Patent application number | Description | Published |
20110240231 | STRIPPING METHOD AND STRIPPING SOLUTION - A method for stripping a wafer from a supporting plate to which the wafer is adhered via an adhesive agent, wherein the supporting plate has a through hole penetrating the supporting plate in a thickness direction thereof, the method including dissolving the adhesive agent with a stripping solution by contacting the stripping solution with the adhesive agent via the through hole. The adhesive agent has a hydrocarbon resin as a viscous component, and the stripping solution is a hydrocarbon-based solvent having a viscosity of 1.3 mPa·s or less and a dissolving rate of 30 nm/sec or greater to dissolve the adhesive agent. | 10-06-2011 |
20110306720 | ADHESIVE COMPOSITION - Disclosed is an adhesive composition in which a solid component is dissolved in a solvent, the solid component being dissolved in the solvent to have a solid component content of not less than 20% by weight with respect to a total amount of the solid component and the solvent, the solid component containing resin obtained by polymerizing a monomer composition that contains a cycloolefin monomer, the solvent having no carbon-carbon double bond, and an alcohol content contained in the solvent being not more than 0.45% by weight with respect to an entire amount of the solvent. | 12-15-2011 |
20120083561 | ADHESIVE COMPOSITION - An adhesive composition of this invention includes a hydrocarbon resin and a solvent for dissolving the hydrocarbon resin, the solvent containing a condensed polycyclic hydrocarbon. Thus, an adhesive composition having excellent product stability is provided. | 04-05-2012 |
20120118511 | LAMINATE AND METHOD FOR SEPARATING THE SAME - A laminate including a supporter which transmits infrared; a substrate supported by the supporter; an adhesive layer via which the supporter and the substrate are attached to each other; and a separation layer, positioned on a surface of the supporter to which surface the substrate is attached, and made of a compound having an infrared-absorbing structure. | 05-17-2012 |
20120217210 | SUPPORT METHOD, HIGH-TEMPERATURE TREATMENT METHOD USING SAME, AND SUPPORT JIG - A method for supporting a support to which a wafer is attached, by supporting the support against gravitational force by supporting three or more support points of an inner circumference section of a support surface of the support. The support surface of the support is opposite to a side on which the wafer is attached to the support. | 08-30-2012 |
20130081760 | ADHESIVE COMPOSITION, ADHESIVE FILM, AND METHOD FOR TREATING SUBSTRATE - An adhesive composition including a hydrocarbon resin, a modified elastomer that is bonded with at least one functional group-containing atom group, and a solvent. | 04-04-2013 |
20130213582 | LAMINATE AND METHOD FOR SEPARATING THE SAME - A laminate including a supporting member which is light transmissive; a supported substrate supported by the supporting member; an adhesive layer provided on a surface of the supported substrate which surface faces toward the supporting member; and a release layer which is made of an inorganic material and is provided between the supporting member and the supported substrate, the release layer having a property that changes when the release layer absorbs light coming through the supporting layer, and the release layer having a flat surface which faces the adhesive layer. | 08-22-2013 |
20130220554 | LAMINATE AND METHOD FOR SEPARATING THE SAME - A laminate including a supporting member which is light transmissive; a supported substrate supported by the supporting member; an adhesive layer provided on a surface of the supported substrate which surface faces toward the supporting member; and a release layer which is made of a fluorocarbon and is provided between the supporting member and the supported substrate, the release layer having a property that changes when it absorbs light coming through the supporting member. | 08-29-2013 |
20140044962 | ADHESIVE COMPOSITION, FILM ADHESIVE, AND BONDING METHOD - An adhesive composition including an elastomer as a main component, an adhesive layer prepared from the adhesive composition having (i) a storage modulus (G′) of not less than 20,000 Pa at 220° C. and/or (ii) a loss modulus (G″) of not less than 20,000 Pa at 220° C. | 02-13-2014 |
20140166209 | LAMINATE AND METHOD FOR SEPARATING THE SAME - A laminate including a supporter which transmits infrared; a substrate supported by the supporter; an adhesive layer via which the supporter and the substrate are attached to each other; and a separation layer positioned on a surface of the supporter to which surface the substrate is attached, and which is made of a compound having an infrared-absorbing structure. A target is tightly attached and supported in the laminate while securing easy separation of a supporter from the target. | 06-19-2014 |
20140255638 | ADHESIVE COMPOSITION FOR BONDING A WAFER AND SUPPORTING BODY FOR SAID WAFER, ADHESIVE FILM, AND LAMINATE - An adhesive composition for bonding a wafer and a support for the wafer. The adhesive composition contains an elastomer in which a styrene unit is contained as a constituent unit of a main chain, a content of the styrene unit is 14% by weight to 50% by weight, and a weight average molecular weight of the styrene unit is 10,000 to 200,000. | 09-11-2014 |
20140311680 | LAMINATED BODY AND METHOD FOR SEPARATING LAMINATED BODY - A laminate including a supporting member which is light transmissive; a supported substrate which is supported by the supporting member; an adhesive layer which is provided on a surface of the supported substrate on which surface the supported substrate is supported by the supporting member; and a release layer, which (i) is provided between the supporting member and the supported substrate and (ii) contains a polymer including, in a repeating unit, a structure having a light absorption property, a property of the polymer being changed when the polymer absorbs light irradiated via the supporting member. | 10-23-2014 |
20150059976 | ADHESIVE COMPOSITION, ADHESIVE FILM, AND BONDING METHOD - An adhesive composition including a block copolymer. An adhesive layer formed by using the adhesive composition has a Young's modulus of 0.1 GPa or greater at 23° C., a storage modulus (G′) of 1.5×10 | 03-05-2015 |