Inventors list

Assignees list

Classification tree browser

Top 100 Inventors

Top 100 Assignees


Atsushi Kikuchi

Atsushi Kikuchi, Kanagawa JP

Patent application numberDescriptionPublished
20090061132CONTAINER FORMED BY STRETCH FORMING AND PROCESS FOR PRODUCING THE SAME - A stretch-formed container having a layer comprising a blend of an ethylene terephthalate type polyester resin and another material, characterized in that the layer comprising the blend has a dispersion structure composed of a continuous phase comprising the ethylene terephthalate type polyester resin and a dispersed phase comprising the other material and that at least the container body part has a tan δ maximum temperature of 115° C. or lower in a dynamic viscoelasticity examination. Due to the constitution, even when the mechanical stretching rate reaches a limit, strain hardening effectively occurs. Thus, a stretch-formed container of a polyester resin can be provided which has both of excellent heat resistance attributable to high-temperature stretching and a stretch balance attributable to strain hardening.03-05-2009
20100092621MULTI-LAYER PLASTIC CONTAINER FOR NON-OILY CONTENTS - [Problem] To provide a polyethylene container which enables a non-oily viscous content such as ketchup or the like to favorably run down when the container is inverted.04-15-2010
20100116707PRESSURE-RESISTANT POLYESTER CONTAINER AND PROCESS FOR PRODUCING THE SAME - A pressure-resistant polyester container having a multilayer structure comprising inner and outer layers of a polyester resin and at least one intermediate layer of a functional resin, wherein in the container body portion, the inner layer of the polyester resin has a crystallinity of not less than 23%, the outer layer thereof has a crystallinity of not less than 18%, the average value of the crystallinity of the inner layer and the crystallinity of the outer layer is not less than 24%. The pressure-resistant polyester container effectively prevents whitening even after the passage of time and features excellent transparency despite of using, as an intermediate layer, a functional resin composition obtained by blending a functional resin with a clay. The invention, further, provides a process for producing the same.05-13-2010
20100129577MULTI-LAYER POLYESTER CONTAINER AND METHOD OF PRODUCING THE SAME - A multi-layer polyester container comprising inner and outer layers of a polyester resin and at least one intermediate layer of a functional resin or a functional resin composition, wherein a difference of tan δ of the inner polyester layer at 80° C. and 60° C. is 0.035 or less in the measurement of the dynamic viscoelasticity (DMS) thereof at 0.5 Hz. Even when the functional resin or the functional resin composition having a large draw stress is used as an intermediate layer, therefore, excellent transparency is obtained while effectively exhibiting the function such as barrier property possessed by the functional resin or the functional resin composition.05-27-2010
20100136271MULTILAYERED CONTAINER - Disclosed is a multilayered container having an intermediate layer comprising an oxygen-absorbable barrier resin composition showing excellent processability upon molding. Specifically disclosed is a multilayered container which comprises an inner layer and an outer layer each comprising an olefin resin and an intermediate layer provided between the inner layer and the outer layer and comprising an oxygen-absorbable barrier resin composition, wherein the oxygen-absorbable barrier resin composition has a cooling crystallization peak temperature lower than that of a base resin (an oxygen barrier resin) which constitutes the oxygen-absorbable barrier resin composition, the multilayered container is formed by a solid-phase forming process at a temperature lower by 1 to 15° C. than the cooling crystallization starting temperature (Tc2) of the base resin, and the body of the container shows a calorific value of less than 0.5 J/g by the isothermal crystallization after heating from 30° C. to 130° C. at a heating rate of 100° C./min in a thermal analysis of the body.06-03-2010
20100206762MULTILAYER POLYESTER CONTAINER AND PROCESS FOR PRODUCING THE SAME - A multilayer polyester container comprising inner and outer layers of a polyester resin and at least one intermediate layer of a polyamide resin, wherein in the container body portion, the intermediate layer of the polyamide resin has an exothermic peak starting temperature due to crystallization of not lower than 96° C. as measured by a differential scanning calorimetry, and a clay is dispersed in the polyamide resin, effectively preventing whitening of the intermediate layer even after the passage of time and featuring excellent transparency despite of using, as an intermediate layer, a polyamide resin composition obtained by blending the polyamide resin with the clay.08-19-2010
20100323140MULTILAYERED CONTAINER EXCELLENT IN OXYGEN-BARRIER PROPERTY - A multilayered container with excellent heat resistance which is obtained by melt molding and has an interlayer made of an oxygen-absorbing barrier resin composition. The multilayered container comprises inner and outer layers comprising an olefin resin and, sandwiched between the inner and outer layers, an interlayer made of an oxygen-absorbing barrier resin composition. The multilayered container is one formed by melt molding. In thermal analysis of a container barrel part, it has a quantity of heat of isothermal crystallization after heating from 30° C. to 130° C. at 100° C./min of 0.5 J/g or larger. In the analysis, the barrel part, after cooling from 200° C. to 130° C. at 100° C./min, gives an isothermal crystallization profile in which the time period to a peak top is shorter than that in a multilayered container including an interlayer consisting only of the base resin (oxygen-barrier resin) constituting the oxygen-absorbing barrier resin composition.12-23-2010

