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Au
Keng Yuen Au, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20100261313 | SEMICONDUCTOR PACKAGE AND METHOD OF PACKAGING SEMICONDUCTOR DEVICES - A method of forming a device stack is presented. The method includes providing a temporary substrate having a temporary mounting surface. A first chip is temporarily mounted to the temporary mounting surface. A first bottom surface of the first chip is temporarily mounted to the temporary mounting surface and a first top surface of the first chip comprises first interconnects. A second chip is stacked on the first chip. The second chip includes second conductive contacts on the second bottom surface. The method also includes bonding the first and second chips together to form the device stack. The second conductive contacts are coupled to the first interconnects. The first bottom surface of the first chip is separated from the substrate to separate the chip stack from the substrate. | 10-14-2010 |
Kw Au, Kowloon CN
| Patent application number | Description | Published |
|---|---|---|
| 20100202137 | Rechargeable Device Having an Adaptor - A device having a body and an adaptor is provided. The body includes a battery, a circuit and recharging terminals connected to the battery and the circuit for recharging the battery. The adaptor includes electrical connectors that can be connected to a wall outlet and/or power supply. Further, the adaptor includes contacts. The recharging terminals can be inserted into the adaptor and connect to the contacts. | 08-12-2010 |
Kwok Shum Au, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20120094650 | METHOD OF COMMUNICATION - A method of communication comprising: determining whether a mobile station (MS) is within a collaborative zone with respect to a first base station (BS | 04-19-2012 |
Kwok Shum Edward Au, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20110211549 | MULTIPLE ACCESS COMMUNICATION SYSTEM - A multiple access communication system is disclosed herein. In a described embodiment, there is disclosed a method of allocating system bandwidth of the communication system and the method comprises, at step ( | 09-01-2011 |
Sze Lok Au, New Territories Hong Kong CN
| Patent application number | Description | Published |
|---|---|---|
| 20100306197 | NON-LINEAR REPRESENTATION OF VIDEO DATA - The present invention is a method of representing video data in a non-linear paradigm. Video data are categorized into semantic content comprising multi-layer structure each denotes semantic reference, such as different cinematic entities. The semantic content is organized in a hierarchical structure where the top layer denotes global information while the lowest layer represents primitive information. The cinematic entities in the top layer are hyper-linked to the entities in the second layer. The entities in the second layer are hyper-linked to the third layer and so forth. Each cinematic entity in the lowest layer is designated to a part of the video content and hyper-linked to the corresponding video data. The semantic content comprises hyper-linked video data in an N-to-N relationship. N-to-N relationship means the data are hyper-video and the video data supports multiple access and multiple presentation. An apparatus for presenting categorized semantic content is also disclosed. | 12-02-2010 |
Sze Lok Au, Hong Kong Sar CN
| Patent application number | Description | Published |
|---|---|---|
| 20110096149 | VIDEO SURVEILLANCE SYSTEM WITH OBJECT TRACKING AND RETRIEVAL - A system for capturing and retrieving a collection of video image data captures video image data from a live scene with still cameras and PTZ cameras, and automatically detects an object of interest entering or moving in the live scene. The system automatically controls the PTZ camera to enable close-up real time video capture of the object of interest. The system automatically tracks the object of interest in the captured video image data and analyses features of the object of interest. | 04-28-2011 |
Yin Kheng Au, Petaling Jaya MY
| Patent application number | Description | Published |
|---|---|---|
| 20110204498 | LEAD FRAME AND SEMICONDUCTOR PACKAGE MANUFACTURED THEREWITH - A lead frame for a semiconductor package has a flag to which a semiconductor die is mounted. Tie bars are coupled to the flag. There is a first set of leads and each first set lead in the first set of leads has a first set lead parallel length and a first set lead tapered length. The first set lead parallel length of each first set lead has a constant width and edges that are parallel to edges of all other first set lead parallel lengths. A free end region of the first set lead tapered length of each first set lead provides a first set lead bond target region. There is a second set of leads disposed between a first one of the tie bars and the first set of leads. Each second set lead, in the second set of leads, has a second set lead parallel length and a second set lead tapered length. The second set lead parallel length of each second set lead has a constant width and edges that are parallel to edges of all other second set lead parallel lengths in the second set of leads and also parallel to the edges of first set lead parallel lengths. At least one second set lead has an extension length extending inwardly from the second set lead tapered length, the extension length has a constant width and provides a second set lead bond target region. Wire bond leads electrically couple both the first set lead bond target region and second set lead bond target region to respective die external electrical connection pads on a surface of the die and a package body encloses the die. | 08-25-2011 |