Patent application number | Description | Published |
20110209755 | LIQUID CRYSTAL POLYMER BARRIER FILMS FOR OPTOELECTRONICS - An optoelectronic structure can include a liquid crystal polymer layer and an optoelectronic device adjacent to a first surface of the liquid crystal polymer layer. The liquid crystal polymer layer can include the first surface and a second surface opposite the first surface. In an embodiment, the liquid crystal polymer layer can further include a liquid crystal polymer at least partially exposed to a gas at the second surface. In another embodiment, the liquid crystal polymer may be a thermotropic liquid crystal polymer. In still another embodiment, the polymer layer can include an additive to reduce migration of a gas through the polymer layer. Methods of forming such optoelectronic structures can include melt-processing techniques. | 09-01-2011 |
20130082089 | CURABLE FLUX COMPOSITION AND METHOD OF SOLDERING - A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a carboxylic acid; a fluxing agent represented by formula I: | 04-04-2013 |
20130082092 | Curable Amine, Carboxylic Acid Flux Composition And Method Of Soldering - A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a carboxylic acid; and, an amine fluxing agent represented by formula I: | 04-04-2013 |
20130082093 | Amine, Carboxylic Acid Flux Composition And Method Of Soldering - A flux composition is provided, comprising, as initial components: a carboxylic acid; and, an amine fluxing agent represented by formula I: | 04-04-2013 |
20130082094 | POLYAMINE, CARBOXYLIC ACID FLUX COMPOSITION AND METHOD OF SOLDERING - A flux composition is provided, comprising, as initial components: a carboxylic acid; and, a polyamine fluxing agent represented by formula I: | 04-04-2013 |
20130082095 | Flux Composition And Method Of Soldering - A flux composition is provided, comprising, as an initial component: a carboxylic acid; and, a fluxing agent represented by formula I: | 04-04-2013 |
20150064851 | PRE-APPLIED UNDERFILL - Underfill structures useful as pre-applied underfill materials comprise a polymer layer having a first polymer region and a second polymer region, wherein the second polymer region comprises inorganic filler. Electronic assemblies comprising a chip or die and a substrate are formed using such multi-layer structured pre-applied underfill. | 03-05-2015 |
20150371916 | PRE-APPLIED UNDERFILL - Underfill structures useful as pre-applied underfill materials comprise a polymer layer having a first filled polymer region having a first viscosity and a second filled polymer region having a second viscosity, wherein the first viscosity is less than the second viscosity. Electronic assemblies comprising a chip or die and a substrate are formed using such multi-layer structured pre-applied underfill. | 12-24-2015 |