Patent applications by Atsushi Kikuchi, Kanagawa JP

Atsushi Kikuchi, Yamagata JP

Patent application numberDescriptionPublished
20100221912Method of Manufacturing a semiconductor device - A method of manufacturing a semiconductor device includes a process of removing, by dry etching, an insulating layer which is formed on the top surface of a Ni-containing silicide layer to thereby at least partially expose the Ni-containing silicide layer; and a process of cleaning the exposed portion of the Ni-containing silicide layer using reduced water having a reductive function.09-02-2010

Atsushi Kikuchi, Yokohama JP

Patent application numberDescriptionPublished
20090317577PREFORM, METHOD OF PRODUCING THE SAME, AND BIAXIALLY DRAWN CONTAINER MADE FROM THE PREFORM - A preform, a method of producing the preform, and a container obtained by draw-forming the preform. The preform has at least a layer of a polyester resin and is formed by the compression-forming, wherein the time is not shorter than 300 seconds before a calorific value of isothermal crystallization of the layer of the polyester resin at 210° C. reaches a maximum value. The preform is provided suppressing the thermal decomposition of the resin at the time of forming the preform, and effectively suppressing a drop in the inherent viscosity and the formation of the acetaldehyde. Further, a biaxially drawn container is provided having excellent mechanical strength and flavor-retaining property.12-24-2009

Patent applications by Atsushi Kikuchi, Yokohama JP

Atsushi Kikuchi, Kawasaki JP

Patent application numberDescriptionPublished
20080261336Semiconductor device and manufacturing method thereof - A method of manufacturing a semiconductor device using a wiring substrate is provided which can facilitate the handling of the wiring substrate. The method includes the steps of forming a peelable resin layer on a silicon substrate, forming the wiring substrate on the peelable resin layer, mounting semiconductor chips on the wiring substrate, forming semiconductor devices by sealing the plurality of semiconductor chips by a sealing resin, individualizing the semiconductor devices by dicing the semiconductor devices from the sealing resin side but leaving the silicon substrate, peeling each of the individualized semiconductor devices from the silicon substrate between the silicon substrate and the peelable resin layer, and exposing terminals on the wiring substrate by forming openings through the peelable resin layer or by removing the peelable resin layer.10-23-2008

Atsushi Kikuchi, Yokohama-Shi JP

Patent application numberDescriptionPublished
20110304069MULTI-LAYER STRUCTURE AND METHOD OF PRODUCING THE SAME - A multi-layer structure comprising a functional resin layer obtained by covering a core layer of a base body resin or a second functional resin with a shell layer of a first functional resin, and a base body resin layer containing the functional resin layer therein. The layers of the functional resins are formed at positions where they are allowed to exhibit their functions to a sufficient degree, a plurality of functions can be imparted, and a molten resin mass having the above multi-layer structure can be formed by the compression-forming.12-15-2011