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Atsushi Osawa

Atsushi Osawa, Kanagawa JP

Patent application numberDescriptionPublished
20090104350NOZZLE DEVICE, FILM FORMING APPARATUS AND METHOD USING THE SAME, INORGANIC ELECTROLUMINESCENCE DEVICE, INKJET HEAD, AND ULTRASONIC TRANSDUCER ARRAY - A film forming apparatus by which uniform and large area films can be formed according to the AD method. The film forming apparatus includes: a film forming chamber; a substrate holder located in the film forming chamber, for holding a substrate on which a structure is to be formed; an exhaust pump for exhausting an interior of the film forming chamber; an aerosol generating unit for generating an aerosol by blowing up a raw material powder placed in a container with a gas; a carrier pipe for introducing the generated aerosol into the film forming chamber; a nozzle for spraying the aerosol introduced via the carrier pipe toward the substrate; and a control unit for chaotically changing a relative position of the substrate held by the substrate holder and the nozzle.04-23-2009
20090115291VIBRATOR ARRAY, MANUFACTURING METHOD THEREOF, AND ULTRASONIC PROBE - In an ultrasonic transducer array, a plurality of vibrators arranged in an array is bonded to a base plate by bond material. The bond material bonds the bottom of the each vibrator to the base plate in a manner to surround lower part of the side face of the vibrator. A filling material is filled in between the vibrators. The filling material has a multi-layer structure of different rigidity. In a double layer structure of the filling material, it is preferable that thickness ratio of layer of filling material at the base plate side (lower side) to the other layer of the filling material is 1:1 to 1:3. Preferably, a beam is provided for connecting the side faces of the adjacent vibrators.05-07-2009
20110074244Ultrasonic probe - An ultrasonic probe has transmitting ultrasonic transducers and receiving ultrasonic transducers. The transmitting ultrasonic transducer is composed of a multilayer piezoelectric element, and the receiving ultrasonic transducer is composed of a single-layer piezoelectric element. The transmitting and receiving ultrasonic transducers are alternately arranged in an azimuth direction to form a piezoelectric element line. The single transmitting ultrasonic transducer and the single receiving ultrasonic transducer that adjoin to each other compose a single channel to transmit ultrasonic waves and receive echoes. The transmitting ultrasonic transducer is connected to a transmission circuit board on which a pulser is implemented, and the receiving ultrasonic transducer is connected to a reception circuit board on which an amplifier is implemented. The receiving ultrasonic transducer is directly connected to the amplifier without passing through a capacitance transmission line.03-31-2011
20110077520Ultrasonic diagnostic apparatus and ultrasonic diagnostic method - An ultrasonic probe has a plurality of ultrasonic transducers (UTs). Each UT transmits ultrasonic waves and receives echo waves. In a B/A coefficient acquisition mode, every time a transmission of the ultrasonic waves and reception of echo waves takes place, ultrasonic waves for heating are transmitted to heat an object of interest. An HI processor calculates a non-linear B/A coefficient based on a harmonic component of a detection signal from the UT. The HI processor acquires information of changes in the B/A coefficient while the object of interest is heated with the ultrasonic waves for heating. A DSC displays the information of the B/A coefficient together with an ultrasonic image on a monitor.03-31-2011

Patent applications by Atsushi Osawa, Kanagawa JP

Atsushi Osawa, Ashigarakami-Gun JP

Patent application numberDescriptionPublished
20080200812ULTRASONIC PROBE - An ultrasonic probe that can be relatively easily manufactured and has a desired ultrasonic radiation surface. The ultrasonic probe includes: plural supporting materials, each having a principle surface on which plural signal wires are formed, the plural supporting materials arranged such that the principle surfaces are oriented in different directions from one another; plural groups of ultrasonic transducers, plural ultrasonic transducers in each group having plural electrodes formed on side surfaces, the plural electrodes respectively joined to the plural signal wires formed on the principle surface of the respective one of the plural supporting materials.08-21-2008
20080238259ULTRASONIC PROBE AND PRODUCTION METHOD THEREOF - An ultrasonic probe realizing a high sensitivity and a wide band thereof while miniaturizing a transducer and also taking into consideration a measure against generated heat. The ultrasonic probe includes: a backing material; a transducer array having a multi-layered structure in which a plurality of transducers are arranged in a first direction to compose a transducer group and a plurality of the transducer groups are arranged in a second direction different from the first direction; a first layer of conductive resin electrically connecting the first electrode layers of adjacent transducers with each other in each transducer group; a second layer of conductive resin electrically connecting the internal electrode layers of adjacent transducers with each other in each transducer group; and an insulating resin disposed in a predetermined region among the plurality of transducers in each transducer group.10-02-2008
20090088646ULTRASONIC ENDOSCOPE - An ultrasonic endoscope in which the temperature rise can be suppressed with a reduced diameter. The ultrasonic endoscope includes: an ultrasonic transducer part including plural ultrasonic transducers; an exterior member for accommodating the ultrasonic transducer part; and a heat conducting part provided inside of the exterior member and respectively connected to the ultrasonic transducer part and an inner surface of the exterior member. It is preferable that the heat conducting part has a coefficient of thermal conductivity equal to or more than 10 W/(m·K). Further, it is preferable that one of the heat conducting member and the exterior member has an electric insulation property.04-02-2009
20090236940ULTRASONIC PROBE AND METHOD OF MANUFACTURING THE SAME - In an ultrasonic probe in which individual wires led out from multilayered piezoelectric elements are arranged in a staggered manner, short-circuit is prevented. Each of the elements includes: a multilayered structure in which piezoelectric material layers and at least one internal electrode are stacked; first and second flat electrodes; first and second side electrodes; an insulating film formed at a second side surface side of the multilayered structure; a wiring member bonded to the first flat electrode on the one end of the multilayered structure by using a conducting adhesive material; and the wiring member is provided at the second side surface side of the multilayered structure and the insulating film electrically separates the second side electrode and the conducting adhesive material in a first element, and the wiring member is provided at a first side surface side of the multilayered structure in a second element.09-24-2009
20100026141INTRACAVITY ULTRASONIC PROBE - An intracavity ultrasonic probe which prevents or reduces degradation or failures with time due to use of an intermediate balloon made of rubber. The intracavity ultrasonic probe includes: a piezoelectric vibrator having a piezoelectric material, and a first electrode layer and a second electrode layer formed on a first surface and a second surface of the piezoelectric material, respectively; at least one acoustic matching layer provided above the second electrode layer; an acoustic lens disposed above the at least one acoustic matching layer so as to cover the at least one acoustic matching layer and the piezoelectric vibrator; and a sulfur adsorbing material layer disposed between the acoustic lens and the second electrode layer.02-04-2010

