| Patent application number | Description | Published |
| 20080251719 | SCANNING ELECTRON MICROSCOPE AND METHOD FOR PROCESSING AN IMAGE OBTAINED BY THE SCANNING ELECTRON MICROSCOPE - In the case where a specimen is imaged by a scanning electron microscope, it is intended to acquire an image of a high quality having a noise component reduced, thereby to improve the precision of an image processing. The intensity distribution of a beam is calculated on the basis of an imaging condition or specimen information, and an image restoration is performed by using a resolving power deterioration factor other than the beam intensity distribution as a target of a deterioration mode, so that a high resolving power image can be acquired under various conditions. In the scanning electron microscope for semiconductor inspections and semiconductor measurements, the restored image is used for pattern size measurement, defect detections, defect classifications and so on, so that the measurements can be improved in precision and so that the defect detections and classifications can be made high precise. | 10-16-2008 |
| 20090208090 | METHOD AND APPARATUS FOR INSPECTING DEFECT OF PATTERN FORMED ON SEMICONDUCTOR DEVICE - In the inspection apparatus for a defect of a semiconductor and the method using it for automatically detecting the defect on a semiconductor wafer and presuming the defect occurrence factor using the circuit design data, a plurality of shapes are formed from the circuit design data by deforming the design data with respect to shape deformation items stipulated for respective defect occurrence factor for comparison with the inspection object circuit pattern. The defect is detected by comparison of the group of shapes formed and the actual pattern. Further, the occurrence factors of these defects are presumed, and the defects are classified according to respective factor. | 08-20-2009 |
| 20090212212 | Scanning Electron Microscope system and Method for Measuring Dimensions of Patterns Formed on Semiconductor Device By Using the System - The present invention is for providing a scanning electron microscope system adapted to output contour information fitting in with the real pattern edge end of a sample, and is arranged to generate a local projection waveform by projecting the scanning electron microscope image in the tangential direction with respect to the pattern edge at each point of the pattern edge of the scanning electron microscope image, estimate the cross-sectional shape of the pattern transferred on the sample by applying the local projection waveform generated at each point to a library, which has previously been created, correlating the cross-sectional shape with the electron beam signal waveform, obtain position coordinate of the edge end fitting in with the cross-sectional shape, and output the contour of the pattern as a range of position coordinates. | 08-27-2009 |
| 20090242760 | Method and Apparatus for Measuring Dimension of Circuit Patterm Formed on Substrate by Using Scanning Electron Microscope - In the dimension measurement of a circuit pattern using a scanning electron microscope (SEM), in order to make it possible to automatically image desired evaluation points (EPs) on a sample, and automatically measure the circuit pattern formed at the evaluation points, according to the present invention, in the dimension measurement of a circuit pattern using a scanning electron microscope (SEM), it is arranged that coordinate data of the EP and design data of the circuit pattern including the EP are used as an input, creation of a dimension measurement cursor for measuring the pattern existing in the EP and selection or setting of the dimension measurement method are automatically performed based on the EP coordinate data and the design data to automatically create a recipe, and automatic imaging/measurement is performed using the recipe. | 10-01-2009 |
| 20090266985 | Scanning Type Charged Particle Beam Microscope and an Image Processing Method Using the Same - Design data and sample characteristic information corresponding to individual areas on the design data are used to perform an image quality improvement operation to make appropriate improvements on image quality according to sample characteristic corresponding to the individual areas on the image, allowing a high speed area division on the image. Further, the use of a database that stores image information associated with the design data allows for an image quality improvement operation that automatically emphasizes portions of the image that greatly differ from past images of the similar design data. | 10-29-2009 |
| 20090268959 | METHOD AND APPARATUS FOR REVIEWING DEFECTS - Disclosed is a method for reviewing defects in a large number of samples within a short period of time through the use of a defect review apparatus. To collect defect images steadily and at high throughput, a defect detection method is selected before imaging and set up for each of review target defects in the samples in accordance with the external characteristics of the samples that are calculated from the design information about the samples. The defect images are collected after an imaging sequence is set up for the defect images and reference images in such a manner as to reduce the time required for stage movement in accordance with the defect coordinates of the samples and the selected defect detection method. | 10-29-2009 |
| 20100280378 | ULTRASONOGRAPHIC DEVICE AND METHOD FOR IMPROVING ULTRASONOGRAPHIC DEVICE IMAGE QUALITY - It is possible to improve an image quality of an ultrasonographic device and improve visibility of a tissue structure and a lesion. According to a noise amount estimated for each of at least two resolution levels and reliability of the noise amount estimation, a corrected noise amount is calculated. An intensity conversion is performed on a decomposition coefficient obtained by a multi-resolution decomposition process using the corrected noise amount. Moreover, by performing intensity conversion of the respective decomposition coefficients according to a plurality of decomposition coefficients, it is possible to generate a high-quality image. Furthermore, by switching processing parameters in accordance with the imaging condition, the image type, and the imaging object, it is possible to simultaneously realize the processing time and the image quality appropriate for the purpose. | 11-04-2010 |
| 20110074817 | COMPOSITE PICTURE FORMING METHOD AND PICTURE FORMING APPARATUS - A composite picture forming method and picture forming apparatus forms pattern attribute information contained in an overlapping domain for the overlapping domain between a plurality of pictures to select the pictures to be targeted for a composition in accordance with the pattern attribute information and combine the selected pictures, and the composition of the pictures is also performed in plural stages by using the pattern attribute information in the overlapping domain. | 03-31-2011 |
| 20110125030 | MEDICAL DIAGNOSTIC DEVICE AND METHOD OF IMPROVING IMAGE QUALITY OF MEDICAL DIAGNOSTIC DEVICE - A medical diagnostic device is characterized in that an image processing means ( | 05-26-2011 |
| 20110127429 | Method and Apparatus For Measuring Dimension Of Circuit Pattern Formed On Substrate By Using Scanning Electron Microscope - In the dimension measurement of a circuit pattern using a scanning electron microscope (SEM), in order to make it possible to automatically image desired evaluation points (EPs) on a sample, and automatically measure the circuit pattern formed at the evaluation points, according to the present invention, in the dimension measurement of a circuit pattern using a scanning electron microscope (SEM), it is arranged that coordinate data of the EP and design data of the circuit pattern including the EP are used as an input, creation of a dimension measurement cursor for measuring the pattern existing in the EP and selection or setting of the dimension measurement method are automatically performed based on the EP coordinate data and the design data to automatically create a recipe, and automatic imaging/measurement is performed using the recipe. | 06-02-2011 |