represented by general formula (I) below, a coloring material (E) and a photopolymerization initiator (F).08-13-2009
20100253888Colored composition, color filter and method of manufacturing the same - Disclosed is a coloring composition including a pigment, a transparent resin, a monomer having an ethylenic unsaturated double bond, and a photo-polymerization initiator, wherein a ratio (M/P) of weight (M) of the monomer having an ethylenic unsaturated double bond to weight (P) of the transparent resin is confined to a range of 0.12 to 1.35, and the coloring composition is adapted to be employed in a manufacturing method of a color filter including coating a surface of a substrate with the coloring composition, irradiating a filter segment-forming region or a black matrix-forming region of the coated coloring composition film with a laser beam having a wavelength of 340 nm to 380 nm, thereby curing the irradiated region, and removing uncured portion of the coated coloring composition film to form the filter segment or the black matrix.10-07-2010

Patent applications by Azumi Sato, Tokyo JP