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Aumer
Bernhard Aumer, Fischbach DE
| Patent application number | Description | Published |
|---|---|---|
| 20080248295 | Articles Comprising Rubber, Thermoplastic Polyurethane and Engineering Polymer - Item comprising thermoplastic polyurethane, which has, respectively, direct-contact adhesive bonding not only to rubber but also to engineering plastic. | 10-09-2008 |
| 20100299108 | METHOD FOR DESIGNING THE WALL THICKNESS OF COMPONENTS AND COMPONENT - The invention relates to a method for designing the wall thickness of components that are permanently subjected to static and/or dynamic loading, the components being made of a fiber reinforced polymer material. In a first step, the orientation of the fibers in the fiber reinforced plastic and the position of the weld lines in the component are determined by a first simulation calculation. A degree of utilization of the strength of the component is calculated by a second simulation calculation. The wall thickness of the component is adapted to the result of the second simulation calculation, and the previous steps are repeated if a change of the wall thickness has been carried out. The invention also relates to a component of a fiber reinforced polymer material that has a wall thickness designed by the method according to the invention. | 11-25-2010 |
Michael Aumer, Raleigh, NC US
| Patent application number | Description | Published |
|---|---|---|
| 20090014756 | Method of producing large area SiC substrates - A method for growing a SiC-containing film on a Si substrate is disclosed. The SiC-containing film can be formed on a Si substrate by, for example, plasma sputtering, chemical vapor deposition, or atomic layer deposition. The thus-grown SiC-containing film provides an alternative to expensive SiC wafers for growing semiconductor crystals. | 01-15-2009 |
Michael E. Aumer, Laurel, MD US
| Patent application number | Description | Published |
|---|---|---|
| 20100192840 | SEMICONDUCTOR HETEROJUNCTION DEVICES BASED ON SiC | 08-05-2010 |
Mike Aumer, Laurel, MD US
| Patent application number | Description | Published |
|---|---|---|
| 20080206121 | Solid solution wide bandgap semiconductor materials - A substrate and method for growing a semi-conductive crystal on an alloy film such as (AIN) | 08-28-2008 |