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Atsushi Denda, Chino JP

Atsushi Denda, Chino JP

Patent application numberDescriptionPublished
20100117241SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME - A semiconductor device includes: a plurality of semiconductor substrates each having a pad-formed surface and being mutually laminated; a connection electrode pad formed on the pad-formed surface; a wire connecting the connection electrode pads of the plurality of semiconductor substrates so as to electrically connect the semiconductor substrates; a relay electrode pad that is provided on the pad-formed surface of a lower one of the laminated semiconductor substrates so as to be exposed by an upper one of the laminated semiconductor substrates, and that is connected to the connection electrode pad by a relay wire included in the wire; and a mounting electrode pad that is formed on a mounting surface on which the laminated semiconductor substrates are mounted, and that is connected to the relay electrode pad of the lower semiconductor substrate by the wire. In the device, the wire electrically connects the connection electrode pad of the upper semiconductor substrate to the relay electrode pad of the lower semiconductor substrate.05-13-2010
20100171718METHOD FOR MANUFACTURING TOUCH PANEL, TOUCH PANEL, DISPLAY DEVICE, AND ELECTRONIC APPARATUS - A method for manufacturing a touch panel including a substrate, a first electrode, and a second electrode, the first and second electrodes being formed on one side of the substrate in a plural numbers and extending in directions intersecting with each other, the method includes forming the first electrode and electrode films on the substrate, forming an insulating film by a printing method on at least an intersection of the first electrode with the second electrode, and forming a bridge wiring line connecting the electrode films over the insulating film by the printing method. In the method, each of the electrode films has a shape obtained by cutting off the second electrode at the intersection.07-08-2010
20100300514SOLAR CELL AND METHOD FOR MANUFACTURING SOLAR CELL - A solar cell includes a substrate, a lower electrode layer, a semiconductor layer and an upper electrode layer. The lower electrode layer is formed on the substrate with the lower electrode layer having a first lower electrode layer and a second lower electrode layer. The first lower electrode layer includes a material having a lower electrical resistivity than the second lower electrode layer. The semiconductor layer is formed on the lower electrode layer. The upper electrode layer is formed on the semiconductor layer.12-02-2010
20100300526SOLAR CELL AND METHOD FOR MANUFACTURING SOLAR CELL - A solar cell includes a substrate, a first electrode layer formed on the substrate, a semiconductor layer formed on the first electrode layer, a second electrode layer formed on the semiconductor layer, and a conductive contact layer formed in a groove portion extending from the first electrode layer to the second electrode layer in a portion of the semiconductor layer.12-02-2010
20110011437SOLAR CELL AND METHOD FOR MANUFACTURING SOLAR CELL - A solar cell includes a plurality of unit cells connected in series and a first partition portion. Each of the unit cells includes a substrate, a first electrode layer formed on the substrate, a semiconductor layer formed on the first electrode layer, and a second electrode layer formed on the semiconductor layer. The first partition portion has insulation properties and partitions the first electrode layers of the unit cells on the substrate with each the first electrode layers being disposed respectively in a region partitioned by the first partition portion.01-20-2011
20110011458SOLAR CELL AND METHOD FOR MANUFACTURING SOLAR CELL - A method is for manufacturing a solar cell having a plurality of unit cells connected in series, each of the unit cells including a substrate, a first electrode layer formed on the substrate, a semiconductor layer formed on the first electrode layer, and a second electrode layer formed on the semiconductor layer. The method includes forming a fluid-repellent partition portion on the substrate to partition a plurality of regions respectively corresponding to the first electrode layers of the unit cells, and applying a liquid material including a first electrode material for forming the first electrode layers on the regions of the substrate that are partitioned by the partition portion, and baking the applied liquid material to form the first electrode layers.01-20-2011
20110065230METHOD FOR MANUFACTURING SOLAR CELL - A method for manufacturing a solar cell including a substrate, a first electrode layer, a semiconductor layer, and a second electrode layer, includes forming a first sacrificial layer on a portion of a surface of the substrate; forming the first electrode layer on the substrate and on the first sacrificial layer; and dividing the first electrode layer by removing the first sacrificial layer and a portion of the first electrode layer formed on the first sacrificial layer.03-17-2011
20110212823CERAMIC SHAPED BODY AND WIRING BOARD - A ceramic shaped body for producing a wiring board includes a ceramic material, a binder, and a polyalcohol, the polyalcohol being present in at least a near-surface region of the ceramic shaped body.09-01-2011

Patent applications by Atsushi Denda, Chino JP