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| 20110048775 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes a substrate having a first surface and a second surface on the opposite side of the first surface and multiple first penetrating holes, a first conductive portion formed on the first surface of the substrate and made of a first plated cover layer, a second conductive portion formed on the second surface of the substrate and made of a second plated cover layer, the second conductive portion being positioned opposite the first conductive portion, and multiple first through-hole conductors made of conductors formed in the multiple first penetrating holes, respectively, the multiple first through-hole conductors connecting the first conductive portion and the second conductive portion. The first conductive portion, the second conductive portion and the first through-hole conductors form a first through-hole connection section which sets up either a power-source through-hole conductor or a ground through-hole conductor. | 03-03-2011 |
| 20110209904 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a substrate having first and second surfaces and a first penetrating hole through the substrate, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, an interlayer insulation layer on the substrate and the first or second circuit, and a third conductive circuit on the interlayer layer. The interlayer layer has a via conductor in the interlayer layer and connecting the third circuit and the second conductor. The substrate has a first through-hole conductor connecting the first and second circuits and on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor in the second hole. The via conductor is shifted from the center of the second conductor in the direction parallel to the first surface of the substrate. | 09-01-2011 |
| 20110209905 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a substrate having a first penetrating hole penetrating through the substrate, a first through-hole conductor formed on the inner wall of the first penetrating hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor formed in the second penetrating hole, a first conductive circuit formed on a first surface of the substrate; a second conductive circuit formed on a second surface of the substrate; a first conductive portion formed on one end of the second penetrating hole, and a second conductive portion formed on the opposite end of the second penetrating hole. The first conductor is connecting the first and second circuits. The second conductor is connecting the first and second conductive portions. The first circuit has the thickness which is set greater than the thickness of the first conductive portion. | 09-01-2011 |
| 20110209911 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a substrate having first and second surfaces, a first penetrating hole penetrating through the substrate, a first through-hole conductor formed on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor formed in the second hole, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, a first conductive portion on one end of the second hole, and a second conductive portion on the opposite end of the second penetrating hole. The first conductor is connecting the first circuit and the second circuit. The second conductor is made of a conductive material filled in the second hole and is connecting the first conductive portion and the second conductive portion. | 09-01-2011 |
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| 20090103240 | CAPACITOR ARRAY AND METHOD FOR MANUFACTURING THE SAME - A capacitor array includes mutually opposed first and second internal electrodes having a first capacitance portion and a second capacitance portion, respectively, a first lead portion and a second lead portion, respectively, which are electrically connected to a first outer terminal electrode and a second outer terminal electrode, and a first protrusion portion and a second protrusion portion, respectively, which partially protrude toward the second outer terminal electrode and the first outer terminal electrode. The outer terminal electrodes have plating films directly connected to the internal electrodes. The plating film is formed by electrolytic plating. In the electrolytic plating, deposition of plating proceeds while being prevented from spreading in width directions of the individual side surfaces by electric fields generated from the protrusion portions toward the vicinities of exposure portions of the respective lead portions on the side surfaces. | 04-23-2009 |
| 20100271752 | LAMINATED CERAMIC ELECTRONIC COMPONENT - In a laminated ceramic electronic component including a ceramic element body including a plurality of effective sections, each of which constitutes a circuit element such as a laminated capacitor unit, bumps generated between the effective portions and a gap interposed between the effective portions can be made minimized. Specifically, the ceramic element body includes a first effective section including a first circuit element and a second effective section including a second circuit element. A gap is provided between the first and second effective section. Floating internal conductors are arranged in the gap at least in one of first and second external layer sections, the first external section being interposed between a first main surface and the first and second effective sections, and the second external layer section being interposed between a second main surface and the first and second effective sections. | 10-28-2010 |
| 20100271754 | ELECTRONIC COMPONENT - An electronic component includes a substantially rectangular parallelepiped electronic component body and first to fourth external electrodes. The first to fourth external electrodes are arranged such that a shaped defined by joining the centers of portions of the first to fourth external electrodes on a first main surface with a substantially straight line is substantially square. The first main surface is provided with a substantially linear orientation identifying mark disposed thereon. The orientation identifying mark passes through an intersection of two diagonals of the substantially square shape and extends along the longitudinal direction or the width direction. | 10-28-2010 |
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| 20100243305 | SUBSTRATE WITH METAL FILM AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a substrate with a metal film includes preparing an insulative substrate having the first surface and the second surface on the opposite side of the first surface, forming in the insulative substrate a penetrating hole having the inner wall tapering from the first surface of the insulative substrate toward the second surface, forming a layer of a composition containing a polymerization initiator and a polymerizable compound on the inner wall of the penetrating hole, irradiating the layer of the composition with energy such that a polymer is formed on the inner wall of the penetrating hole, applying a plating catalyst on the polymer, and forming a plated-metal film on the inner wall of the penetrating hole. | 09-30-2010 |
| 20100243311 | SUBSTRATE WITH METAL FILM AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a substrate with a metal film includes preparing a first insulation layer having first and second surfaces, forming a first conductive circuit on the first surface of the first insulation layer, forming on the first surface of the first insulation layer and on the first conductive circuit a second insulation layer having first and second surfaces, forming in the second insulation layer a penetrating hole tapering from the first surface toward the first conductive circuit, forming on the inner wall of the penetrating hole, a composition containing a polymerization initiator and a polymerizable compound, providing a polymer on the inner wall of the penetrating hole by irradiating the composition, applying a plating catalyst on the polymer, and forming a plated-metal film on the inner wall of the penetrating hole. The first surface of the first insulation layer faces the second surface of the second insulation layer. | 09-30-2010 |