Patent applications by Atsushi Osawa, Ashigarakami-Gun JP

Atsushi Osawa, Kaisei-Machi JP

Patent application numberDescriptionPublished
20090119896MULTILAYERED PIEZOELECTRIC ELEMENT AND METHOD OF MANUFACTURING THE SAME - A multilayered piezoelectric element in which braking to displacement of piezoelectric material layers is suppressed and insulating films suitable for thinning of the piezoelectric material layers are formed. A method of manufacturing the element includes the steps of: (a) forming a multilayered structure including piezoelectric material layers, at least one first electrode layer, and at least one second electrode layer; (b) discharging a liquid synthetic resin from a nozzle provided in a dispenser to apply it to an end portion of the first electrode layer in a first region within side surfaces of the multilayered structure and curing the liquid synthetic resin to form a first insulating film; and (c) discharging the liquid synthetic resin from the nozzle to apply it to an end portion of the second electrode layer in a second region and curing the liquid synthetic resin to form a second insulating film.05-14-2009
20090243442MULTILAYERED PIEZOELECTRIC ELEMENT AND METHOD OF MANUFACTURING THE SAME - In a multilayered piezoelectric element, a side insulating film is accurately formed even on a thin multilayered structure. The element includes: a multilayered structure having a step formed on a side surface of the multilayered structure such that an end of an internal electrode is located on a convex portion of either side surface; a side insulating film for covering the end of the internal electrode on the convex portion of the side surface; a first flat electrode formed on one principal surface of the multilayered structure; a second flat electrode formed on the other principal surface of the multilayered structure; a first side electrode formed on a first side surface of the multilayered structure and connected to a first group of electrodes; and a second side electrode formed on a second side surface of the multilayered structure and connected to a second group of electrodes.10-01-2009

Patent applications by Atsushi Osawa, Kaisei-Machi JP

Atsushi Osawa, Kyoto JP

Patent application numberDescriptionPublished
20090080879APPARATUS FOR AND METHOD OF PROCESSING SUBSTRATE - A substrate processing apparatus discharges a hydrofluoric acid solution from discharge nozzles toward grooves formed in side walls of an inner bath. The hydrofluoric acid solution discharged from the discharge nozzles impinges upon the grooves to diffuse, thereby moving toward a top portion of the inner bath in the form of low-speed uniform liquid flows. Thus, a metal component and foreign substances generated in the inner bath float up toward the top portion of the inner bath without being agitated within the inner bath, and are rapidly drained to an outer bath together with the hydrofluoric acid solution.03-26-2009
20090239384SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A discharge hole of a lower nozzle is directed at an angle of 5 degrees to 40 degrees slanting inward with respect to a normal to the upper surface of a bottom plate. Thus, the flow pressure of a processing solution discharged through the discharge hole is not excessively reduced. Further, a circulation area of the processing solution does not expand widely in an inner bath. As a result, the processing solution in the inner bath is effectively displaced while the processing solution smoothly flows into gaps between substrates.09-24-2009

Patent applications by Atsushi Osawa, Kyoto JP

Atsushi Osawa, Tokyo JP

Patent application numberDescriptionPublished
20110213592CAPACITIVE ULTRASONIC TRANSDUCER AND ENDO CAVITY ULTRASONIC DIAGNOSIS SYSTEM USING THE SAME - A capacitive ultrasonic transducer (c-MUT) comprising a silicon substrate and a transducer element which comprises transducer cells, each of which is constituted by a first electrode equipped on the top surface of the silicon substrate, a second electrode placed opposite to the first electrode with a predetermined gap therefrom and a membrane for supporting the second electrode, wherein a trench is equipped between the adjacent transducers and a conductive film is formed in the trench.09-01-2011