Inventors list

Assignees list

Classification tree browser

Top 100 Inventors

Top 100 Assignees


Atsushi Osada

Atsushi Osada, Kai-Shi JP

Patent application numberDescriptionPublished
20080208386SEMICONDUCTOR MANUFACTURING SYSTEM, CONTROLLER, SEMICONDUCTOR MANUFACTURING SYSTEM CONTROL METHOD, AND PROCESSING LIQUID COLLECTION METHOD - A semiconductor manufacturing system includes a semiconductor manufacturing apparatus, a first controller for controlling the semiconductor manufacturing apparatus, an auxiliary machine for the semiconductor manufacturing apparatus, a second controller for controlling the auxiliary machine, and a third controller for electrically coupling the first and second controllers. The second controller outputs an auxiliary machine-in-operation signal to the third controller when the auxiliary machine is operating, outputs an auxiliary machine-stopping signal to the third controller when the auxiliary machine is stopping, and operates or stops the auxiliary machine according to an instruction signal received from the third controller. The first controller receives the auxiliary machine-in-operation signal or the auxiliary machine-stopping signal via the third controller, and keeps the semiconductor manufacturing apparatus in operation or on standby when the first controller is receiving the auxiliary machine-in-operation signal. The third controller stops the auxiliary machine when the third controller detects that the semiconductor manufacturing apparatus is on standby, and outputs the auxiliary machine-in-operation signal, instead of the auxiliary machine-stopping signal received from the second controller, to the first controller.08-28-2008
20110046797SEMICONDUCTOR MANUFACTURING SYSTEM, CONTROLLER, SEMICONDUCTOR MANUFACTURING SYSTEM CONTROL METHOD, AND PROCESSING LIQUID COLLECTION METHOD - A semiconductor manufacturing system includes a semiconductor manufacturing apparatus, a first controller for controlling the semiconductor manufacturing apparatus, an auxiliary machine for the semiconductor manufacturing apparatus, a second controller for controlling the auxiliary machine, and a third controller for electrically coupling the first and second controllers. The second controller outputs an auxiliary machine-in-operation signal to the third controller when the auxiliary machine is operating, outputs an auxiliary machine-stopping signal to the third controller when the auxiliary machine is stopping, and operates or stops the auxiliary machine according to an instruction signal received from the third controller. The first controller receives the auxiliary machine-in-operation signal or the auxiliary machine-stopping signal via the third controller, and keeps the semiconductor manufacturing apparatus in operation or on standby when the first controller is receiving the auxiliary machine-in-operation signal. The third controller stops the auxiliary machine when the third controller detects that the semiconductor manufacturing apparatus is on standby, and outputs the auxiliary machine-in-operation signal, instead of the auxiliary machine-stopping signal received from the second controller, to the first controller.02-24-2011

Atsushi Osada, Tochigi JP

Patent application numberDescriptionPublished
20090241316Method and Device For Installing Door Glass on Vehicle Door - A method of installing a door glass (10-01-2009
20110004340WORKING SYSTEM AND WORK-AUTOMATING METHOD - Provided is a work assembling system (01-06-2011
20110018291WORK ALIGNING SYSTEM AND METHOD OF MOVING WORK - A work aligning system capable of easily altering the kind of works to be aligned. The work aligning system (01-27-2011
20110022218WORK MEASURING METHOD, METHOD FOR ATTACHING SUSPENSION ASSEMBLY AND APPARATUS FOR ATTACHING SUSPENSION ASSEMBLY - Provided is a work measuring method by which a deviation quantity of a work measuring point from a reference position can be measured in a short time. A work surface is set as a reference point when the measuring point is positioned at the reference position, and a distance from a photographing device to a reference surface is set as a reference distance. A deviation quantity of the measurement point in a direction intersecting a photographing direction on the reference surface is measured by the photographing device, and a deviation quantity of the measuring point in the photographing direction is measured by a laser distance sensor. Then, based on the deviation quantity measured by the photographing device, the deviation quantity measured by the laser distance sensor, and the reference distance, a deviation quantity of the measuring point in a direction intersecting the photographing direction is calculated.01-27-2011
20110160905WORKPIECE MOUNTING SYSTEM, WORKPIECE MOUNTING METHOD, SUNROOF UNIT HOLDING DEVICE, AND SUNROOF UNIT HOLDING METHOD - A workpiece mounting system which is highly versatile and can reduce a cycle time. A workpiece mounting system (06-30-2011

Atsushi Osada, Kofu-Shi JP

Patent application numberDescriptionPublished
20090297303Thin Plate Container and Processing Apparatus for Thin Plate Container - Arbitrary pieces of semiconductor wafers are supported flexibly on either the upper side or the lower side. The present invention is a thin plate container for supporting plural semiconductor wafers for use in carriage, storage, processing, etc. It comprises processing trays plurally stacked in a state of each supporting at least one semiconductor wafer individually and a coupling mechanism for integrally coupling the processing trays in a state where the processing trays are plurally stacked and separating the processing trays at an arbitrary location. Each processing tray has a one-side support for supporting at least one semiconductor wafer on its one side and the other-side support mutually fitted to the one-side support of the other processing tray on the other side to form a housing space sealed off from the external environment for constraining and supporting the thin plate. Accordingly, as many processing trays as the number of the semiconductor wafers are stacked to constitute the thin plate container.12-03-2009

Atsushi Osada, Saitama JP

Patent application numberDescriptionPublished
20090199385Parts conveying/mounting method, and its device - Mounting operation is efficiently performed by automatically conveying parts and assisting only an operation to mount the parts to a mounted body. A parts conveying/mounting device 08-13-2009

Atsushi Osada, Yokohama-Shi JP

Patent application numberDescriptionPublished
20090089820OPTICAL DISC APPARATUS - According to one embodiment, an optical disc apparatus includes a main frame, a medium drive unit, and an ascent/descent retaining member which supports the medium drive unit for ascent and descent. The ascent/descent retaining member includes a pair of arm portions, a connecting portion, and pivotal portions supported on the sidewalls, individually. One of the front wall of the main frame and the connecting portion integrally has a guide boss projecting toward the other of them and a press projection which is elastically deformable in a direction in which the connecting portion extends. The other of the front wall and the connecting portion has a guide groove which extends in the ascent and descent direction and is engaged with the guide boss, and a guide rib having a guide surface for deforming the press projection to generate an elastic force and provided adjacent to the guide groove.04-02-2009