| Patent application number | Description | Published |
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| 20100036009 | PROCESS FOR PRODUCING MICROPOROUS POLYMERIC OBJECT, AND MICROPOROUS POLYMERIC OBJECT AND SEPARATION MEMBRANE - A process for producing a microporous polymeric object to improve the degree of freedom for its various properties, compared to conventional processes, includes: mixing a block copolymer made of three or more kinds of segments with a polymer, wherein one or more of the segments are made of monomer units having a first functional group forming ionic and/or hydrogen bond, the segments constitute a co-continuous structure having mutually-independent and continuous regions due to a phase separation based on incompatibility between the segments, and the polymer has, at other than polymer chain terminals, a second functional group forming such bond with the first functional group, thereby allowing the segments to associate with the polymer at many points; forming a co-continuous structure including a region composed of the polymer and the segments due to the phase separation; and removing the polymer from the region by weakening the bond between the functional groups. | 02-11-2010 |
| 20100120985 | PROCESS FOR PRODUCING POLYMERIC OBJECT HAVING MICROPHASE-SEPARATED STRUCTURE AND POLYMERIC OBJECT HAVING MICROPHASE-SEPARATED STRUCTURE - A process for producing a polymeric object having a microphase-separated structure that can improve the degree of freedom for the structure to be formed is provided. A block copolymer composed of two or more segments and having a first segment composed of a monomer unit having a first functional group capable of forming an ionic bond and/or a hydrogen bond and a second segment incompatible with the first segment, and a polymer having, at other than the terminals of its polymer chain, a second functional group capable of forming an ionic bond and/or a hydrogen bond with the first functional group are mixed. Then, allowing the first segment to be associated with the polymer at many points by an ionic bond and/or a hydrogen bond, the mixture of the copolymer and the polymer is microphase separated. As a result, a polymeric object is formed including a region including the first segment and the polymer that have been associated with each other, and a region including the second segment. | 05-13-2010 |
| Patent application number | Description | Published |
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| 20090021109 | UNDER BUMP METAL FILM, METHOD FOR FORMING SAME, AND SURFACE ACOUSTIC WAVE DEVICE - An under bump metal film formed on a substrate includes a diffusion-resistant barrier layer made of a platinum group metal film, and an aluminum-based stress relaxation layer formed under the diffusion-resistant barrier layer. | 01-22-2009 |
| 20090051245 | Surface Acoustic Wave Device and Method for Manufacturing the Same - A surface acoustic wave device includes a piezoelectric substrate and a lid spaced apart from each other oppositely by a specific interval. A comb electrode and a pad electrode are provided to the piezoelectric substrate on a main surface on the lid side, and an external terminal is provided to the lid on a surface on the opposite side to the piezoelectric substrate. Further, the surface acoustic wave device includes a connection electrode that electrically connects the pad electrode and the external terminal, and an insulator interposed between at least one of the main surface of the piezoelectric substrate and the pad electrode and the lid. | 02-26-2009 |
| 20090071711 | ELECTRONIC COMPONENT PACKAGE - An electronic component package comprises: an electronic component where device elements are mounted inside cavities formed between a component substrate and a component cover that covers the component substrate; and a mounting substrate. The component cover is placed on the mounting substrate, and the electronic component is mounted on the mounting substrate and molded by a resin. At least one of a ground electrode and a dummy electrode is provided on a surface of the component cover, the surface being placed on the mounting substrate. At least one of the ground electrode and the dummy electrode is provided in a position opposed to at least part of the cavities. | 03-19-2009 |
| 20090194325 | ELECTRONIC COMPONENT PACKAGE - The strength of an electronic component package against an external pressure is improved. According to the invention, in order to realize this, in an electronic component package in which an electronic component mounted on a mounting substrate via external electrodes placed on the mounting substrate is covered by a mold resin, the electronic component has a component cover which covers elements placed on the lower face of a component substrate, and which forms cavities, and a protective member which is lower in elastic modulus than the mold resin is disposed in a portion which excludes portions joined with the external electrodes in a lower face of the component cover, and which is opposed to the cavities. | 08-06-2009 |
